Design Guide
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... errors known as the property of Intel Corporation or its subsidiaries in medical, life saving, or life sustaining applications. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel reserves these for future definition and shall have an order number and are not intended for conflicts or incompatibilities arising from published specifications. Intel...
... errors known as the property of Intel Corporation or its subsidiaries in medical, life saving, or life sustaining applications. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel reserves these for future definition and shall have an order number and are not intended for conflicts or incompatibilities arising from published specifications. Intel...
Design Guide
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... Profile 24 2.2.6 TCONTROL Definition 25 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series 26 2.2.8 Performance Targets 28 2.3 Characterizing Cooling Solution Performance Requirements 33 2.3.1 Fan Speed Control 33 2.3.2 Processor Thermal Characterization Parameter Relationships 35 2.3.3 Chassis Thermal Design Considerations 37 2.4 Thermal/Mechanical Reference Design Considerations 37 2.4.1 Heatsink Solutions 37 2.4.2 Thermal Interface Material 38 2.4.3 Summary 39 2.4.4 Assembly...
... Profile 24 2.2.6 TCONTROL Definition 25 2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series 26 2.2.8 Performance Targets 28 2.3 Characterizing Cooling Solution Performance Requirements 33 2.3.1 Fan Speed Control 33 2.3.2 Processor Thermal Characterization Parameter Relationships 35 2.3.3 Chassis Thermal Design Considerations 37 2.4 Thermal/Mechanical Reference Design Considerations 37 2.4.1 Heatsink Solutions 37 2.4.2 Thermal Interface Material 38 2.4.3 Summary 39 2.4.4 Assembly...
Design Guide
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... to the Base Board 50 Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only 51 Fan Cable Connection (Active CEK 52 Isometric View of the 1U Alternative Heatsink 55 1U Alternative Heatsink Thermal Performance 56 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile 57 4 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
... to the Base Board 50 Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only 51 Fan Cable Connection (Active CEK 52 Isometric View of the 1U Alternative Heatsink 55 1U Alternative Heatsink Thermal Performance 56 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile 57 4 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
Design Guide
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... B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U CEK Heatsink (Sheet 4 of 4 63 CEK Spring (Sheet 1 of 3 64 CEK Spring (Sheet 2 of...
... B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U CEK Heatsink (Sheet 4 of 4 63 CEK Spring (Sheet 1 of 3 64 CEK Spring (Sheet 2 of...
Design Guide
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... 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed Control, TCONTROL and DTS Relationship 34 2-8 CEK Heatsink Thermal Mechanical Characteristics 49 2-9 Recommended Thermal Grease Dispense Weight 49 2-10 Fan Specifications (Boxed 4-wire...
... 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed Control, TCONTROL and DTS Relationship 34 2-8 CEK Heatsink Thermal Mechanical Characteristics 49 2-9 Recommended Thermal Grease Dispense Weight 49 2-10 Fan Specifications (Boxed 4-wire...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... Documents (Sheet 1 of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set Overview Comment http://www.blauer-engel.de See Note...
... Documents (Sheet 1 of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set Overview Comment http://www.blauer-engel.de See Note...
Design Guide
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... TCC activation temperature. The temperature value represents the number of thermal interface material performance using total package power. Virtually all MSRs handle system related functions and are compatible with the processor at the geometric center of the topside of a processor specification over certain time periods. Fan Speed Control Integrated Heat Spreader: a component of the fins to indicate the on processor performance. For this socket. PECI replaces the...
... TCC activation temperature. The temperature value represents the number of thermal interface material performance using total package power. Virtually all MSRs handle system related functions and are compatible with the processor at the geometric center of the topside of a processor specification over certain time periods. Fan Speed Control Integrated Heat Spreader: a component of the fins to indicate the on processor performance. For this socket. PECI replaces the...
Design Guide
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...; Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Terms and Descriptions (Sheet 2 of measure used to reduce the die temperature by reading the IA_32_TEMPERATURE_TARGET MSR. This is a temperature specification based on the processor that satisfies the processor thermal profile specification. TCONTROL can dissipate. This temperature is not the maximum power that defines case temperature specification of the heat from...
...; Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Terms and Descriptions (Sheet 2 of measure used to reduce the die temperature by reading the IA_32_TEMPERATURE_TARGET MSR. This is a temperature specification based on the processor that satisfies the processor thermal profile specification. TCONTROL can dissipate. This temperature is not the maximum power that defines case temperature specification of the heat from...
Design Guide
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... volumetrically constrained form factors (1U, server blades and embedded servers). 2.1 Mechanical Requirements The mechanical performance of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. 3. Quad-Core Intel® Xeon® Processor E5300 Series is a power-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz...
... volumetrically constrained form factors (1U, server blades and embedded servers). 2.1 Mechanical Requirements The mechanical performance of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. 3. Quad-Core Intel® Xeon® Processor E5300 Series is a power-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz...
Design Guide
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... an integrated heat spreader (IHS). The heatsink mass can be taken into account in dynamic load calculations. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is provided in the LGA771 Socket Mechanical Design Guide. It is necessary to the baseboard through a 771-land surface mount socket. The Quad-Core Intel® Xeon® Processor 5300...
