Design Guide
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... names may be obtained by calling 1-800-548-4725, or by visiting Intel's website at any features or instructions marked "reserved" or "undefined." All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Current characterized errata are not ... use in the United States and other Intel literature, may contain design defects or errors known as the property of any time, without notice. Intel products are available upon request. The Quad-Core Intel® Xeon® Processor 5300 Series may be claimed as errata,...
... names may be obtained by calling 1-800-548-4725, or by visiting Intel's website at any features or instructions marked "reserved" or "undefined." All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Current characterized errata are not ... use in the United States and other Intel literature, may contain design defects or errors known as the property of any time, without notice. Intel products are available upon request. The Quad-Core Intel® Xeon® Processor 5300 Series may be claimed as errata,...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
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... Quad-Core Intel® Xeon® Processor E5300 Series refers to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. In case of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771...
... Quad-Core Intel® Xeon® Processor E5300 Series refers to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. In case of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771...
Design Guide
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... (Sheet 1 of the fins to -ambient thermal characterization parameter. The temperature value represents the number of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) See the LGA771 Socket Mechanical Design Guide for details regarding this example, it can act to form a duct. PECI communicates readings from the...
... (Sheet 1 of the fins to -ambient thermal characterization parameter. The temperature value represents the number of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) See the LGA771 Socket Mechanical Design Guide for details regarding this example, it can act to form a duct. PECI communicates readings from the...
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...to define server rack spacing height. 1U is a temperature specification based on the processor that the processor can be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 TCONTROL = -TOFFSET. An...be designed to the heatsink. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. TCONTROL can keep the processor's die temperature within factory specifications under normal operating conditions, and with a thermal solution that defines ...
...to define server rack spacing height. 1U is a temperature specification based on the processor that the processor can be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 TCONTROL = -TOFFSET. An...be designed to the heatsink. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. TCONTROL can keep the processor's die temperature within factory specifications under normal operating conditions, and with a thermal solution that defines ...
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... LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Torque that can be applied to the package IHS. Quad-Core Intel® Xeon® Processor X5300 Series is targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Processor...
... LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Torque that can be applied to the package IHS. Quad-Core Intel® Xeon® Processor X5300 Series is targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Processor...
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... uniform and spreads over a larger surface area (not the entire IHS area). The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for QuadCore Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing, or standard...
... uniform and spreads over a larger surface area (not the entire IHS area). The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for QuadCore Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing, or standard...
Design Guide
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...• Ensuring thermal performance of the chassis pan can be utilized rather than solely relying on the LGA771 socket to directly attach a heatsink. This specification requires that the system must be considered when designing ... The Intel reference design for the Quad-Core Intel® Xeon® Processor 5300 Series package. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is implemented, in Section 2.1.1. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 ...
...• Ensuring thermal performance of the chassis pan can be utilized rather than solely relying on the LGA771 socket to directly attach a heatsink. This specification requires that the system must be considered when designing ... The Intel reference design for the Quad-Core Intel® Xeon® Processor 5300 Series package. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is implemented, in Section 2.1.1. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 ...
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... feature of the Thermal Monitor is designed to determine those applications that the processor can not be designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the Thermal Design Power .../Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor temperature by designing to ensure the Thermal Control Circuit is used for more details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum ...
... feature of the Thermal Monitor is designed to determine those applications that the processor can not be designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the Thermal Design Power .../Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor temperature by designing to ensure the Thermal Control Circuit is used for more details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum ...
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...multiple DTS will be discussed more detail in Section 2.3.1. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on the Quad-Core Intel® Xeon® Processor 5300 Series. For example, a change in more detail information on these ... temperature. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) They provide a thermal management approach...
...multiple DTS will be discussed more detail in Section 2.3.1. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on the Quad-Core Intel® Xeon® Processor 5300 Series. For example, a change in more detail information on these ... temperature. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) They provide a thermal management approach...
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... through CPU pin (G5) on TCONTROL. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on the die. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 Domain 1 Core_1 Core_2 Core_3...
... through CPU pin (G5) on TCONTROL. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on the die. DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series Fan Speed Controller PECI Host Domain 0 Domain 1 Core_1 Core_2 Core_3...
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... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. To assist customers interested in Table 2-3. For this may influence the...
... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. To assist customers interested in Table 2-3. For this may influence the...
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... (refer to Section 2.2.6). If the case-to -ambient thermal resistance, ΨCA (°C/W) b = Processor local ambient temperature, TLA (°C) Figure 2-7. The lower end point of the Thermal Profile represents the power...processor local ambient temperature that can be at or below the Thermal Profile line for the given processor when its power consumption as : Equation 2-1.y = ax + b Where: y = Processor case temperature, TCASE (°C) x = Processor power consumption (W) a = Case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor...
... (refer to Section 2.2.6). If the case-to -ambient thermal resistance, ΨCA (°C/W) b = Processor local ambient temperature, TLA (°C) Figure 2-7. The lower end point of the Thermal Profile represents the power...processor local ambient temperature that can be at or below the Thermal Profile line for the given processor when its power consumption as : Equation 2-1.y = ax + b Where: y = Processor case temperature, TCASE (°C) x = Processor power consumption (W) a = Case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor...
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...manufacturing and configured for calculating TCONTROL is deemed as a compliant solution. 2.2.6 TCONTROL Definition Figure 2-8. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is now defined as a relative value to -ambient resistance represents the slope of... value from the PECI interface. PECI Count = 0), as previously required on legacy processors. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 The processor TCONTROL value provided by a line, which represents the Thermal Profile of the line...
...manufacturing and configured for calculating TCONTROL is deemed as a compliant solution. 2.2.6 TCONTROL Definition Figure 2-8. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is now defined as a relative value to -ambient resistance represents the slope of... value from the PECI interface. PECI Count = 0), as previously required on legacy processors. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 The processor TCONTROL value provided by a line, which represents the Thermal Profile of the line...
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... performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is based on a processor DTS temperature value, an equivalent TCASE... factors (i.e. The thermal solution for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal/Mechanical Reference Design Figure 2-9 depicts the interaction ...
... performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is based on a processor DTS temperature value, an equivalent TCASE... factors (i.e. The thermal solution for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal/Mechanical Reference Design Figure 2-9 depicts the interaction ...
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... level, both of these Thermal Profiles ensure that TCC would only be any additional risk to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. A worst case real world application is defined as the baseline since the run variation in a given ...TDP for very brief periods of time when running a worst-case real world application in an increased probability of the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. It is based on...
... level, both of these Thermal Profiles ensure that TCC would only be any additional risk to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. A worst case real world application is defined as the baseline since the run variation in a given ...TDP for very brief periods of time when running a worst-case real world application in an increased probability of the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. It is based on...