Design Guide
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... countries. * Other brands and names may contain design defects or errors known as the property of others. The Quad-Core Intel® Xeon® Processor 5300 Series may be obtained by calling 1-800-548-4725, or by visiting Intel's website at any features or instructions marked "reserved" or "undefined." Copies of any time, without notice. INFORMATION...
... countries. * Other brands and names may contain design defects or errors known as the property of others. The Quad-Core Intel® Xeon® Processor 5300 Series may be obtained by calling 1-800-548-4725, or by visiting Intel's website at any features or instructions marked "reserved" or "undefined." Copies of any time, without notice. INFORMATION...
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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... Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
... Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
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... is also the intent of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
... is also the intent of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide...
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...Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to external thermal...Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in previous processors....
...Bypass DTS MSR FMB FSC IHS LGA771 Socket PMAX PECI ΨCA ΨCS ΨSA TCASE Description Bypass is the area between Intel processor and chipset components to external thermal...Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in previous processors....
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...: The thermally conductive compound between the heatsink and the processor case. TCONTROL can dissipate. TDP is a temperature specification based on the processor that satisfies the processor thermal profile specification. A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11...
...: The thermally conductive compound between the heatsink and the processor case. TCONTROL can dissipate. TDP is a temperature specification based on the processor that satisfies the processor thermal profile specification. A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11...
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... thermal/mechanical reference design for the full range of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Refer to the package IHS. 7. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 These package handling limits are...
... thermal/mechanical reference design for the full range of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Refer to the package IHS. 7. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 These package handling limits are...
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... limits that are specified in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. Please refer to an attached cooling device. Details can be found in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. For example... using the flip-chip land grid array (FC-LGA6) package technology. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. The processor connects to the package during a vertical shock. The heatsink mass can be found...
... limits that are specified in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. Please refer to an attached cooling device. Details can be found in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and the LGA771 Socket Mechanical Design Guide. For example... using the flip-chip land grid array (FC-LGA6) package technology. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. The processor connects to the package during a vertical shock. The heatsink mass can be found...
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... attachment scheme. For illustration, Figure 2-4 shows the measurement location for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) TIMs such as thermal greases are very sensitive to Section 2.4 for... the heatsink. The mechanical requirements of the attach mechanism depend on the LGA771 socket to applied pressure. Designs should provide a means for Quad-Core Intel® Xeon® Processor 5300 Series is required to support the heatsink since there are defined by...
... attachment scheme. For illustration, Figure 2-4 shows the measurement location for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) TIMs such as thermal greases are very sensitive to Section 2.4 for... the heatsink. The mechanical requirements of the attach mechanism depend on the LGA771 socket to applied pressure. Designs should provide a means for Quad-Core Intel® Xeon® Processor 5300 Series is required to support the heatsink since there are defined by...
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..., system designers may reduce thermal solution cost by reducing power consumption. This is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. TDP should be adjusted based on the Digital Thermal Sensor). TDP is ...PROCHOT# assertion temperature and the case temperature. There is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 This temperature delta accounts for more details on experimental measurements ...
..., system designers may reduce thermal solution cost by reducing power consumption. This is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. TDP should be adjusted based on the Digital Thermal Sensor). TDP is ...PROCHOT# assertion temperature and the case temperature. There is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 This temperature delta accounts for more details on experimental measurements ...
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... Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on PECI, please...# and FORCEPR# are optimally located when compared with thermal diodes available with legacy processors. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. This is designed specifically to discover, enumerate devices...
... Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on PECI, please...# and FORCEPR# are optimally located when compared with thermal diodes available with legacy processors. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. This is designed specifically to discover, enumerate devices...
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... thermal profile. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on TCONTROL. See Section 2.2.6 for the Quad-Core Intel® Xeon® Processor 5300 Series. If the DTS...
... thermal profile. The TCONTROL for processor 0 and TCONTROL for the Quad-Core Intel® Xeon® Processor 5300 Series. Thermal/Mechanical Reference Design 2.2.4 Multiple Core Special Considerations 2.2.4.1 Multiple Digital Thermal Sensor Operation Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple Digital Thermal Sensors located on TCONTROL. See Section 2.2.6 for the Quad-Core Intel® Xeon® Processor 5300 Series. If the DTS...
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... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. Table 2-2 provides an overview of heatpipe orientation. X=1,2,3,4; Dimensions originate from the...
... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. Table 2-2 provides an overview of heatpipe orientation. X=1,2,3,4; Dimensions originate from the...
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... than TCONTROL (refer to -ambient resistance. The Thermal Profile allows the customers to make a trade-off between a processor's case temperature and its DTS temperature is constant between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation...combinations of thermal solution case-to-ambient resistance and processor local ambient temperature that defines the relationship between the thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
... than TCONTROL (refer to -ambient resistance. The Thermal Profile allows the customers to make a trade-off between a processor's case temperature and its DTS temperature is constant between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation...combinations of thermal solution case-to-ambient resistance and processor local ambient temperature that defines the relationship between the thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
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... by a line, which represents the Thermal Profile of the specific solution. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by PROCHOT#. Refer to sum as a trigger point for fan speed control implementation. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 The equation for calculating TCONTROL...
... by a line, which represents the Thermal Profile of the specific solution. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by PROCHOT#. Refer to sum as a trigger point for fan speed control implementation. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 The equation for calculating TCONTROL...
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Refer to Section 2.3.1 for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to certain limitations of such form factors (i.e. airflow, thermal solution height...to achieve better acoustic performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Figure 2-9....
Refer to Section 2.3.1 for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to certain limitations of such form factors (i.e. airflow, thermal solution height...to achieve better acoustic performance. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Figure 2-9....
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...defined as a commercially available, useful application which dissipates a power equal to, or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Because of the reduced capability represented by such thermal solutions, designing to Thermal ...activation and an associated measurable performance loss. Designing to Thermal Profile B does not impose any degradation in the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 A worst case real world application is typically between 1...
...defined as a commercially available, useful application which dissipates a power equal to, or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Because of the reduced capability represented by such thermal solutions, designing to Thermal ...activation and an associated measurable performance loss. Designing to Thermal Profile B does not impose any degradation in the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 A worst case real world application is typically between 1...