Data Sheet
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Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531 and 520/521∆ Supporting Hyper-Threading Technology1 Datasheet On 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ May 2005 Document Number: 302351-004
Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531 and 520/521∆ Supporting Hyper-Threading Technology1 Datasheet On 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ May 2005 Document Number: 302351-004
Data Sheet
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...8710; Intel processor numbers are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the 775-land package on the absence or characteristics of performance. Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are not a measure of any time, without an Intel EM64T-enabled... including details on whether your system vendor for conflicts or incompatibilities arising from published specifications. The Intel® Pentium® 4 processor in the United States and other countries. *Other names and brands may cause the product to...
...8710; Intel processor numbers are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the 775-land package on the absence or characteristics of performance. Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst and the Intel logo are not a measure of any time, without an Intel EM64T-enabled... including details on whether your system vendor for conflicts or incompatibilities arising from published specifications. The Intel® Pentium® 4 processor in the United States and other countries. *Other names and brands may cause the product to...
Data Sheet
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...2.2 Power and Ground Lands 15 2.3 Decoupling Guidelines...15 2.3.1 VCC Decoupling ...16 2.3.2 FSB GTL+ Decoupling 16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking 16 2.4 Voltage Identification ...17 2.4.1 Phase Lock Loop (PLL) Power and Filter 19 2.5 Reserved, Unused, FC and TESTHI Signals 20 2.6...Test Access Port (TAP) Connection 23 2.9 FSB Frequency Select Signals (BSEL[2:0 23 2.10 Absolute Maximum and Minimum Ratings 24 2.11 Processor DC Specifications 24 2.12 VCC Overshoot Specification 33 2.12.1 Die Voltage Validation 33 2.13 GTL+ FSB Specifications...34 3 Package Mechanical...
...2.2 Power and Ground Lands 15 2.3 Decoupling Guidelines...15 2.3.1 VCC Decoupling ...16 2.3.2 FSB GTL+ Decoupling 16 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking 16 2.4 Voltage Identification ...17 2.4.1 Phase Lock Loop (PLL) Power and Filter 19 2.5 Reserved, Unused, FC and TESTHI Signals 20 2.6...Test Access Port (TAP) Connection 23 2.9 FSB Frequency Select Signals (BSEL[2:0 23 2.10 Absolute Maximum and Minimum Ratings 24 2.11 Processor DC Specifications 24 2.12 VCC Overshoot Specification 33 2.12.1 Die Voltage Validation 33 2.13 GTL+ FSB Specifications...34 3 Package Mechanical...
Data Sheet
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... 86 6.2.3 Stop-Grant State...87 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State 88 7 Boxed Processor Specifications ...89 7.1 Mechanical Specifications 90 7.1.1 Boxed Processor Cooling Solution Dimensions 90 7.1.2 Boxed Processor Fan Heatsink Weight 91 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly 91 7.2 Electrical Requirements...91 7.2.1 Fan Heatsink Power Supply 91 7.3 Thermal...
... 86 6.2.3 Stop-Grant State...87 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State 88 7 Boxed Processor Specifications ...89 7.1 Mechanical Specifications 90 7.1.1 Boxed Processor Cooling Solution Dimensions 90 7.1.2 Boxed Processor Fan Heatsink Weight 91 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly 91 7.2 Electrical Requirements...91 7.2.1 Fan Heatsink Power Supply 91 7.3 Thermal...
Data Sheet
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... Example Waveform 33 3-1 Processor Package Assembly Sketch 35 3-2 Processor Package Drawing 1 36 3-3 Processor Package Drawing 2 37 3-4 Processor Package Drawing 3 38 3-5 Processor Top-Side Marking Example 40 3-6 Processor Top-Side Marking Example for the Boxed Processor (Overall View 91 7-5 Boxed Processor Fan Heatsink Power Cable Connector Description 92 7-6 Baseboard Power Header Placement Relative to Processor Socket 93 7-7 Boxed Processor Fan Heatsink Airspace...
... Example Waveform 33 3-1 Processor Package Assembly Sketch 35 3-2 Processor Package Drawing 1 36 3-3 Processor Package Drawing 2 37 3-4 Processor Package Drawing 3 38 3-5 Processor Top-Side Marking Example 40 3-6 Processor Top-Side Marking Example for the Boxed Processor (Overall View 91 7-5 Boxed Processor Fan Heatsink Power Cable Connector Description 92 7-6 Baseboard Power Header Placement Relative to Processor Socket 93 7-7 Boxed Processor Fan Heatsink Airspace...
Data Sheet
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... Absolute Maximum Ratings 24 2-8 Voltage and Current Specifications 25 2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors 27 2-10 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors 29 2-11 GTL+ Asynchronous Signal Group DC Specifications 31 2-12 GTL+ Signal Group DC Specifications 31 2-13 PWRGOOD and TAP Signal Group DC Specifications 32...
