Design Guide
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... UP ATCA 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal...
... UP ATCA 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal...
Design Guide
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...TEST PAD AREA E D M C B J A 2X 39 2X 36.5 14.4 BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V 7.2 U T R P N M L K J H G F E D C B A 0.23 C H E M N N H E R2 D DETAIL SCALE 15:1 R1 G K H 0.23 C H G J K E DETAIL SCALE 15:1 8 7 6 5 4 3 2 D SEE DETAIL DWG. August 2010 Order Number: 323107-002US Intel® Xeon® Processor... C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION ...
...TEST PAD AREA E D M C B J A 2X 39 2X 36.5 14.4 BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V 7.2 U T R P N M L K J H G F E D C B A 0.23 C H E M N N H E R2 D DETAIL SCALE 15:1 R1 G K H 0.23 C H G J K E DETAIL SCALE 15:1 8 7 6 5 4 3 2 D SEE DETAIL DWG. August 2010 Order Number: 323107-002US Intel® Xeon® Processor... C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION ...
Design Guide
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... Section 5. These maximum limits should not be exceeded during test may change due to a fixed substrate. Decoupling capacitors are based on the substrate that can be inserted into the required keep -out zones. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
... Section 5. These maximum limits should not be exceeded during test may change due to a fixed substrate. Decoupling capacitors are based on the substrate that can be inserted into the required keep -out zones. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
Design Guide
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... product functionality. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 24 The processor signals at NCTF locations are molded or laser marked on... the socket: • LGA1366: Font type is given in Appendix B to function (NCTF) when evaluating package solder joints post environmental testing. LGA1366 Socket NCTF Solder Joints Intel...
... product functionality. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 24 The processor signals at NCTF locations are molded or laser marked on... the socket: • LGA1366: Font type is given in Appendix B to function (NCTF) when evaluating package solder joints post environmental testing. LGA1366 Socket NCTF Solder Joints Intel...
Design Guide
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... are ILM cover assembly and back plate. When closed on the processor package. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 26 Intel performs detailed studies on the solder joints. ILM Cover Assembly Design ...loads onto the IHS at the "dimpled" features shown in Figure 4-1. The exact assembly location is closed on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for the load lever and load plate. These studies directly impact ...
... are ILM cover assembly and back plate. When closed on the processor package. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 26 Intel performs detailed studies on the solder joints. ILM Cover Assembly Design ...loads onto the IHS at the "dimpled" features shown in Figure 4-1. The exact assembly location is closed on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for the load lever and load plate. These studies directly impact ...
Design Guide
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... steel back plate with threaded studs for ILM attach, and internally threaded nuts for the back plate to test points and backside capacitors. Back plates for backside voltage regulator components. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 27 August 2010 Order Number: 323107-002US The threaded...
... steel back plate with threaded studs for ILM attach, and internally threaded nuts for the back plate to test points and backside capacitors. Back plates for backside voltage regulator components. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 27 August 2010 Order Number: 323107-002US The threaded...
Design Guide
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... static force that can have flexibility in component failure. The maximum limits should not be exceeded during test may result in specific values, but the ultimate product of 550gm [1.21 lb] with 50 g ...6 10.2 N [2.3 lbf] 38.3 N [8.6 lbf] in the vertical direction. 10.2 N [2.3 lbf] in this dynamic load. 5.4.1 Board Deflection Guidance See Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide (TMDG), Revision 2.1 for thermal solutions. LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 5.4 Loading Specifications The socket...
... static force that can have flexibility in component failure. The maximum limits should not be exceeded during test may result in specific values, but the ultimate product of 550gm [1.21 lb] with 50 g ...6 10.2 N [2.3 lbf] 38.3 N [8.6 lbf] in the vertical direction. 10.2 N [2.3 lbf] in this dynamic load. 5.4.1 Board Deflection Guidance See Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide (TMDG), Revision 2.1 for thermal solutions. LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 5.4 Loading Specifications The socket...
