Design Guide
Page 10
...always be expressed as a dimension away from the processors Digital Thermal Sensor. The Quad-Core Intel® Xeon® Processor 5300 Series interface to the baseboard through this document. 1.4 Definition of 2) Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ... Thermal Sensor replaces the Tdiode in previous processors. Flexible Motherboard Guideline: an estimate of the maximum value of this surface mount, 771 Land socket. Component thermal solutions interface with future processor releases. See the LGA771 Socket Mechanical Design Guide for the latest ...
...always be expressed as a dimension away from the processors Digital Thermal Sensor. The Quad-Core Intel® Xeon® Processor 5300 Series interface to the baseboard through this document. 1.4 Definition of 2) Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ... Thermal Sensor replaces the Tdiode in previous processors. Flexible Motherboard Guideline: an estimate of the maximum value of this surface mount, 771 Land socket. Component thermal solutions interface with future processor releases. See the LGA771 Socket Mechanical Design Guide for the latest ...
Design Guide
Page 53
...is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will include the following items: • Quad-Core Intel® Xeon® Processor 5300 Series • Unattached heatsink solution • 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the constant +.... The board must be set by other system components. The boxed processor contains the components necessary to properly follow the thermal profile. This control method requires the motherboard provide the correct PWM duty cycle to the active fan heatsink solution to...
...is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will include the following items: • Quad-Core Intel® Xeon® Processor 5300 Series • Unattached heatsink solution • 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the constant +.... The board must be set by other system components. The boxed processor contains the components necessary to properly follow the thermal profile. This control method requires the motherboard provide the correct PWM duty cycle to the active fan heatsink solution to...
Design Guide
Page 85
...base. Figure C-3 shows an example using the Quad-Core Intel® Xeon® Processor 5300 Series CEK Reference Heatsink designed for the LGA771 socket. • Quantify preload degradation under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using load cells...fastener assembly on the processor and motherboard. Updates will need to improve metrology. The load cells should also be subtracted from the heatsink base. The depth of the pocket depends on the whole assembly stiffness (i.e. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/...
...base. Figure C-3 shows an example using the Quad-Core Intel® Xeon® Processor 5300 Series CEK Reference Heatsink designed for the LGA771 socket. • Quantify preload degradation under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using load cells...fastener assembly on the processor and motherboard. Updates will need to improve metrology. The load cells should also be subtracted from the heatsink base. The depth of the pocket depends on the whole assembly stiffness (i.e. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/...
Design Guide
Page 88
...compensation package (spliced into pounds. 3. An automated model will need to be included, as needed prior to mounting the motherboard on an appropriate support fixture that the load cell has been calibrated against known loads. IMPORTANT: In addition to just ..., following sections give two examples of load measurement. However, this is also placed in Figure C-3, and actuate attach mechanism. 88 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example: If the attach mechanism includes fixtures on the board as the goal of...
...compensation package (spliced into pounds. 3. An automated model will need to be included, as needed prior to mounting the motherboard on an appropriate support fixture that the load cell has been calibrated against known loads. IMPORTANT: In addition to just ..., following sections give two examples of load measurement. However, this is also placed in Figure C-3, and actuate attach mechanism. 88 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example: If the attach mechanism includes fixtures on the board as the goal of...