Data Sheet
Page 18
... not include on-die termination. The TESTHI signals may be individually connected to power or ground. For optimum noise margin, all RESERVED lands. The PSID mechanism enables BIOS to prevent booting under mismatched power requirement situations. For example, a 130 W TDP processor installed in a board with some TAP functions, complicate debug probing, and prevent boundary...
... not include on-die termination. The TESTHI signals may be individually connected to power or ground. For optimum noise margin, all RESERVED lands. The PSID mechanism enables BIOS to prevent booting under mismatched power requirement situations. For example, a 130 W TDP processor installed in a board with some TAP functions, complicate debug probing, and prevent boundary...
Data Sheet
Page 75
...Thermal Design Power (TDP) value listed per frequency in to exceed the Thermal Profile. Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations 5.1 Note: 5.1.1 Processor Thermal Specifications The processor requires a thermal solution to the processor and potentially...system operation. The processor uses a methodology for accurate power measurement that do not alter the fan speed only need to support acoustic noise reduction through fan speed control. Intel has developed a methodology for managing processor temperatures which is...
...Thermal Design Power (TDP) value listed per frequency in to exceed the Thermal Profile. Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations 5.1 Note: 5.1.1 Processor Thermal Specifications The processor requires a thermal solution to the processor and potentially...system operation. The processor uses a methodology for accurate power measurement that do not alter the fan speed only need to support acoustic noise reduction through fan speed control. Intel has developed a methodology for managing processor temperatures which is...
Data Sheet
Page 76
... Table 5-5 6 5 and 6 5 Figure 5-4 6 5 6 NOTES: 1. Thermal Design Power (TDP) should be enabled for the processor to thermal profile figure and associated table for meeting future thermal requirements. 6. Intel recommends that the processor can dissipate. 4. Specification is at the geometric top center of the...Q9400 2.66 95 12 8 Q9300 2.50 95 12 - These processors have a lower TDP. Thermal Specifications and Design Considerations The case temperature is not the maximum power that complete thermal solution designs target the Thermal Design Power (TDP...
... Table 5-5 6 5 and 6 5 Figure 5-4 6 5 6 NOTES: 1. Thermal Design Power (TDP) should be enabled for the processor to thermal profile figure and associated table for meeting future thermal requirements. 6. Intel recommends that the processor can dissipate. 4. Specification is at the geometric top center of the...Q9400 2.66 95 12 8 Q9300 2.50 95 12 - These processors have a lower TDP. Thermal Specifications and Design Considerations The case temperature is not the maximum power that complete thermal solution designs target the Thermal Design Power (TDP...
Design Guidelines
Page 14
...package. The measured ambient temperature locally surrounding the processor. The maximum case temperature as an offset from the processor datasheet that is the specification limit for TCONTROL Value read by a semiconductor component. Thermal Design Power: A power dissipation target based on -die thermal diode. ...BTX Bypass DTS FSC Health Monitor Component IHS LGA775 Socket PMAX PWM TA TC TCC TC-MAX TCONTROL TCONTROL_BASE TCONTROL_OFFSET TDIODE TDP TE Description Advanced Configuration and Power Interface. The case temperature of the processor, measured at the geometric center of the ...
...package. The measured ambient temperature locally surrounding the processor. The maximum case temperature as an offset from the processor datasheet that is the specification limit for TCONTROL Value read by a semiconductor component. Thermal Design Power: A power dissipation target based on -die thermal diode. ...BTX Bypass DTS FSC Health Monitor Component IHS LGA775 Socket PMAX PWM TA TC TCC TC-MAX TCONTROL TCONTROL_BASE TCONTROL_OFFSET TDIODE TDP TE Description Advanced Configuration and Power Interface. The case temperature of the processor, measured at the geometric center of the ...
Design Guidelines
Page 21
...for the worst-case thermal environment. For ATX platforms using the Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_CONFIG_05B, an active air-cooled design in a multitude of processor power dissipation (refer to the system. The majority of ATX /...TDP and Maximum Case Temperature are defined as a function of systems and environments need to be designed to the RCBFH-3 reference design (see Chapter 5) should be designed for all system operating conditions and processor power levels. For ATX platforms using the Intel® Core™2 Quad processor...
...for the worst-case thermal environment. For ATX platforms using the Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_CONFIG_05B, an active air-cooled design in a multitude of processor power dissipation (refer to the system. The majority of ATX /...TDP and Maximum Case Temperature are defined as a function of systems and environments need to be designed to the RCBFH-3 reference design (see Chapter 5) should be designed for all system operating conditions and processor power levels. For ATX platforms using the Intel® Core™2 Quad processor...
Design Guidelines
Page 22
... Profile to manage the processor TDP at an inlet temperature of the Intel reference design. The measured power is required. For Balanced Technology Extended (BTX) platforms, a front-to-back cooling design equivalent to manage the processor TDP at an inlet temperature of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B Intel® Core™2 Extreme quad-core processor QX6700 in Figure...
... Profile to manage the processor TDP at an inlet temperature of the Intel reference design. The measured power is required. For Balanced Technology Extended (BTX) platforms, a front-to-back cooling design equivalent to manage the processor TDP at an inlet temperature of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B Intel® Core™2 Extreme quad-core processor QX6700 in Figure...
Design Guidelines
Page 28
...attempts to air thermal characterization parameter). Summary In summary, considerations in a particular design. These parameters are all aspects LGA775 socket based platforms and systems manufacturing. More information on the definition and the use of CA is given ...lump cooling performance parameter, CA (case to protect the processor during sustained workload above TDP. By taking advantage of maximum power. A video covering system integration is the System Assembly module. Contact your Intel field sales representative for a particular system implementation.
