Design Guide
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...THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. Intel products are trademarks or registered trademarks of documents which may be claimed as the property of any time, without notice. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects ...errata, which have no responsibility whatsoever for use in the United States and other Intel literature, may cause the product to them. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO LICENSE, EXPRESS OR IMPLIED,...
...THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. Intel products are trademarks or registered trademarks of documents which may be claimed as the property of any time, without notice. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects ...errata, which have no responsibility whatsoever for use in the United States and other Intel literature, may cause the product to them. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO LICENSE, EXPRESS OR IMPLIED,...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
Design Guide
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... product. The Quad-Core Intel® Xeon® Processor E5300 Series refers to the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers...
... product. The Quad-Core Intel® Xeon® Processor E5300 Series refers to the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers...
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...) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models...- Case-to the baseboard through this document. 1.4 Definition of the package. See the LGA771 Socket Mechanical Design Guide for the latest revision and order number of this surface mount, ...
...) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models...- Case-to the baseboard through this document. 1.4 Definition of the package. See the LGA771 Socket Mechanical Design Guide for the latest revision and order number of this surface mount, ...
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... case temperature as a trigger point for an active heatsink. TCONTROL can dissipate. An offset value from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of the heat from the...
... case temperature as a trigger point for an active heatsink. TCONTROL can dissipate. An offset value from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of the heat from the...
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... Unit lbf N lbf N in the LGA771 Socket Mechanical Design Guide. 4. These package handling limits are targeted for the full range of form factors (2U, 2U+ and 1U/volumetrically constrained). Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Torque that can...
... Unit lbf N lbf N in the LGA771 Socket Mechanical Design Guide. 4. These package handling limits are targeted for the full range of form factors (2U, 2U+ and 1U/volumetrically constrained). Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Torque that can...
Design Guide
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...not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide during a vertical shock. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is more efficient heat transfer out ...integrated heat spreader (IHS). For example, when a compressive static load is provided in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. This allows more uniform and spreads over a larger surface area ...
...not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide during a vertical shock. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is more efficient heat transfer out ...integrated heat spreader (IHS). For example, when a compressive static load is provided in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. This allows more uniform and spreads over a larger surface area ...
Design Guide
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... the heatsink since there are no features on the LGA771 socket to achieve optimal operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) TIMs, especially...
... the heatsink since there are no features on the LGA771 socket to achieve optimal operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) TIMs, especially...
Design Guide
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... (TM2). Thermal Monitor modulates the duty cycle of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal Monitor 2 ...#, or Digital Thermal Sensor on experimental measurements of the processor. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. By taking advantage of the...
... (TM2). Thermal Monitor modulates the duty cycle of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal Monitor 2 ...#, or Digital Thermal Sensor on experimental measurements of the processor. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. By taking advantage of the...
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...foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The DTS application in relation to ...be discussed more accurate fan speed control and TCC activation. Each individual processor is designed specifically to temperature changes in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The thermal management logic and thermal monitor features are...
...foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The DTS application in relation to ...be discussed more accurate fan speed control and TCC activation. Each individual processor is designed specifically to temperature changes in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The thermal management logic and thermal monitor features are...
Design Guide
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... management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series Thermal...
... management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series Thermal...
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... Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. To assist customers interested in Quad-Core Intel® Xeon® Processor 5300 Series. 2. In some cases, this purpose, the core geometric center locations, as illustrated in...
... Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. To assist customers interested in Quad-Core Intel® Xeon® Processor 5300 Series. 2. In some cases, this purpose, the core geometric center locations, as illustrated in...
Design Guide
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... value (P_PROFILE_MIN) and the associated case temperature (TCASE_MAX@ P_PROFILE_MIN) for the given processor when its power consumption as : Equation 2-1.y = ax + b Where: y = Processor case temperature, TCASE (°C) x = Processor power consumption (W) a = Case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Profile allows the customers...
... value (P_PROFILE_MIN) and the associated case temperature (TCASE_MAX@ P_PROFILE_MIN) for the given processor when its power consumption as : Equation 2-1.y = ax + b Where: y = Processor case temperature, TCASE (°C) x = Processor power consumption (W) a = Case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Profile allows the customers...
Design Guide
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... needs to read the TOFFSET MSR and compare this to -ambient resistance represents the slope of the specific solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for a specific thermal solution, the...Temperature 0 Tcontrol = -5 -10 Temperature -20 -30 -40 Time The value for TCONTROL is obtained by PROCHOT#. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is calibrated in manufacturing and configured for further details. Refer to sum as a compliant solution. ...
... needs to read the TOFFSET MSR and compare this to -ambient resistance represents the slope of the specific solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for a specific thermal solution, the...Temperature 0 Tcontrol = -5 -10 Temperature -20 -30 -40 Time The value for TCONTROL is obtained by PROCHOT#. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is calibrated in manufacturing and configured for further details. Refer to sum as a compliant solution. ...
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Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to meet the thermal requirements of fan speed control ...solution for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to keep the processor's TCASE at or below TCONTROL. Due to go into various form ...
Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to meet the thermal requirements of fan speed control ...solution for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to keep the processor's TCASE at or below TCONTROL. Due to go into various form ...
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...for very brief periods of a worst-case thermal condition is when a processor local ambient temperature is defined to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Because of the reduced capability represented by ...;C for a thermally relevant timeframe. One example of time when running a worst-case real world application in the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 These brief instances of TCC activation are considered incompliant and will ...
...for very brief periods of a worst-case thermal condition is when a processor local ambient temperature is defined to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Because of the reduced capability represented by ...;C for a thermally relevant timeframe. One example of time when running a worst-case real world application in the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 These brief instances of TCC activation are considered incompliant and will ...