Design Guide
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... absence or characteristics of documents which may cause the product to them. Intel, Intel Inside, Xeon, Intel Core and the Intel logo are not intended for future definition and shall have an order number and are available upon request. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) INFORMATION IN THIS DOCUMENT IS...
... absence or characteristics of documents which may cause the product to them. Intel, Intel Inside, Xeon, Intel Core and the Intel logo are not intended for future definition and shall have an order number and are available upon request. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) INFORMATION IN THIS DOCUMENT IS...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
Design Guide
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... Heatsink Base Pocket - A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
... Heatsink Base Pocket - A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
Design Guide
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
... the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
Design Guide
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... Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 ...Heat Spreader: a component of the processor, measured at the IHS surface. See the LGA771 Socket Mechanical Design Guide for Ψ measurements. A measure of a processor specification over certain time periods. TLA...
... Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 ...Heat Spreader: a component of the processor, measured at the IHS surface. See the LGA771 Socket Mechanical Design Guide for Ψ measurements. A measure of a processor specification over certain time periods. TLA...
Design Guide
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.... A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. A unit of 2) TCASE_MAX TCC TCONTROL TOFFSET TDP Thermal Monitor Thermal Profile TIM TLA...
.... A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. A unit of 2) TCASE_MAX TCC TCONTROL TOFFSET TDP Thermal Monitor Thermal Profile TIM TLA...
Design Guide
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... Table 2-1 above. 3. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 Quad-Core Intel® Xeon® Processor X5300 Series is targeted for volumetrically constrained form factors (1U, server...
... Table 2-1 above. 3. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 Quad-Core Intel® Xeon® Processor X5300 Series is targeted for volumetrically constrained form factors (1U, server...
Design Guide
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... socket is superseded with the drawing in the LGA771 Socket Mechanical Design Guide during a mechanical shock event. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. The drawing is shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. Details can also...
... socket is superseded with the drawing in the LGA771 Socket Mechanical Design Guide during a mechanical shock event. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. The drawing is shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. Details can also...
Design Guide
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... order to avoid any damage to directly attach a heatsink. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to the baseboard. The mechanical requirements of the attach mechanism depend on the...
... order to avoid any damage to directly attach a heatsink. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to the baseboard. The mechanical requirements of the attach mechanism depend on the...
Design Guide
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... data set is the Thermal Control Circuit (TCC). One feature of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. This is no defined... PROCHOT# is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 When active, the TCC lowers the processor temperature by designing to the processor specifications (i.e Thermal Profile) and can not be adjusted based...
... data set is the Thermal Control Circuit (TCC). One feature of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. This is no defined... PROCHOT# is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 When active, the TCC lowers the processor temperature by designing to the processor specifications (i.e Thermal Profile) and can not be adjusted based...
Design Guide
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...a thermal management approach to derive the TDP targets published in Section 2.2.4. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on these thermal management features. The DTS uses the same sensor utilized for ...Section 2.3.1. It is designed specifically to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For an overview of approximately 1°C....
...a thermal management approach to derive the TDP targets published in Section 2.2.4. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on these thermal management features. The DTS uses the same sensor utilized for ...Section 2.3.1. It is designed specifically to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For an overview of approximately 1°C....
Design Guide
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... highest of the DTS domains for multiple core products has only one TCONTROL value per processor. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. Each die within the processor is available through CPU pin (G5) on each die contains two cores. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and...
... highest of the DTS domains for multiple core products has only one TCONTROL value per processor. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. Each die within the processor is available through CPU pin (G5) on each die contains two cores. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and...
Design Guide
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... THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be shared by all cores shut down All Cores TCC Activation Notes: 1. Table 2-2 provides an overview of heatpipe heatsinks, as...
... THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be shared by all cores shut down All Cores TCC Activation Notes: 1. Table 2-2 provides an overview of heatpipe heatsinks, as...
Design Guide
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... customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) There can meet a given Thermal Profile. The equation...
... customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) There can meet a given Thermal Profile. The equation...
Design Guide
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... is no longer absolute, the TCONTROL value is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. Refer to the DTS value from the PECI interface. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 TCONTROL Value and Digital Thermal Sensor Value Interaction Digital Thermal Sensor...
... is no longer absolute, the TCONTROL value is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. Refer to the DTS value from the PECI interface. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 TCONTROL Value and Digital Thermal Sensor Value Interaction Digital Thermal Sensor...
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... Thermal Profile specification, shown in support of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile, but the DTS temperature must be...
... Thermal Profile specification, shown in support of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile, but the DTS temperature must be...
Design Guide
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... of time when running a worst-case real world application in a given performance benchmark is based on Intel's 2U+ air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Dual Thermal Profile Diagram TCASEMAX B TCASEMAX A TCASEMAX@... reduced capability represented by such thermal solutions, designing to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is ...
... of time when running a worst-case real world application in a given performance benchmark is based on Intel's 2U+ air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Dual Thermal Profile Diagram TCASEMAX B TCASEMAX A TCASEMAX@... reduced capability represented by such thermal solutions, designing to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is ...