Data Sheet
Page 10
...Operation - The processor (in a Flip-Chip Land Grid Array (FC-LGA) package, consisting of the new DDR memory standard that is being developed as executable or non-executable, when combined with an integrated heat spreader (IHS). • LGA1366 Socket - If...up to -point link based electrical interconnect specification for clarification: • Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series - The entire product, including processor substrate and integrated heat spreader (IHS). • 1366-land LGA ...
...Operation - The processor (in a Flip-Chip Land Grid Array (FC-LGA) package, consisting of the new DDR memory standard that is being developed as executable or non-executable, when combined with an integrated heat spreader (IHS). • LGA1366 Socket - If...up to -point link based electrical interconnect specification for clarification: • Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series - The entire product, including processor substrate and integrated heat spreader (IHS). • 1366-land LGA ...
Data Sheet
Page 11
... system. References Document Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Specification Update Intel® Core™ i7-900 Desktop Processor Extreme Edition and Intel® Core™ i7-900 Desktop Processor Series Datasheet Volume 2 Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series and LGA1366 Socket Thermal and Mechanical...
... system. References Document Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Specification Update Intel® Core™ i7-900 Desktop Processor Extreme Edition and Intel® Core™ i7-900 Desktop Processor Series Datasheet Volume 2 Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series and LGA1366 Socket Thermal and Mechanical...
Data Sheet
Page 14
...-on front side bus architecture, there is configured during manufacturing. The processor's maximum non-turbo core frequency is no direct link between core frequency and Intel QPI link frequency (such as defined in timing violations or reduced lifetime...core multiplier at the same core frequency may be delivered to Table 2-7 for these signals. Electrical Specifications 2.3.1 2.4 2.4.1 2.5 ensure that the voltage provided to the LGA1366 socket. Failure to Table 2-15 for the DC specifications for DC specifications. Processor Clocking (BCLK_DP, BCLK_DN) The processor core, Intel...
...-on front side bus architecture, there is configured during manufacturing. The processor's maximum non-turbo core frequency is no direct link between core frequency and Intel QPI link frequency (such as defined in timing violations or reduced lifetime...core multiplier at the same core frequency may be delivered to Table 2-7 for these signals. Electrical Specifications 2.3.1 2.4 2.4.1 2.5 ensure that the voltage provided to the LGA1366 socket. Failure to Table 2-15 for the DC specifications for DC specifications. Processor Clocking (BCLK_DP, BCLK_DN) The processor core, Intel...
Data Sheet
Page 31
... are included for reference and are in mm. • Guidelines on potential IHS flatness variation with the motherboard using an LGA1366 socket. The drawings include dimensions necessary to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Package Mechanical Specifications 3 Package Mechanical Specifications The...
... are included for reference and are in mm. • Guidelines on potential IHS flatness variation with the motherboard using an LGA1366 socket. The drawings include dimensions necessary to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Package Mechanical Specifications 3 Package Mechanical Specifications The...
Data Sheet
Page 34
...mechanical solution design must not intrude into and removed from an LGA1366 socket 15 times. Table 3-1. Loading limits are based on the processor IHS relative to uniform compressive loading in the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) 34 Datasheet... shipping conditions, or standard use condition. The processor package substrate should not exceed the maximum limits. These specifications apply to a fixed substrate. These mechanical maximum load limits should meet the LGA1366 requirements detailed in a direction normal to either the...
...mechanical solution design must not intrude into and removed from an LGA1366 socket 15 times. Table 3-1. Loading limits are based on the processor IHS relative to uniform compressive loading in the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) 34 Datasheet... shipping conditions, or standard use condition. The processor package substrate should not exceed the maximum limits. These specifications apply to a fixed substrate. These mechanical maximum load limits should meet the LGA1366 requirements detailed in a direction normal to either the...