Design Guide
Page 2
...INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. The Quad-Core Intel® Xeon® Processor... by visiting Intel's website at any features or instructions marked "reserved" or "undefined." All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series ...
...INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. The Quad-Core Intel® Xeon® Processor... by visiting Intel's website at any features or instructions marked "reserved" or "undefined." All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series ...
Design Guide
Page 10
...your Intel field sales representative for the latest revision and order number of this document. 1.4 Definition of heatsink thermal performance using total package power. System designers should always be expressed as a dimension away from the processors Digital Thermal Sensor. The Quad-Core Intel® Xeon® Processor 5300 ... Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to ensure their systems are compatible with the processor at the geometric center of the...
...your Intel field sales representative for the latest revision and order number of this document. 1.4 Definition of heatsink thermal performance using total package power. System designers should always be expressed as a dimension away from the processors Digital Thermal Sensor. The Quad-Core Intel® Xeon® Processor 5300 ... Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to ensure their systems are compatible with the processor at the geometric center of the...
Design Guide
Page 41
...to extend air-cooling capability through the use of the new thermal solutions is large enough to require consideration Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 41 Refer to Appendix B for a baseboard thickness range of...] thick board. Contact your Intel field sales representative for an electronic version of mechanical and thermal models of the baseboard provides the necessary compressive load for the Quad-Core Intel® Xeon® Processor 5300 Series was verified according to the Intel validation criteria given in .] large...
...to extend air-cooling capability through the use of the new thermal solutions is large enough to require consideration Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 41 Refer to Appendix B for a baseboard thickness range of...] thick board. Contact your Intel field sales representative for an electronic version of mechanical and thermal models of the baseboard provides the necessary compressive load for the Quad-Core Intel® Xeon® Processor 5300 Series was verified according to the Intel validation criteria given in .] large...