... Absolute Maximum Ratings 24 2-8 Voltage and Current Specifications 25 2-9 VCC Static and Transient Tolerance for 775_VR_CONFIG_04A Processors 27 2-10 VCC Static and Transient Tolerance for 775_VR_CONFIG_04B Processors 29 2-11 GTL+ Asynchronous Signal Group DC Specifications 31 2-12 GTL+ Signal Group DC Specifications 31 2-13 PWRGOOD and TAP Signal Group DC Specifications 32...
Data Sheet
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... Bit capability • Added Icc Enhanced Auto Halt specifications • Added support for Thermal Monitor 2 • Added specifications for processor number 570 with PRB = 1 • Added specifications for processor numbers 571, 561, 551, 541, 531, and 521. • Modified Table 2-3, "FSB Signal Groups". • Added Note 5 to Table 2-18. • Updated Figure 3-5 Top...
... Bit capability • Added Icc Enhanced Auto Halt specifications • Added support for Thermal Monitor 2 • Added specifications for processor number 570 with PRB = 1 • Added specifications for processor numbers 571, 561, 551, 541, 531, and 521. • Modified Table 2-3, "FSB Signal Groups". • Added Note 5 to Table 2-18. • Updated Figure 3-5 Top...
Data Sheet
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... (HT Technology) for all frequencies with 800 MHz front side bus (FSB) • Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521 support Intel® Extended Memory 64 Technology (EM64T)Φ • Supports Execute Disable Bit capability •...associativity provides improved cache hit rate on load/store operations • 775-land Package The Intel® Pentium® 4 processor family supporting Hyper-Threading Technology1 (HT Technology) delivers Intel's advanced, powerful processors for 32-bit applications running on advanced 32-bit operating systems ...
... (HT Technology) for all frequencies with 800 MHz front side bus (FSB) • Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521 support Intel® Extended Memory 64 Technology (EM64T)Φ • Supports Execute Disable Bit capability •...associativity provides improved cache hit rate on load/store operations • 775-land Package The Intel® Pentium® 4 processor family supporting Hyper-Threading Technology1 (HT Technology) delivers Intel's advanced, powerful processors for 32-bit applications running on advanced 32-bit operating systems ...
Data Sheet
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...Intel recommends enabling Hyper-Threading Technology with the Pentium 4 processor in the 775-land package and SSE3 become available in AGP 4X). TTehcehInnotelolgPyen(EtiMum644Tp)Φrocaessasnoren5h7a1n, c5e6m1,e5n4t 1to, 531, and 521 Intel's IA-32 support Intel® Extended Memory 64 architecture. Further details on to the Pentium 4 processor in the Intel...increased system responsiveness in the 775-land package uses FlipChip Land Grid Array (FC-LGA4) package technology, and plugs into a 775LGA socket. The Pentium 4 processor on the same Intel 32-bit microarchitecture and ...
...Intel recommends enabling Hyper-Threading Technology with the Pentium 4 processor in the 775-land package and SSE3 become available in AGP 4X). TTehcehInnotelolgPyen(EtiMum644Tp)Φrocaessasnoren5h7a1n, c5e6m1,e5n4t 1to, 531, and 521 Intel's IA-32 support Intel® Extended Memory 64 architecture. Further details on to the Pentium 4 processor in the Intel...increased system responsiveness in the 775-land package uses FlipChip Land Grid Array (FC-LGA4) package technology, and plugs into a 775LGA socket. The Pentium 4 processor on the same Intel 32-bit microarchitecture and ...
Data Sheet
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... detailed information. See the Intel® Architecture Software Developer's Manual for the processor including heatsink, heatsink retention mechanism, and socket. In the case of signals where the name does not imply an active state but describes part of the processor package used terms are explained here for the Pentium 4 processor in the 775-land package. • Keep...
... detailed information. See the Intel® Architecture Software Developer's Manual for the processor including heatsink, heatsink retention mechanism, and socket. In the case of signals where the name does not imply an active state but describes part of the processor package used terms are explained here for the Pentium 4 processor in the 775-land package. • Keep...
Data Sheet
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...processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are satisfied. 1.2 References Material and concepts available in the 775-Land Package Thermal Design Guidelines http://developer.intel.com/ design/Pentium4/guides/ 302553.htm Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket Intel... Document Document Numbers/ Location Intel® Pentium® 4 Processor on 90 nm Process Specification Update http://developer.intel.com/ design/Pentium4/ specupdt/302352.htm Intel® Pentium® 4 Processor on 90 nm Process in...
...processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are satisfied. 1.2 References Material and concepts available in the 775-Land Package Thermal Design Guidelines http://developer.intel.com/ design/Pentium4/guides/ 302553.htm Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket Intel... Document Document Numbers/ Location Intel® Pentium® 4 Processor on 90 nm Process Specification Update http://developer.intel.com/ design/Pentium4/ specupdt/302352.htm Intel® Pentium® 4 Processor on 90 nm Process in...
Data Sheet
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...processor interfaces and signals. Intel chipsets will also provide on flight time as opposed to VCC. Analog signal simulation of transistors and high internal clock speeds, the processor... (VRD) 10.1 Design Guide For Desktop LGA775 Socket. Decoupling Guidelines Due to its large number of...terminated on -chip power distribution, the Pentium 4 processor in timing violations or reduced lifetime of...processor silicon and are based on -die termination, thus eliminating the need to a system ground plane. Termination resistors are provided. Some GTL+ signals do so can result in the 775...
...processor interfaces and signals. Intel chipsets will also provide on flight time as opposed to VCC. Analog signal simulation of transistors and high internal clock speeds, the processor... (VRD) 10.1 Design Guide For Desktop LGA775 Socket. Decoupling Guidelines Due to its large number of...terminated on -chip power distribution, the Pentium 4 processor in timing violations or reduced lifetime of...processor silicon and are based on -die termination, thus eliminating the need to a system ground plane. Termination resistors are provided. Some GTL+ signals do so can result in the 775...
Data Sheet
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... current swings when the part is a multiple of the processor. The Pentium 4 processor in the 775-land package clocking, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. 2.3.2 FSB GTL+ Decoupling The Pentium 4 processor in the 775-land package core frequency is powering on the processor package. Bulk decoupling for proper GTL+ bus operation...
... current swings when the part is a multiple of the processor. The Pentium 4 processor in the 775-land package clocking, refer to the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket. 2.3.2 FSB GTL+ Decoupling The Pentium 4 processor in the 775-land package core frequency is powering on the processor package. Bulk decoupling for proper GTL+ bus operation...
Data Sheet
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... appropriate chipset GTLREF level. Datasheet 17 See the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for more details. VTT_SEL = 1 for the Pentium 4 processor in the 775-land package. GTLREF_SEL = 0 for the Pentium 4 processor in the 775-land package. The specifications have been set by the platform to have different VID settings. If the...
... appropriate chipset GTLREF level. Datasheet 17 See the Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket for more details. VTT_SEL = 1 for the Pentium 4 processor in the 775-land package. GTLREF_SEL = 0 for the Pentium 4 processor in the 775-land package. The specifications have been set by the platform to have different VID settings. If the...
Data Sheet
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... Forbidden Zone -34 dB Forbidden Zone DC 1 Hz Passband fpeak 1 MHz 66 MHz fcore High Frequency Band Filter_Spec NOTES: 1. No specification exists for the Pentium 4 processor in the 775-land package. Electrical Specifications 2.4.1 Phase Lock Loop (PLL) Power and Filter VCCA and VCCIOPLL are power sources required by the PLL clock generators for...
... Forbidden Zone -34 dB Forbidden Zone DC 1 Hz Passband fpeak 1 MHz 66 MHz fcore High Frequency Band Filter_Spec NOTES: 1. No specification exists for the Pentium 4 processor in the 775-land package. Electrical Specifications 2.4.1 Phase Lock Loop (PLL) Power and Filter VCCA and VCCIOPLL are power sources required by the PLL clock generators for...
Data Sheet
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...a system level design, on-die termination has been included on the processor silicon. Unused outputs can result in the 775-land package to allow for more details. Inputs and used for a land listing of the processor and the location of these signals to VCC, VSS, VTT, or... For example, if the trace impedance is 60 Ω, then a value between 48 Ω and 72 Ω is provided on the Pentium 4 processor in component malfunction or incompatibility with other TESTHI signals • TESTHI11 - cannot be left unconnected, however this may interfere with other TESTHI signals ...
...a system level design, on-die termination has been included on the processor silicon. Unused outputs can result in the 775-land package to allow for more details. Inputs and used for a land listing of the processor and the location of these signals to VCC, VSS, VTT, or... For example, if the trace impedance is 60 Ω, then a value between 48 Ω and 72 Ω is provided on the Pentium 4 processor in component malfunction or incompatibility with other TESTHI signals • TESTHI11 - cannot be left unconnected, however this may interfere with other TESTHI signals ...
