Design Guide
Page 21
... domain. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on each other. An external PECI device that is part of the DTS output temperatures within the processor is available through CPU pin (G5) on the die.
... domain. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on each other. An external PECI device that is part of the DTS output temperatures within the processor is available through CPU pin (G5) on the die.
Design Guide
Page 52
.... If the SENSE signal is recommended that a 4 pin fan header be used , pin 3 of the processor socket. Fan Cable Connection (Active CEK) 52 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to match the baseboard-mounted fan speed monitor requirements, if applicable....] from the center of the connector should be positioned to allow the fan heatsink power cable to support the boxed processor. If a 3-pin CPU fan header is required around the heatsink to VCC with a resistor. The baseboard fan power header should be documented...
.... If the SENSE signal is recommended that a 4 pin fan header be used , pin 3 of the processor socket. Fan Cable Connection (Active CEK) 52 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to match the baseboard-mounted fan speed monitor requirements, if applicable....] from the center of the connector should be positioned to allow the fan heatsink power cable to support the boxed processor. If a 3-pin CPU fan header is required around the heatsink to VCC with a resistor. The baseboard fan power header should be documented...