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... cause the product to the public, i.e., announced, launched or shipped. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number: 323107-002US Intel products are not intended to them. They are not commercial names for... as the property of any time, without notice. Copyright © 2010, Intel Corporation. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 socket may make changes to obtain the latest specifications...
... cause the product to the public, i.e., announced, launched or shipped. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number: 323107-002US Intel products are not intended to them. They are not commercial names for... as the property of any time, without notice. Copyright © 2010, Intel Corporation. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 socket may make changes to obtain the latest specifications...
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... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
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... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
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... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
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... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
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Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
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... thermal mechanical designers. • To assist designers and suppliers of thermal and mechanical solutions for processors in this document are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 8 Introduction 1 Introduction This document...
... thermal mechanical designers. • To assist designers and suppliers of thermal and mechanical solutions for processors in this document are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 8 Introduction 1 Introduction This document...
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... 9 August 2010 Order Number: 323107-002US Reference Documents Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay Specification Document# Notes 3 323103 1 323317 1 321326...
... 9 August 2010 Order Number: 323107-002US Reference Documents Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay Specification Document# Notes 3 323103 1 323317 1 321326...
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... TCC activation used to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 A power reduction feature designed to dissipate this target power level.... The measured ambient temperature locally surrounding the processor. This material fills the air gaps and voids, and enhances the ...
... TCC activation used to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 A power reduction feature designed to dissipate this target power level.... The measured ambient temperature locally surrounding the processor. This material fills the air gaps and voids, and enhances the ...
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...: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure 2-1. Processor Package Assembly Sketch IHS Die Substrate System Board TIM Capacitors LGA1366 Socket Note: 1. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 11...
...: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure 2-1. Processor Package Assembly Sketch IHS Die Substrate System Board TIM Capacitors LGA1366 Socket Note: 1. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 11...
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All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107-002US Package Mechanical Specifications 2.1.1 Package Mechanical Drawing The package ... 6. These dimensions include: 1. Package reference with tolerances (total height, length, width, etc.) 2. Land dimensions 4. The drawings include dimensions necessary to design a thermal solution for the processor.
All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107-002US Package Mechanical Specifications 2.1.1 Package Mechanical Drawing The package ... 6. These dimensions include: 1. Package reference with tolerances (total height, length, width, etc.) 2. Land dimensions 4. The drawings include dimensions necessary to design a thermal solution for the processor.
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... IHS SEALANT 0.08 0.203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. R P.O. Processor Package Drawing (Sheet 1 of 2) BOX 58119 SANTA CLARA, CA 95052-8119 EMTS DRAWING SIZE DRAWING NUMBER A1 D76126 REV A 7 SCALE: 2:1 DO NOT SCALE DRAWING SHEET...ANGLE PROJECTION APPROVED BY MATERIAL DATE DATE DATE DATE FINISH DEPARTMENT TITLE 2200 MISSION COLLEGE BLVD. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7...
... IHS SEALANT 0.08 0.203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. R P.O. Processor Package Drawing (Sheet 1 of 2) BOX 58119 SANTA CLARA, CA 95052-8119 EMTS DRAWING SIZE DRAWING NUMBER A1 D76126 REV A 7 SCALE: 2:1 DO NOT SCALE DRAWING SHEET...ANGLE PROJECTION APPROVED BY MATERIAL DATE DATE DATE DATE FINISH DEPARTMENT TITLE 2200 MISSION COLLEGE BLVD. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7...
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August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. NO D76126 SHT. 2 REV 7 H H V2 C E T1 G F E 1 3 5 7 9 11 13 15 ...R1.09 R1.09 0.2 11.7 0.2 11.7 COMMENTS ------- 1.06 MAX D COMPONENT HEIGHT C B DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. Processor Package Drawing (Sheet 2 of 2) H G F 4X SURFACE TEST PAD AREA E D M C B J A 2X 39 2X 36.5 14.4 BA AY AW...
August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. NO D76126 SHT. 2 REV 7 H H V2 C E T1 G F E 1 3 5 7 9 11 13 15 ...R1.09 R1.09 0.2 11.7 0.2 11.7 COMMENTS ------- 1.06 MAX D COMPONENT HEIGHT C B DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. Processor Package Drawing (Sheet 2 of 2) H G F 4X SURFACE TEST PAD AREA E D M C B J A 2X 39 2X 36.5 14.4 BA AY AW...
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... not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during heatsink removal. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 Table 2-1. Dynamic loading is the maximum static force that define component keep -in...
... not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during heatsink removal. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 Table 2-1. Dynamic loading is the maximum static force that define component keep -in...
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... XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US Package Mechanical...
... XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US Package Mechanical...
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Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5. Package Mechanical Specifications 2.1.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Figure 2-5 shows the bottom view of the processor land coordinates.
Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5. Package Mechanical Specifications 2.1.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Figure 2-5 shows the bottom view of the processor land coordinates.
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...about a cavity in the center of the socket with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 Socket loading specifications are listed in the Picket Post platform. The socket ...21 x 17 grid depopulation in the center of the array and selective depopulation elsewhere. LGA1366 Socket with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in Section 5. The socket provides I/O, power and ground contacts.
...about a cavity in the center of the socket with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 Socket loading specifications are listed in the Picket Post platform. The socket ...21 x 17 grid depopulation in the center of the array and selective depopulation elsewhere. LGA1366 Socket with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in Section 5. The socket provides I/O, power and ground contacts.
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LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
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Figure 3-3. Select PCB suppliers are equivalent. LGA1366 Socket Land Pattern (Top View of the Intel® Xeon® 5500 Platform Design Guide (PDG). LGA1366 Socket 3.1 Board Layout The land pattern for the LGA1366 socket. In general, metal defined (MD) pads perform ...AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 There is explained in a reduced drill keepout as compared to previous platforms. Drill...
Figure 3-3. Select PCB suppliers are equivalent. LGA1366 Socket Land Pattern (Top View of the Intel® Xeon® 5500 Platform Design Guide (PDG). LGA1366 Socket 3.1 Board Layout The land pattern for the LGA1366 socket. In general, metal defined (MD) pads perform ...AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 There is explained in a reduced drill keepout as compared to previous platforms. Drill...
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... 3-4, the Independent Loading Mechanism (ILM) is attached to the motherboard by 1366 solder balls. The socket coefficient of withstanding 260°C for detailed drawings. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US LGA1366 Socket 3.2 Attachment to Motherboard The socket...
... 3-4, the Independent Loading Mechanism (ILM) is attached to the motherboard by 1366 solder balls. The socket coefficient of withstanding 260°C for detailed drawings. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US LGA1366 Socket 3.2 Attachment to Motherboard The socket...