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... PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number: 323107-002US Intel reserves these for use by Intel to identify products, technologies, or services in medical, life saving, or life sustaining applications...
... PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number: 323107-002US Intel reserves these for use by Intel to identify products, technologies, or services in medical, life saving, or life sustaining applications...
Design Guide
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... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
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... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
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... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
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... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
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Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
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... Picket Post platform. Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for processors in this document are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet. Other processor specifications are : • To assist board and system thermal mechanical designers. • To assist designers and suppliers of...
... Picket Post platform. Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for processors in this document are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet. Other processor specifications are : • To assist board and system thermal mechanical designers. • To assist designers and suppliers of...
Design Guide
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...characterization parameter. The current monitor input to -ambient thermal characterization parameter. Defined as (TS - Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107... Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics...
...characterization parameter. The current monitor input to -ambient thermal characterization parameter. Defined as (TS - Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107... Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics...
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... U Description Thermal Control Circuit: Thermal monitor uses the TCC to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 The system ambient air temperature external to dissipate this target power level. This...
... U Description Thermal Control Circuit: Thermal monitor uses the TCC to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 The system ambient air temperature external to dissipate this target power level. This...
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... 2.1 Package Mechanical Specifications The processor is attached to the package substrate and core and serves as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are not part of a processor mounted on a substrate land-carrier. See Section 3 and Section 4. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and...
... 2.1 Package Mechanical Specifications The processor is attached to the package substrate and core and serves as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are not part of a processor mounted on a substrate land-carrier. See Section 3 and Section 4. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and...
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... parallelism and tilt 3. Reference datums 6. The drawings include dimensions necessary to design a thermal solution for the processor. Top-side and back-side component keep-out dimensions 5. All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107...
... parallelism and tilt 3. Reference datums 6. The drawings include dimensions necessary to design a thermal solution for the processor. Top-side and back-side component keep-out dimensions 5. All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107...
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... SECTION A-A C PACKAGE SUBSTRATE IHS SEALANT 0.08 0.203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. Processor Package Drawing (Sheet 1 of 2) NO D76126 SHT. 1 REV 7 H G1 C SEE DETAIL H1 SEE DETAIL B J2 BA AY AW AV AU AT AR AP AN AM... BY THIRD ANGLE PROJECTION APPROVED BY MATERIAL DATE DATE DATE DATE FINISH DEPARTMENT TITLE 2200 MISSION COLLEGE BLVD. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7 6 THIS...
... SECTION A-A C PACKAGE SUBSTRATE IHS SEALANT 0.08 0.203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. Processor Package Drawing (Sheet 1 of 2) NO D76126 SHT. 1 REV 7 H G1 C SEE DETAIL H1 SEE DETAIL B J2 BA AY AW AV AU AT AR AP AN AM... BY THIRD ANGLE PROJECTION APPROVED BY MATERIAL DATE DATE DATE DATE FINISH DEPARTMENT TITLE 2200 MISSION COLLEGE BLVD. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7 6 THIS...
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... 0.2 11.7 COMMENTS ------- 1.06 MAX D COMPONENT HEIGHT C B DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. Processor Package Drawing (Sheet 2 of 2) BOX 58119 A1 D76126 7 SANTA CLARA, CA 95052-8119 SCALE: 2:1 DO NOT SCALE DRAWING SHEET 2... MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. H G F 4X SURFACE...
... 0.2 11.7 COMMENTS ------- 1.06 MAX D COMPONENT HEIGHT C B DEPARTMENT SIZE DRAWING NUMBER REV A R 2200 MISSION COLLEGE BLVD. P.O. Processor Package Drawing (Sheet 2 of 2) BOX 58119 A1 D76126 7 SANTA CLARA, CA 95052-8119 SCALE: 2:1 DO NOT SCALE DRAWING SHEET 2... MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. H G F 4X SURFACE...
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... compressive + dynamic load] Notes 1, 2, 3 1, 3, 4 Notes: 1. Dynamic loading is the maximum static force that define component keep -out zones. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 These maximum limits should not be experienced during heatsink removal. These specifications apply...
... compressive + dynamic load] Notes 1, 2, 3 1, 3, 4 Notes: 1. Dynamic loading is the maximum static force that define component keep -out zones. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 These maximum limits should not be experienced during heatsink removal. These specifications apply...
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... XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US Figure 2-4. Table...
... XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US Figure 2-4. Table...
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Figure 2-5. Package Mechanical Specifications 2.1.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5 shows the bottom view of the processor land coordinates.
Figure 2-5. Package Mechanical Specifications 2.1.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5 shows the bottom view of the processor land coordinates.
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...Y) in a 43 x 41 grid array with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 Socket loading specifications are listed in the center of the array and... Picket Post platform. The socket must be compatible with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in the center of the socket with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is ...
...Y) in a 43 x 41 grid array with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 Socket loading specifications are listed in the center of the array and... Picket Post platform. The socket must be compatible with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in the center of the socket with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is ...
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LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
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...basis do not exist for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is explained in section 3.2.1 of the Intel® Xeon® 5500 Platform Design Guide (PDG). There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) ... AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 LGA1366 Socket Land Pattern (Top View of producing 40 mil spacing. Figure 3-3.
...basis do not exist for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is explained in section 3.2.1 of the Intel® Xeon® 5500 Platform Design Guide (PDG). There is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) ... AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 LGA1366 Socket Land Pattern (Top View of producing 40 mil spacing. Figure 3-3.
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The co-planarity (profile) and true position requirements are no additional external methods (i.e. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US Figure 3-4. The socket has the following solder ball ...
The co-planarity (profile) and true position requirements are no additional external methods (i.e. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US Figure 3-4. The socket has the following solder ball ...