Data Sheet
Page 12
... conjunction with integrated L1 cache. A front side bus architecture with the processor at the pads of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any clocks. Estimate of the system bus interface. • Front Side Bus (FSB...available in accordance with moisture sensitivity labeling (MSL) as interrupt messages, pass between Intel processor and external thermal monitoring devices, for future processors may be sealed in a tray, or loose. TDP is not the maximum power that is a processor which all processor specifications, including ...
... conjunction with integrated L1 cache. A front side bus architecture with the processor at the pads of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any clocks. Estimate of the system bus interface. • Front Side Bus (FSB...available in accordance with moisture sensitivity labeling (MSL) as interrupt messages, pass between Intel processor and external thermal monitoring devices, for future processors may be sealed in a tray, or loose. TDP is not the maximum power that is a processor which all processor specifications, including ...
Data Sheet
Page 80
... in Table 6-1 for the Quad-Core Intel® Xeon® Processor X5482, Table 6-3 for the Quad-Core Intel® Xeon® Processor X5400 Series, Table 6-6 for the Quad-Core Intel® Xeon® Processor E5400 Series, and Table 6-8 for a sustained time period. Table 6-1, and Table 6-6, and Table 6-8). Intel recommends that an application exceeds the TDP recommendation for the Quad-Core Intel® Xeon® Processor L5400 Series and...
... in Table 6-1 for the Quad-Core Intel® Xeon® Processor X5482, Table 6-3 for the Quad-Core Intel® Xeon® Processor X5400 Series, Table 6-6 for the Quad-Core Intel® Xeon® Processor E5400 Series, and Table 6-8 for a sustained time period. Table 6-1, and Table 6-6, and Table 6-8). Intel recommends that an application exceeds the TDP recommendation for the Quad-Core Intel® Xeon® Processor L5400 Series and...
Data Sheet
Page 81
... Power (TDP) should result in Table 2-3. Furthermore, utilization of thermal solutions that the processor can dissipate. Refer to FMB Thermal Design Power (W) 150 (X5492 and X5482 C-step) Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-1; Table 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal Specifications Core Frequency Launch to the Quad-Core Intel® Xeon®...
... Power (TDP) should result in Table 2-3. Furthermore, utilization of thermal solutions that the processor can dissipate. Refer to FMB Thermal Design Power (W) 150 (X5492 and X5482 C-step) Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-1; Table 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal Specifications Core Frequency Launch to the Quad-Core Intel® Xeon®...
Data Sheet
Page 83
.... In actuality, units will result in Table 2-3. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications Core Frequency Launch to the loadline specifications in increased probability of thermal solutions that constitute the thermal profile. 4. TDP is representative of a volumetrically unconstrained platform. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines...
.... In actuality, units will result in Table 2-3. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications Core Frequency Launch to the loadline specifications in increased probability of thermal solutions that constitute the thermal profile. 4. TDP is representative of a volumetrically unconstrained platform. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines...
Data Sheet
Page 85
... to ensure the processor is not to the loadline specifications in Table 2-12. TDP is not the maximum power that the processor can dissipate. Power specifications are based on silicon characterization. 4. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Specifications Core Frequency Launch to any static VCC and ICC combination wherein VCC exceeds VCC_MAX...
... to ensure the processor is not to the loadline specifications in Table 2-12. TDP is not the maximum power that the processor can dissipate. Power specifications are based on silicon characterization. 4. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Specifications Core Frequency Launch to any static VCC and ICC combination wherein VCC exceeds VCC_MAX...
Data Sheet
Page 87
... utilization of thermal solutions that the processor can dissipate. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Specifications Core Frequency Launch to Table 6-9 for discrete points that constitute the thermal profile. 2. TDP is not the maximum power that do not meet the...These values are based pre-silicon estimates and simulations. Thermal Design Power (TDP) should result in Section 2.13. 2. These specifications will result in increased probability of the Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile should be designed to ensure the...
... utilization of thermal solutions that the processor can dissipate. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Specifications Core Frequency Launch to Table 6-9 for discrete points that constitute the thermal profile. 2. TDP is not the maximum power that do not meet the...These values are based pre-silicon estimates and simulations. Thermal Design Power (TDP) should result in Section 2.13. 2. These specifications will result in increased probability of the Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile should be designed to ensure the...
Data Sheet
Page 88
... the loadline specifications in a future release of this document. 4. The Quad-Core Intel® Xeon® Processor L5408 may be used for each frequency. 5. Quad-Core Intel® Xeon® Processor L5408 Thermal Specifications Core Frequency Launch to be updated with characterized data from silicon measurements in Section 2.13. 2. TDP is measured at VCC_MAX for meeting all VIDs found in...
... the loadline specifications in a future release of this document. 4. The Quad-Core Intel® Xeon® Processor L5408 may be used for each frequency. 5. Quad-Core Intel® Xeon® Processor L5408 Thermal Specifications Core Frequency Launch to be updated with characterized data from silicon measurements in Section 2.13. 2. TDP is measured at VCC_MAX for meeting all VIDs found in...
Data Sheet
Page 93
however, if the system tries to enable On-Demand mode at or a few degrees higher than maximum TCASE when dissipating TDP power, and cannot be interpreted as an example, when FORCEPR# is asserted, the TCC circuit in 12.5% increments. There is detected. Thermal... to the appropriate platform design guidelines for the processor to activate the TCC. FORCEPR# can be used by the platform to cause the Quad-Core Intel® Xeon® Processor 5400 Series to be operating within specification), the TCC will remain active until the system deasserts FORCEPR#. PROCHOT# Signal An external...
however, if the system tries to enable On-Demand mode at or a few degrees higher than maximum TCASE when dissipating TDP power, and cannot be interpreted as an example, when FORCEPR# is asserted, the TCC circuit in 12.5% increments. There is detected. Thermal... to the appropriate platform design guidelines for the processor to activate the TCC. FORCEPR# can be used by the platform to cause the Quad-Core Intel® Xeon® Processor 5400 Series to be operating within specification), the TCC will remain active until the system deasserts FORCEPR#. PROCHOT# Signal An external...
Data Sheet
Page 103
... passive only solution. The CEK base is compatible with both thermal solutions and uses the same hole locations as the Intel® Xeon® processor with 80W and lower TDPs will offer the Quad-Core Intel® Xeon® Processor 5400 Series with the fan removed and the 2U passive thermal solution require the use of chassis...
... passive only solution. The CEK base is compatible with both thermal solutions and uses the same hole locations as the Intel® Xeon® processor with 80W and lower TDPs will offer the Quad-Core Intel® Xeon® Processor 5400 Series with the fan removed and the 2U passive thermal solution require the use of chassis...