Design Guide
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... to them. Designers must not rely on the absence or characteristics of others. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Current characterized errata are not intended for conflicts or incompatibilities arising... from published specifications. Contact your local Intel sales office or your product order. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors...
... to them. Designers must not rely on the absence or characteristics of others. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Current characterized errata are not intended for conflicts or incompatibilities arising... from published specifications. Contact your local Intel sales office or your product order. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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... Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
... Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
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... 1.1 Objective The purpose of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG...
... 1.1 Objective The purpose of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG...
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...DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to ensure...Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor...
...DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to ensure...Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor...
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... the TCC to reduce the die temperature by reading the IA_32_TEMPERATURE_TARGET MSR. This is a temperature specification based on the processor that defines case temperature specification of the heat from the TCC activation temperature value specified in a component specification. TCONTROL ...solution that the processor can be obtained by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is equal to a system chassis. A processor unique value for use in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series ...
... the TCC to reduce the die temperature by reading the IA_32_TEMPERATURE_TARGET MSR. This is a temperature specification based on the processor that defines case temperature specification of the heat from the TCC activation temperature value specified in a component specification. TCONTROL ...solution that the processor can be obtained by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is equal to a system chassis. A processor unique value for use in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series ...
Design Guide
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... to the package IHS. 6. In the case of 1066 MHz or 1333 MHz. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Appendix B. 2. Shear load that can...
... to the package IHS. 6. In the case of 1066 MHz or 1333 MHz. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Appendix B. 2. Shear load that can...
Design Guide
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A description of the socket can be found in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The heatsink mass can be found in the LGA771 Socket Mechanical Design Guide. Amplification factors due to the package during shock must... package to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for QuadCore Intel® Xeon® Processor 5300 Series. The processor package and socket have mechanical load limits that are specified in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design ...
A description of the socket can be found in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The heatsink mass can be found in the LGA771 Socket Mechanical Design Guide. Amplification factors due to the package during shock must... package to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for QuadCore Intel® Xeon® Processor 5300 Series. The processor package and socket have mechanical load limits that are specified in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design ...
Design Guide
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... optimal operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for protecting LGA771 socket solder joints as well as preventing package pullout from the socket. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is implemented, in which it...
... optimal operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for protecting LGA771 socket solder joints as well as preventing package pullout from the socket. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is implemented, in which it...
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...multiplier) and input voltage (via the VID signals). This temperature delta accounts for further details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal ...dissipate. Please refer to determine those applications that the processor can not be used to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can not be ...
...multiplier) and input voltage (via the VID signals). This temperature delta accounts for further details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal ...dissipate. Please refer to determine those applications that the processor can not be used to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can not be ...
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... a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Monitor can protect the processors in processor frequency and performance. Platform Environmental Control Interface (PECI) The PECI interface is a proprietary single...
... a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Monitor can protect the processors in processor frequency and performance. Platform Environmental Control Interface (PECI) The PECI interface is a proprietary single...
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... DTS output temperatures within each LAG771 socket for information on the die. Figure 2-5 provides an illustration of domains to a PECI domain. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 Domain 1 Core_1 Core_2 Core_3 Core_4 DTS_1 DTS_2 DTS_3 DTS_4 Domain 0 Domain 1 Core_1 Core_2 Core_3 Core_4 DTS_1...
... DTS output temperatures within each LAG771 socket for information on the die. Figure 2-5 provides an illustration of domains to a PECI domain. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 Domain 1 Core_1 Core_2 Core_3 Core_4 DTS_1 DTS_2 DTS_3 DTS_4 Domain 0 Domain 1 Core_1 Core_2 Core_3 Core_4 DTS_1...
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... PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. For more information on a processor. Dimensions originate from the vertical edge of input and output conditions for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of...
... PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. For more information on a processor. Dimensions originate from the vertical edge of input and output conditions for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of...
Design Guide
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... Thermal Profile is constant between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
... Thermal Profile is constant between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
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...P_PROFILE_MIN power levels. Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is a static and a unique value. As explained above, the case-to the... values of the line and the processor local ambient temperature represents the y-axis intercept. The equation for each processor during manufacturing that solution can be plotted against the Thermal Profile specification. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines ...
...P_PROFILE_MIN power levels. Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is a static and a unique value. As explained above, the case-to the... values of the line and the processor local ambient temperature represents the y-axis intercept. The equation for each processor during manufacturing that solution can be plotted against the Thermal Profile specification. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines ...
Design Guide
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..., an equivalent TCASE temperature must be determined to DTS = TCONTROL. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to P_PROFILE_MIN. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in support of the TCONTROL value in Figure...
..., an equivalent TCASE temperature must be determined to DTS = TCONTROL. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to P_PROFILE_MIN. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in support of the TCONTROL value in Figure...
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... Thermal Profile B Thermal Profile A TCASE P P _PROFILE_MIN_B _PROFILE_MIN_A Power TDP The Thermal Profile A is expected that no measurable performance loss due to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. A worst case real world application is typically between 1 and 2%. In other words, designing to Thermal Profile B does not impose any...
... Thermal Profile B Thermal Profile A TCASE P P _PROFILE_MIN_B _PROFILE_MIN_A Power TDP The Thermal Profile A is expected that no measurable performance loss due to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. A worst case real world application is typically between 1 and 2%. In other words, designing to Thermal Profile B does not impose any...