Product Specification
Page 12
... Memory Chipset Audio ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) • Intel® Core™2 Extreme Processor in an LGA775 socket with a 1066 MHz system bus • Intel® Core™...Intel® 975X Chipset, consisting of the board. Intel Desktop Board D975XBX2 Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of : • Intel® 82975X Memory Controller Hub (MCH) • Intel® 82801GR I/O Controller Hub (ICH7-R) or Intel® 82801GH I/O Controller Hub (ICH7-DH) Intel...
... Memory Chipset Audio ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) • Intel® Core™2 Extreme Processor in an LGA775 socket with a 1066 MHz system bus • Intel® Core™...Intel® 975X Chipset, consisting of the board. Intel Desktop Board D975XBX2 Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of : • Intel® 82975X Memory Controller Hub (MCH) • Intel® 82801GR I/O Controller Hub (ICH7-R) or Intel® 82801GH I/O Controller Hub (ICH7-DH) Intel...
Product Specification
Page 71
Location of the I/O connectors and mounting holes are in inches [millimeters]. Board Dimensions 71 Dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Figure 25. The outer dimensions are given in compliance with the ATX specification. Technical Reference 2.9 Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 25 illustrates the mechanical form factor for the board.
Location of the I/O connectors and mounting holes are in inches [millimeters]. Board Dimensions 71 Dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]. Figure 25. The outer dimensions are given in compliance with the ATX specification. Technical Reference 2.9 Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 25 illustrates the mechanical form factor for the board.
Product Specification
Page 72
... ±0.02 inches. I/O shields compliant with the ATX chassis specification are described in this board need the back panel I/O shield to pass certification testing. I/O Shield Dimensions for the board must meet specific dimension and material requirements. Intel Desktop Board D975XBX2 Technical Product Specification 2.9.2 I/O Shield The back panel I/O shield for Boards with the 8-Channel (7.1) Audio Subsystem 72 Additional design...
... ±0.02 inches. I/O shields compliant with the ATX chassis specification are described in this board need the back panel I/O shield to pass certification testing. I/O Shield Dimensions for the board must meet specific dimension and material requirements. Intel Desktop Board D975XBX2 Technical Product Specification 2.9.2 I/O Shield The back panel I/O shield for Boards with the 8-Channel (7.1) Audio Subsystem 72 Additional design...
Product Specification
Page 75
... of providing adequate +5 V standby current. Additional power required will halt fan operation. The power supply must comply with the board. Connecting the processor fan to a chassis fan header may result in the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails • The current capability of standby...
... of providing adequate +5 V standby current. Additional power required will halt fan operation. The power supply must comply with the board. Connecting the processor fan to a chassis fan header may result in the ATX form factor specification. • The potential relation between 3.3 VDC and +5 VDC power rails • The current capability of standby...