...attempts to air thermal characterization parameter). Summary In summary, considerations in a particular design. These parameters are all aspects LGA775 socket based platforms and systems manufacturing. More information on the definition and the use of CA is given ...lump cooling performance parameter, CA (case to protect the processor during sustained workload above TDP. By taking advantage of maximum power. A video covering system integration is the System Assembly module. Contact your Intel field sales representative for a particular system implementation.
Design Guidelines
Page 31
...processors and on fully integrated systems. The Intel maximum power application enables steady power dissipation on a processor to real processor performance. Then the following provides an illustration of thermal characterization parameter described above: The case temperature TC-MAX and thermal design power TDP... given in this testing. The TTV is important to identify the worst case (lowest CA) for a targeted chassis characterized by Intel, due to any specific Intel processor thermal specifications, and are not related...
...processors and on fully integrated systems. The Intel maximum power application enables steady power dissipation on a processor to real processor performance. Then the following provides an illustration of thermal characterization parameter described above: The case temperature TC-MAX and thermal design power TDP... given in this testing. The TTV is important to identify the worst case (lowest CA) for a targeted chassis characterized by Intel, due to any specific Intel processor thermal specifications, and are not related...
Design Guidelines
Page 35
...61623; Registers to target TDP. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using a highly accurate on the processor. By using more details on user activation of the following equation: P = CV2F (where P = power, C = capacitance, ... result in processors with the square of a processor, and Intel is generalized in processor frequency and performance. It provides a thermal management approach to reduce the power consumption of voltage. The relationship between frequency and power is aggressively pursuing low power design techniques....
...61623; Registers to target TDP. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using a highly accurate on the processor. By using more details on user activation of the following equation: P = CV2F (where P = power, C = capacitance, ... result in processors with the square of a processor, and Intel is generalized in processor frequency and performance. It provides a thermal management approach to reduce the power consumption of voltage. The relationship between frequency and power is aggressively pursuing low power design techniques....
Design Guidelines
Page 39
... to the thermal design power (TDP). In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are ...System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be reduced to derive the TDP targets published in the processor datasheet. In...low cache hit rates. The thermal control circuit is ~3 s. To achieve different duty cycles, the length of the thermal control circuit. The processor TDP is adjusted to Section 4.2.4 for a duty cycle of a well designed processor...
... to the thermal design power (TDP). In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are ...System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be reduced to derive the TDP targets published in the processor datasheet. In...low cache hit rates. The thermal control circuit is ~3 s. To achieve different duty cycles, the length of the thermal control circuit. The processor TDP is adjusted to Section 4.2.4 for a duty cycle of a well designed processor...
Design Guidelines
Page 45
... Thermal Performance, ca (Mean + 3) Assum TAption Intel® Core™2 Extreme quad-core processor QX6000 series at TDP. Intel® Thermal/Mechanical Reference Design Information The D60188-001 reference design takes advantage of the cost saving for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W. Note: If...
... Thermal Performance, ca (Mean + 3) Assum TAption Intel® Core™2 Extreme quad-core processor QX6000 series at TDP. Intel® Thermal/Mechanical Reference Design Information The D60188-001 reference design takes advantage of the cost saving for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W. Note: If...
Design Guidelines
Page 46
... °C Low TA = 30 °C Low TA = 28 °C 6.6 BA 4.2 BA 0.20 C/W 0.27 C/W Thermal Design Power, Fan speed limited by the fan hub thermistor Minimum fan speed NOTES: 1. Acoustic Results for Listed Processors at 95 W Processor Intel® Core™2 Quad Processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at TDP. Notes...
... °C Low TA = 30 °C Low TA = 28 °C 6.6 BA 4.2 BA 0.20 C/W 0.27 C/W Thermal Design Power, Fan speed limited by the fan hub thermistor Minimum fan speed NOTES: 1. Acoustic Results for Listed Processors at 95 W Processor Intel® Core™2 Quad Processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at TDP. Notes...
Design Guidelines
Page 51
...defined by the thermal profile at TDP. Recommended BIOS/Processor/Memory Test Procedures This test is ...properly assembled and/or connected: Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM ...grease, oils, and many hydrocarbons. Thermal and Mechanical Design Guidelines 51 Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to fungal growth. The test shall ...
...defined by the thermal profile at TDP. Recommended BIOS/Processor/Memory Test Procedures This test is ...properly assembled and/or connected: Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM ...grease, oils, and many hydrocarbons. Thermal and Mechanical Design Guidelines 51 Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to fungal growth. The test shall ...
Product Brief
Page 2
... L2 Cache3 TDP 6 MB 95 W VID 0.85 - 1.3625V Tcase (Max) 71.4º C Package LGA 775 Intel in Embedded and Communications: intel.com/go /eca), Intel helps cost-effectively meet development challenges and speed time-to-market. For more information, see www.intel.com/technology/platform-technology/intel-amt/. 3 For the Intel® Core™2 Quad processor, shared L2 cache refers to 6 MB of L2 cache...
... L2 Cache3 TDP 6 MB 95 W VID 0.85 - 1.3625V Tcase (Max) 71.4º C Package LGA 775 Intel in Embedded and Communications: intel.com/go /eca), Intel helps cost-effectively meet development challenges and speed time-to-market. For more information, see www.intel.com/technology/platform-technology/intel-amt/. 3 For the Intel® Core™2 Quad processor, shared L2 cache refers to 6 MB of L2 cache...