Design Guide
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... OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. The Quad-Core Intel® Xeon® Processor 5300 Series may make changes to obtain the latest specifications and before placing your product order. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel may contain design defects or errors known as the property...
... OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. The Quad-Core Intel® Xeon® Processor 5300 Series may make changes to obtain the latest specifications and before placing your product order. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel may contain design defects or errors known as the property...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
Design Guide
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... B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U CEK ... Heatsink Base Pocket - Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
... B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U CEK ... Heatsink Base Pocket - Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
... the 80W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
Design Guide
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...PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (... Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to external thermal monitoring ...
...PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (... Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to external thermal monitoring ...
Design Guide
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... height. 1U is usually measured at the chassis air inlets. A feature on a temperature reading from the processor's Digital Thermal Sensor. A unit of the heat from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of...
... height. 1U is usually measured at the chassis air inlets. A feature on a temperature reading from the processor's Digital Thermal Sensor. A unit of the heat from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Introduction Table 1-2. Terms and Descriptions (Sheet 2 of...
Design Guide
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... bus speed of 1066 MHz or 1333 MHz. Quad-Core Intel® Xeon® Processor E5300 Series is targeted for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of the processor cooling solution must satisfy the requirements described in the LGA771 Socket Mechanical Design Guide. 4. These socket limits...
... bus speed of 1066 MHz or 1333 MHz. Quad-Core Intel® Xeon® Processor E5300 Series is targeted for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of the processor cooling solution must satisfy the requirements described in the LGA771 Socket Mechanical Design Guide. 4. These socket limits...
Design Guide
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... the mechanical information for QuadCore Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. A description of the processor substrate as a mechanical reference or load-bearing surface in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
... the mechanical information for QuadCore Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. A description of the processor substrate as a mechanical reference or load-bearing surface in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
Design Guide
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... potential mechanical solution for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to Section 2.4 for protecting LGA771 socket solder joints as well as preventing package pullout from the socket... is using such a heatsink attachment scheme. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is to support acoustic noise reduction through fan speed control and ensure the long-term reliability...
... potential mechanical solution for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Refer to Section 2.4 for protecting LGA771 socket solder joints as well as preventing package pullout from the socket... is using such a heatsink attachment scheme. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is to support acoustic noise reduction through fan speed control and ensure the long-term reliability...
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... fixed correlation between the PROCHOT# assertion temperature and the case temperature. This is used for processor thermal solution design targets. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on the Digital Thermal Sensor). Please refer to ensure...
... fixed correlation between the PROCHOT# assertion temperature and the case temperature. This is used for processor thermal solution design targets. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on the Digital Thermal Sensor). Please refer to ensure...
Design Guide
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...increases in Section 2.3.1. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) In addition, on -die temperature sensor feature...provides a specific command set is a proprietary single wire bus between the processor and the chipset or other health monitoring device. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. The DTS uses the same sensor...
...increases in Section 2.3.1. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) In addition, on -die temperature sensor feature...provides a specific command set is a proprietary single wire bus between the processor and the chipset or other health monitoring device. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. The DTS uses the same sensor...
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...currently receives the highest of the DTS domains for the Quad-Core Intel® Xeon® Processor 5300 Series. Figure 2-5. See Section 2.2.6 for information on each other. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 ...external PECI device such as specified by the thermal profile. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each domain. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 Figure 2-5 ...
...currently receives the highest of the DTS domains for the Quad-Core Intel® Xeon® Processor 5300 Series. Figure 2-5. See Section 2.2.6 for information on each other. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 ...external PECI device such as specified by the thermal profile. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each domain. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 Figure 2-5 ...
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... heatpipe heatsinks, as illustrated in Figure 2-6, are provided in Quad-Core Intel® Xeon® Processor 5300 Series. 2. Table 2-2 provides an overview of input and output conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features Item Processor Input Processor Output TM1/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC Activation Temperature PROCHOT# Asserted...
... heatpipe heatsinks, as illustrated in Figure 2-6, are provided in Quad-Core Intel® Xeon® Processor 5300 Series. 2. Table 2-2 provides an overview of input and output conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features Item Processor Input Processor Output TM1/TM2 DTSCore X > TCC Activation Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC Activation Temperature PROCHOT# Asserted...
Design Guide
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... implementation (refer to Section 2.3.3). If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Profile allows the customers to make a trade-off between a processor's case temperature and its DTS temperature is greater than TCONTROL (refer to Section 2.2.6). The slope...
... implementation (refer to Section 2.3.3). If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Thermal Profile allows the customers to make a trade-off between a processor's case temperature and its DTS temperature is greater than TCONTROL (refer to Section 2.2.6). The slope...
Design Guide
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... The value for TCONTROL is a static and a unique value. Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each...
... The value for TCONTROL is a static and a unique value. Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each...
Design Guide
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... 2.2.7 2.2.7.1 Since TCONTROL is designed to achieve better acoustic performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) airflow, thermal solution height), it is permitted to...
... 2.2.7 2.2.7.1 Since TCONTROL is designed to achieve better acoustic performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) airflow, thermal solution height), it is permitted to...
Design Guide
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... exceed Thermal Profile B specification are not expected to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. The 1.5% number is typically between 1 and 2%. Thermal solutions that Intel's long-term processor reliability requirements are satisfied. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Dual Thermal Profile Diagram TCASEMAX B TCASEMAX...
... exceed Thermal Profile B specification are not expected to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. The 1.5% number is typically between 1 and 2%. Thermal solutions that Intel's long-term processor reliability requirements are satisfied. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Dual Thermal Profile Diagram TCASEMAX B TCASEMAX...