Product Specification
Page 9
...Connector LED Locations 29 6. Thermal Sensors and Fan Headers 31 7. Connection Diagram for Front Panel USB 2.0 Headers 51 13. Localized High Temperature Zones 57 Tables 1. Components Shown in Figure 1 14 3. Wake-up Devices and Events 34 ix Location of the Jumper Block 52 ...Component-side Connectors and Headers 43 11. Location of the Standby Power LED 38 8. Audio Jack Support 26 7. Block Diagram 15 3. Board Dimensions 54 15. Supported Memory Configurations 18 4. Back Panel Connectors 42 10. HDMI Port Status Conditions 22 5. DVI Port Status Conditions 22...
...Connector LED Locations 29 6. Thermal Sensors and Fan Headers 31 7. Connection Diagram for Front Panel USB 2.0 Headers 51 13. Localized High Temperature Zones 57 Tables 1. Components Shown in Figure 1 14 3. Wake-up Devices and Events 34 ix Location of the Jumper Block 52 ...Component-side Connectors and Headers 43 11. Location of the Standby Power LED 38 8. Audio Jack Support 26 7. Block Diagram 15 3. Board Dimensions 54 15. Supported Memory Configurations 18 4. Back Panel Connectors 42 10. HDMI Port Status Conditions 22 5. DVI Port Status Conditions 22...
Product Specification
Page 30
...Intrusion and Detection The board supports a chassis security feature that attaches to the chassis intrusion header. Intel Desktop Board DH67CL Technical Product Specification 1.13 Hardware Management Subsystem The hardware management features enable the board to be implemented using Intel® Desktop Utilities or... When the chassis cover is removed, the mechanical switch is removed. The board has several hardware management features, including the following : • Processor and system ambient temperature monitoring • Chassis fan speed monitoring • Power monitoring of the...
...Intrusion and Detection The board supports a chassis security feature that attaches to the chassis intrusion header. Intel Desktop Board DH67CL Technical Product Specification 1.13 Hardware Management Subsystem The hardware management features enable the board to be implemented using Intel® Desktop Utilities or... When the chassis cover is removed, the mechanical switch is removed. The board has several hardware management features, including the following : • Processor and system ambient temperature monitoring • Chassis fan speed monitoring • Power monitoring of the...
Product Specification
Page 56
... with a maximum internal ambient temperature of current for each add-in some instances, damage to the following the instructions presented in this document will halt fan operation. Table 31 lists the current capability of any thermal or system design remains solely with adequate thermal performance. 56 Intel Desktop Board DH67CL Technical Product Specification 2.5.2 Fan...
... with a maximum internal ambient temperature of current for each add-in some instances, damage to the following the instructions presented in this document will halt fan operation. Table 31 lists the current capability of any thermal or system design remains solely with adequate thermal performance. 56 Intel Desktop Board DH67CL Technical Product Specification 2.5.2 Fan...
Product Specification
Page 57
... the processor voltage regulator circuit. Item A B C Description Processor voltage regulator area Processor Intel H67 Express Chipset Figure 15. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Localized High Temperature Zones 57 For information about the maximum operating temperature, see the environmental specifications in an open chassis. Figure 15 shows the...
... the processor voltage regulator circuit. Item A B C Description Processor voltage regulator area Processor Intel H67 Express Chipset Figure 15. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Localized High Temperature Zones 57 For information about the maximum operating temperature, see the environmental specifications in an open chassis. Figure 15 shows the...
Product Specification
Page 58
... (TDP is specified as the maximum sustainable power to thermal changes. Maximum case temperatures are sensitive to be below the maximum temperature listed in Table 32. Intel Desktop Board DH67CL Technical Product Specification Table 32 provides maximum case temperatures for the components that the temperature measurement in the system BIOS is a value reported by the components). When...
... (TDP is specified as the maximum sustainable power to thermal changes. Maximum case temperatures are sensitive to be below the maximum temperature listed in Table 32. Intel Desktop Board DH67CL Technical Product Specification Table 32 provides maximum case temperatures for the components that the temperature measurement in the system BIOS is a value reported by the components). When...
Product Specification
Page 59
The MTBF data is 244,980 hours. 2.8 Environmental Table 34 lists the environmental specifications for the board. The MTBF for the board is calculated from predicted data at 55 ºC. Technical Reference 2.7 Reliability The Mean Time Between ...50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to estimate repair rates...
The MTBF data is 244,980 hours. 2.8 Environmental Table 34 lists the environmental specifications for the board. The MTBF for the board is calculated from predicted data at 55 ºC. Technical Reference 2.7 Reliability The Mean Time Between ...50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to estimate repair rates...