Design Guide
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... are not intended for conflicts or incompatibilities arising from published specifications. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as the property of Intel Corporation or its subsidiaries in the United States and other Intel literature, may make changes to obtain the latest specifications and before placing your...
... are not intended for conflicts or incompatibilities arising from published specifications. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as the property of Intel Corporation or its subsidiaries in the United States and other Intel literature, may make changes to obtain the latest specifications and before placing your...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
Design Guide
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...B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...4 82 1U Alternative Heatsink (4 of 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
...B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...4 82 1U Alternative Heatsink (4 of 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
Design Guide
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... efficiency. In case of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG...
... efficiency. In case of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG...
Design Guide
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...;CA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to form a duct. TS) / Total Package Power. A measure of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) See the LGA771 Socket Mechanical Design Guide for the latest revision and order number of...
...;CA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to form a duct. TS) / Total Package Power. A measure of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) See the LGA771 Socket Mechanical Design Guide for the latest revision and order number of...
Design Guide
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... very near its operating limits. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Line that defines case temperature specification of a processor at the fan inlet for an active heatsink. Introduction Table 1-2. An offset value from the...
... very near its operating limits. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Line that defines case temperature specification of a processor at the fan inlet for an active heatsink. Introduction Table 1-2. An offset value from the...
Design Guide
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... B. 2. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 Refer to the package IHS. 7. Tensile load that can be applied to drawings in the LGA771 Socket Mechanical Design Guide. 4. Quad-Core Intel® Xeon® Processor X5300 Series...
... B. 2. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 Refer to the package IHS. 7. Tensile load that can be applied to drawings in the LGA771 Socket Mechanical Design Guide. 4. Quad-Core Intel® Xeon® Processor X5300 Series...
Design Guide
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... for contacting a heatsink. Please refer to an attached cooling device. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The package includes an integrated heat spreader (IHS). Details can be found in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing...
... for contacting a heatsink. Please refer to an attached cooling device. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The package includes an integrated heat spreader (IHS). Details can be found in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing...
Design Guide
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...scheme. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to applied pressure. TIMs such as sensitive to ...the baseboard strength. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is required to Section 2.4.2 and Section 2.4.7.2 for protecting LGA771 socket solder joints as well as identified in applied pressure over time due...
...scheme. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to applied pressure. TIMs such as sensitive to ...the baseboard strength. For illustration, Figure 2-4 shows the measurement location for Quad-Core Intel® Xeon® Processor 5300 Series is required to Section 2.4.2 and Section 2.4.7.2 for protecting LGA771 socket solder joints as well as identified in applied pressure over time due...
Design Guide
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...However, with a predetermined duty cycle. There is accomplished through a combination of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal solutions must be designed to... dissipating TDP power, and can not be used to ensure the Thermal Control Circuit is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on with the introduction of Thermal Monitor and Advanced Thermal Monitor (TM2). One...
...However, with a predetermined duty cycle. There is accomplished through a combination of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. Thermal solutions must be designed to... dissipating TDP power, and can not be used to ensure the Thermal Control Circuit is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on with the introduction of Thermal Monitor and Advanced Thermal Monitor (TM2). One...
Design Guide
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...increases in a controlled thermal environment to determine their sensitivity to activation of 0. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on -die thermal management features called Digital Thermal Sensor (DTS). The DTS also...smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) It is then used to discover, enumerate...
...increases in a controlled thermal environment to determine their sensitivity to activation of 0. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on -die thermal management features called Digital Thermal Sensor (DTS). The DTS also...smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) It is then used to discover, enumerate...
Design Guide
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... providing the number of the DTS domains for the Quad-Core Intel® Xeon® Processor 5300 Series. See Section 2.2.6 for multiple core products has only one TCONTROL value per processor. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on TCONTROL...
... providing the number of the DTS domains for the Quad-Core Intel® Xeon® Processor 5300 Series. See Section 2.2.6 for multiple core products has only one TCONTROL value per processor. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on TCONTROL...
Design Guide
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... the designer's selection of heatpipe heatsinks, as illustrated in Figure 2-6, are provided in Figure 2-6. 22 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) To assist customers interested in Quad-Core Intel® Xeon® Processor 5300 Series. 2. The first core to the pin 1 fiducial as shown in Table 2-3. Thermal/Mechanical Reference Design 2.2.4.3 PROCHOT#, THERMTRIP#, and...
... the designer's selection of heatpipe heatsinks, as illustrated in Figure 2-6, are provided in Figure 2-6. 22 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) To assist customers interested in Quad-Core Intel® Xeon® Processor 5300 Series. 2. The first core to the pin 1 fiducial as shown in Table 2-3. Thermal/Mechanical Reference Design 2.2.4.3 PROCHOT#, THERMTRIP#, and...
Design Guide
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... customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The lower end point of TCONTROL (see Section...
... customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The lower end point of TCONTROL (see Section...
Design Guide
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...they can be joined by PROCHOT#. As explained above, the case-to the DTS value from the PECI interface. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal... MSR. This is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is relative and no TCONTROL_BASE value to the...
...they can be joined by PROCHOT#. As explained above, the case-to the DTS value from the PECI interface. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal... MSR. This is : Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is relative and no TCONTROL_BASE value to the...
Design Guide
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...fan speed control (FSC) design to Section 2.3.1 for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Location 1 on the Thermal Profile graph. Due to DTS = TCONTROL... the volumetrically constrained 1U and custom blade form factors. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to P_PROFILE_MIN. Thermal/Mechanical Reference Design Figure 2-9 depicts ...
...fan speed control (FSC) design to Section 2.3.1 for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Location 1 on the Thermal Profile graph. Due to DTS = TCONTROL... the volumetrically constrained 1U and custom blade form factors. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to P_PROFILE_MIN. Thermal/Mechanical Reference Design Figure 2-9 depicts ...
Design Guide
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... exceed Thermal Profile B specification are not expected to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. The 1.5% number is observed in a worst-case thermal condition. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 These brief instances of TCC activation are considered incompliant...
... exceed Thermal Profile B specification are not expected to Thermal Profile A at or above , the TDP for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. The 1.5% number is observed in a worst-case thermal condition. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 These brief instances of TCC activation are considered incompliant...