Design Guide
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... must not rely on the absence or characteristics of any time, without notice. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel, Intel Inside, Xeon, Intel Core and the Intel logo are referenced in the United States and other Intel literature, may cause the product to specifications and product descriptions at http://www...
... must not rely on the absence or characteristics of any time, without notice. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel, Intel Inside, Xeon, Intel Core and the Intel logo are referenced in the United States and other Intel literature, may cause the product to specifications and product descriptions at http://www...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
Design Guide
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... Heatsink Base Pocket - A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
... Heatsink Base Pocket - A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
Design Guide
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
Design Guide
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
Design Guide
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... table. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 50W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers...
... table. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 50W TDP skus of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers...
Design Guide
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... Documents (Sheet 2 of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For this document. 1.4 Definition of 2) Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to the baseboard through...
... Documents (Sheet 2 of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For this document. 1.4 Definition of 2) Term Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to the baseboard through...
Design Guide
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... inlet for fan speed control implementation. TCONTROL = -TOFFSET. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of a passive heatsink or at the chassis air inlets... a given power level. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 This value is very near its operating limits. Introduction Table 1-2. ...
... inlet for fan speed control implementation. TCONTROL = -TOFFSET. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of a passive heatsink or at the chassis air inlets... a given power level. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 This value is very near its operating limits. Introduction Table 1-2. ...
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...) 13 Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for the full range of 1066 MHz or 1333 MHz. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design...
...) 13 Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for the full range of 1066 MHz or 1333 MHz. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design...
Design Guide
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..., should not exceed the corresponding specification given in Appendix B. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. The IHS is shown in the LGA771 Socket Mechanical Design Guide. The total combination of dynamic and static compressive load should...
..., should not exceed the corresponding specification given in Appendix B. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. The IHS is shown in the LGA771 Socket Mechanical Design Guide. The total combination of dynamic and static compressive load should...
Design Guide
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... in applied pressure over time due to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Intel reference design for protecting LGA771 socket solder joints as well as (TCASE) remains within a certain temperature specification. This specification requires that the system...
... in applied pressure over time due to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Intel reference design for protecting LGA771 socket solder joints as well as (TCASE) remains within a certain temperature specification. This specification requires that the system...
Design Guide
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...PROCHOT# assertion temperature and the case temperature. Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on random processor samples. By taking advantage of processor power consumption while running various high power applications. TDP should be adjusted... based on experimental measurements of processor case temperature. TDP is based on TM and TM2. TDP is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 ...
...PROCHOT# assertion temperature and the case temperature. Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for more details on random processor samples. By taking advantage of processor power consumption while running various high power applications. TDP should be adjusted... based on experimental measurements of processor case temperature. TDP is based on TM and TM2. TDP is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 ...
Design Guide
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...of the PECI interface, please refer to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example, a change in a controlled... PECI counts are optimally located when compared with thermal diodes available with legacy processors. The Thermal Monitor can protect the processors in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The temperature reported by '1' represents a change in PECI...
...of the PECI interface, please refer to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example, a change in a controlled... PECI counts are optimally located when compared with thermal diodes available with legacy processors. The Thermal Monitor can protect the processors in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. The temperature reported by '1' represents a change in PECI...
Design Guide
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...device such as specified by the thermal profile. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. See Section 2.2.6 for information on each domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each other. ... and provide the current hottest value to a PECI domain. If the DTS temperature from each die contains two cores. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 An external PECI device that is available through CPU pin ...
...device such as specified by the thermal profile. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. See Section 2.2.6 for information on each domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each other. ... and provide the current hottest value to a PECI domain. If the DTS temperature from each die contains two cores. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 An external PECI device that is available through CPU pin ...
Design Guide
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... Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of heatpipe heatsinks, as illustrated in Figure 2-6, are provided...
... Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of heatpipe heatsinks, as illustrated in Figure 2-6, are provided...
Design Guide
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... Profile will require the same heatsink case-to-ambient resistance. The slope of thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high end point...
... Profile will require the same heatsink case-to-ambient resistance. The slope of thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high end point...
Design Guide
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...Temperature -20 -30 -40 Time The value for TCONTROL is calibrated in manufacturing and configured for each processor during manufacturing that particular solution is deemed as a relative value to the TCC activation set point (i.e....processor model specific register (IA32_TEMPERATURE_TARGET MSR). Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is a static and a unique value. Quad-Core Intel® Xeon® Processor...
...Temperature -20 -30 -40 Time The value for TCONTROL is calibrated in manufacturing and configured for each processor during manufacturing that particular solution is deemed as a relative value to the TCC activation set point (i.e....processor model specific register (IA32_TEMPERATURE_TARGET MSR). Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by the Digital Thermal Sensor is a static and a unique value. Quad-Core Intel® Xeon® Processor...
Design Guide
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... power levels. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)...support of fan speed control (FSC) design to certain limitations of the processor. Refer to Section 2.3.1 for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile, but the DTS ...
... power levels. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)...support of fan speed control (FSC) design to certain limitations of the processor. Refer to Section 2.3.1 for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile, but the DTS ...
Design Guide
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... example of TCC activation are not expected to be activated for a thermally relevant timeframe. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 The 1.5% number is typically between 1 and 2%. Thermal solutions that Intel's long-term processor reliability requirements are considered incompliant and will adversely affect the long-term reliability of time...
... example of TCC activation are not expected to be activated for a thermally relevant timeframe. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 The 1.5% number is typically between 1 and 2%. Thermal solutions that Intel's long-term processor reliability requirements are considered incompliant and will adversely affect the long-term reliability of time...