Design Guide
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All specifications are measured from the socket-seating plane of the processor to the component side of adjacent contacts where indicated. Electrical Requirements for a single socket contact, but includes effects of the socket PCB to which it is attached. Table 5-4. LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 5.5 Electrical Requirements LGA1366 socket electrical requirements are maximum values (unless otherwise stated) for LGA1366 Socket Parameter Mated loop inductance, loop Value
All specifications are measured from the socket-seating plane of the processor to the component side of adjacent contacts where indicated. Electrical Requirements for a single socket contact, but includes effects of the socket PCB to which it is attached. Table 5-4. LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 5.5 Electrical Requirements LGA1366 socket electrical requirements are maximum values (unless otherwise stated) for LGA1366 Socket Parameter Mated loop inductance, loop Value
Design Guide
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The test sequence for these products. Figure 5-2. Flow Chart of Knowledge-Based Reliability Evaluation Methodology Establish the market/expected use environment for the technology Develop Speculative stress ... new sockets will be developed using the knowledge-based reliability evaluation methodology, which is at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 35 The reliability targets in Figure 5-2. LGA1366...
The test sequence for these products. Figure 5-2. Flow Chart of Knowledge-Based Reliability Evaluation Methodology Establish the market/expected use environment for the technology Develop Speculative stress ... new sockets will be developed using the knowledge-based reliability evaluation methodology, which is at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 35 The reliability targets in Figure 5-2. LGA1366...
Design Guide
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... values are many ways to maintain DTS ≤ TCONTROL (low acoustic region). Thermal Solutions 7.5.3 Power Thermal Utility The Intel® Xeon® processor C5500/C3500 series Power Thermal Utility allows power and thermal testing of the processor. See the appropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for the Thermal Design Power (TDP) as specified in...
... values are many ways to maintain DTS ≤ TCONTROL (low acoustic region). Thermal Solutions 7.5.3 Power Thermal Utility The Intel® Xeon® processor C5500/C3500 series Power Thermal Utility allows power and thermal testing of the processor. See the appropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for the Thermal Design Power (TDP) as specified in...
Design Guide
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... 30W 35W 23W TDP TCONTROL Guidance -18 Comment Intel® Xeon® processor EC5549 -16 Intel® Xeon® processor EC5509 -10 Intel® Xeon® processor EC3539 -20 Intel® Xeon® processor LC5528 -14 Intel® Xeon® processor EC5539 -24 Intel® Xeon® processor LC5518 -8 Intel® Celeron® processor P1053 -26 Intel® Xeon® processor LC3528 -26 Intel® Xeon® processor LC3518 7.6.2 7.6.3 PECI Averaging and Catastrophic Thermal Management By...
... 30W 35W 23W TDP TCONTROL Guidance -18 Comment Intel® Xeon® processor EC5549 -16 Intel® Xeon® processor EC5509 -10 Intel® Xeon® processor EC3539 -20 Intel® Xeon® processor LC5528 -14 Intel® Xeon® processor EC5539 -24 Intel® Xeon® processor LC5518 -8 Intel® Celeron® processor P1053 -26 Intel® Xeon® processor LC3528 -26 Intel® Xeon® processor LC3518 7.6.2 7.6.3 PECI Averaging and Catastrophic Thermal Management By...
Design Guide
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...retention and keep-out definitions. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 63 August 2010 Order Number: 323107-002US With Intel® TBT enabled, the processor may result above TCONTROL, as... temperature is not typically the limiter for details regarding IMON accuracy. Absolute Processor Temperature Intel does not test...
...retention and keep-out definitions. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 63 August 2010 Order Number: 323107-002US With Intel® TBT enabled, the processor may result above TCONTROL, as... temperature is not typically the limiter for details regarding IMON accuracy. Absolute Processor Temperature Intel does not test...
Design Guide
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... be then followed by varying boundary conditions. Intel reference components are also used in board functional tests to assess performance for a limited range of restitution. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 67 August 2010 Order Number: 323107-002US Quality and Reliability Requirements Table 8-2. While component validation...
... be then followed by varying boundary conditions. Intel reference components are also used in board functional tests to assess performance for a limited range of restitution. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 67 August 2010 Order Number: 323107-002US Quality and Reliability Requirements Table 8-2. While component validation...
Design Guide
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.... • All enabling components, including socket and thermal solution parts. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 68 Recommended BIOS/Processor/Memory Test Procedures This test ensures proper operation of the product before and after environmental stresses, with respect to the retention...
.... • All enabling components, including socket and thermal solution parts. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 68 Recommended BIOS/Processor/Memory Test Procedures This test ensures proper operation of the product before and after environmental stresses, with respect to the retention...