Data Sheet
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...not actively driven high (during the active-to-inactive edge of the GTL+ Asynchronous signals are used to 1 transition) by the processor. The value of these signals are no RTT A20M#, BCLK[1:0], BPM[5:0]#, BR0#, BSEL[2:0], COMP[1:0], FERR#/PBE#, IERR#, IGNNE#, ...TMS BSEL[2:0], VID[5:0], THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#, BR0#, TDO, VTT_SEL, LL_ID[1:0], MSID[1:0] NOTES: 1. Refer to Section 4.2 for the processor to be asserted/de-asserted for at least six BCLKs for signal descriptions. 2. Signal Characteristics Signals with RTT A[35:3]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BINIT...
...not actively driven high (during the active-to-inactive edge of the GTL+ Asynchronous signals are used to 1 transition) by the processor. The value of these signals are no RTT A20M#, BCLK[1:0], BPM[5:0]#, BR0#, BSEL[2:0], COMP[1:0], FERR#/PBE#, IERR#, IGNNE#, ...TMS BSEL[2:0], VID[5:0], THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#, BR0#, TDO, VTT_SEL, LL_ID[1:0], MSID[1:0] NOTES: 1. Refer to Section 4.2 for the processor to be asserted/de-asserted for at least six BCLKs for signal descriptions. 2. Signal Characteristics Signals with RTT A[35:3]#, ADS#, ADSTB[1:0]#, AP[1:0]#, BINIT...
Data Sheet
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The Pentium 4 processor in the 775-land package currently operates at a 533 MHz or 800 MHz FSB frequency (selected by the processor, chipset, and clock synthesizer. Similar considerations must operate at their specified FSB frequency. BSEL[2:0] Frequency Table for TCK, TMS, TRST#, TDI, and TDO....BSEL[2:0]) The BSEL[2:0] signals are used to connect to the rest of the chain unless one of the other components is recommended that the Pentium 4 processor in the 775-land package be first in the TAP chain and followed by any other components in the Test Access Port (TAP) logic, it is...
The Pentium 4 processor in the 775-land package currently operates at a 533 MHz or 800 MHz FSB frequency (selected by the processor, chipset, and clock synthesizer. Similar considerations must operate at their specified FSB frequency. BSEL[2:0] Frequency Table for TCK, TMS, TRST#, TDI, and TDO....BSEL[2:0]) The BSEL[2:0] signals are used to connect to the rest of the chain unless one of the other components is recommended that the Pentium 4 processor in the 775-land package be first in the TAP chain and followed by any other components in the Test Access Port (TAP) logic, it is...
Data Sheet
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... frequency, and input voltages. Electrical Specifications 2.10 Absolute Maximum and Minimum Ratings Table 2-7 specifies absolute maximum and minimum ratings. Table 2-7. TSTORAGE Processor storage temperature -40 +85 °C 3, 4 NOTES: 1. For functional operation, all notes associated with respect to VSS -0.3 1.55 V... signal assignments. Storage temperature is a Platform Requirement Bit (PRB) that indicates that the processor has specific platform requirements. 24 Datasheet See Chapter 4 for the Pentium 4 processor in the 775-land package and are in Table 2-12.
... frequency, and input voltages. Electrical Specifications 2.10 Absolute Maximum and Minimum Ratings Table 2-7 specifies absolute maximum and minimum ratings. Table 2-7. TSTORAGE Processor storage temperature -40 +85 °C 3, 4 NOTES: 1. For functional operation, all notes associated with respect to VSS -0.3 1.55 V... signal assignments. Storage temperature is a Platform Requirement Bit (PRB) that indicates that the processor has specific platform requirements. 24 Datasheet See Chapter 4 for the Pentium 4 processor in the 775-land package and are in Table 2-12.
Data Sheet
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... (Sheet 1 of 2) Symbol VID range VCC VCC ICC Parameter VID Processor Number Core Frequency 570/571 560/561 550 VCC for 775_VR_CONFIG_04B processors 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 550/551 540/541 530/531 520/521 VCC for 775_VR_CONFIG_04A processors 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 ...GHz (PRB = 0) 2.80 GHz (PRB = 0) 570/571 560/561 550 550/551 540/541 530/531 520/521 ICC for processor with multiple VID 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 ...
... (Sheet 1 of 2) Symbol VID range VCC VCC ICC Parameter VID Processor Number Core Frequency 570/571 560/561 550 VCC for 775_VR_CONFIG_04B processors 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 550/551 540/541 530/531 520/521 VCC for 775_VR_CONFIG_04A processors 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 ...GHz (PRB = 0) 2.80 GHz (PRB = 0) 570/571 560/561 550 550/551 540/541 530/531 520/521 ICC for processor with multiple VID 3.80 GHZ (PRB = 1) 3.60 GHz (PRB = 1) 3.40 GHz (PRB = 1) 3.40 GHz (PRB = 0) 3.20 GHz (PRB = 0) 3 GHz (PRB = 0) 2.80 ...