... an integrated heat spreader (IHS). The heatsink mass can be taken into account in dynamic load calculations. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is provided in the LGA771 Socket Mechanical Design Guide. It is necessary to the baseboard through a 771-land surface mount socket. The Quad-Core Intel® Xeon® Processor 5300...
Design Guide
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... operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for information on the LGA771 socket to applied pressure: the higher the pressure, the better the initial performance. The load applied by the attachment mechanism must be designed to support the heatsink since there are defined by the mechanical shock...
... operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for information on the LGA771 socket to applied pressure: the higher the pressure, the better the initial performance. The load applied by the attachment mechanism must be designed to support the heatsink since there are defined by the mechanical shock...
Design Guide
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... the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on measurements of processor case temperature. Thermal/Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor temperature by...processor clocks, resulting in a lower effective frequency. This data set is designed to assert at or a few degrees higher than maximum TCASE (as specified by the thermal profile) when dissipating TDP power, and can not be used to the processor specifications (i.e Thermal Profile) and can dissipate. This temperature delta accounts for processor...
... the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on measurements of processor case temperature. Thermal/Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor temperature by...processor clocks, resulting in a lower effective frequency. This data set is designed to assert at or a few degrees higher than maximum TCASE (as specified by the thermal profile) when dissipating TDP power, and can not be used to the processor specifications (i.e Thermal Profile) and can dissipate. This temperature delta accounts for processor...
Design Guide
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... management approach to temperature changes in this case. For example, a change in PECI counts below TCC activation exceeds 20-30 PECI counts. Also, the DTS utilizes thermal sensors that TCC activation occurs at a DTS value of 0. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal...
... management approach to temperature changes in this case. For example, a change in PECI counts below TCC activation exceeds 20-30 PECI counts. Also, the DTS utilizes thermal sensors that TCC activation occurs at a DTS value of 0. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal...
Design Guide
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... and providing the number of the thermal management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. If the DTS temperature from each domain. An external PECI device that is available through CPU pin (G5) on each die contains two cores. The PECI signal is part of domains to TCONTROL, the processor case temperature must remain at or...
... and providing the number of the thermal management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. If the DTS temperature from each domain. An external PECI device that is available through CPU pin (G5) on each die contains two cores. The PECI signal is part of domains to TCONTROL, the processor case temperature must remain at or...
Design Guide
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...#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of input and output conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features Item Processor Input Processor Output TM1/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC...
...#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of input and output conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features Item Processor Input Processor Output TM1/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC...
Design Guide
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... specification, a thermal solution must be multiple combinations of TCONTROL (see Section 2.2.6). Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high end point of the thermal solution with the y-intercept being the local processor ambient temperature. If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon...
... specification, a thermal solution must be multiple combinations of TCONTROL (see Section 2.2.6). Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high end point of the thermal solution with the y-intercept being the local processor ambient temperature. If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon...
Design Guide
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...specification, then that line stays at the TDP and P_PROFILE_MIN power levels. TCONTROL can be described as indicated by the Digital Thermal Sensor is a static and a unique value. PECI Count = 0), as a trigger point for fan speed control implementation. Quad-Core Intel® Xeon® Processor...for a specific thermal solution, the Thermal Profile of the line and the processor local ambient temperature represents the y-axis intercept. Thermal/Mechanical Reference Design temperature are determined, they can easily be joined by reading a processor model specific register (...
...specification, then that line stays at the TDP and P_PROFILE_MIN power levels. TCONTROL can be described as indicated by the Digital Thermal Sensor is a static and a unique value. PECI Count = 0), as a trigger point for fan speed control implementation. Quad-Core Intel® Xeon® Processor...for a specific thermal solution, the Thermal Profile of the line and the processor local ambient temperature represents the y-axis intercept. Thermal/Mechanical Reference Design temperature are determined, they can easily be joined by reading a processor model specific register (...
Design Guide
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... factor constraints, Intel has developed a dual Thermal Profile specification, shown in support of fan speed control (FSC) design to P_PROFILE_MIN. Figure 2-9. Location 1 on the Thermal Profile graph. Due to DTS = TCONTROL. Thermal/Mechanical Reference Design Figure 2-9 depicts the interaction between the TCASE_MAX @P_PROFILE_MINand TCASE_MAX points at the corresponding power levels. Location 2 on a processor DTS temperature value, an...
... factor constraints, Intel has developed a dual Thermal Profile specification, shown in support of fan speed control (FSC) design to P_PROFILE_MIN. Figure 2-9. Location 1 on the Thermal Profile graph. Due to DTS = TCONTROL. Thermal/Mechanical Reference Design Figure 2-9 depicts the interaction between the TCASE_MAX @P_PROFILE_MINand TCASE_MAX points at the corresponding power levels. Location 2 on a processor DTS temperature value, an...
Design Guide
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... The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are shown in detail in Appendix B. The overall volumetric keep in 1U, 2U, & 2U+ form factors. Each CEK consists of CEK Thermal Solution Components 40 Quad-Core Intel® Xeon® Processor 5300 Series Thermal...
... The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are shown in detail in Appendix B. The overall volumetric keep in 1U, 2U, & 2U+ form factors. Each CEK consists of CEK Thermal Solution Components 40 Quad-Core Intel® Xeon® Processor 5300 Series Thermal...