Product Specification
Page 7
... DIMMs 20 9. Board Dimensions...57 23. LAN Connector LED Locations 28 12. Detailed System Memory Address Map 40 16. Component-side Connectors 48 18. Processor Heatsink for Front Panel Connector 53 19. Power States and Targeted System Power 33 9. Location of Pressing the Power Switch 32 8. Connection Diagram for Omni-directional...
... DIMMs 20 9. Board Dimensions...57 23. LAN Connector LED Locations 28 12. Detailed System Memory Address Map 40 16. Component-side Connectors 48 18. Processor Heatsink for Front Panel Connector 53 19. Power States and Targeted System Power 33 9. Location of Pressing the Power Switch 32 8. Connection Diagram for Omni-directional...
Product Specification
Page 61
... in Section 2.14. 61 Processor Heatsink for determining the adequacy of any thermal or system design remains solely with the reader. Failure to do so could cause components to exceed their maximum case temperature and malfunction. Intel makes no warranties or representations that ... to ensure appropriate airflow may result in reduced performance of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that the ambient temperature does not exceed the board's maximum operating temperature. Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a...
... in Section 2.14. 61 Processor Heatsink for determining the adequacy of any thermal or system design remains solely with the reader. Failure to do so could cause components to exceed their maximum case temperature and malfunction. Intel makes no warranties or representations that ... to ensure appropriate airflow may result in reduced performance of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that the ambient temperature does not exceed the board's maximum operating temperature. Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a...
Product Specification
Page 63
... see processor datasheets and processor specification updates 103 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to thermal changes. The MTBF data is based on the... to cool the board. The operating temperature, current load, or operating frequency could affect case temperatures. The MTBF for the D945PAW board is calculated using component and subassembly random failure rates. Maximum case temperatures are sensitive to Section 1.3, page 15 2.13 ...
... see processor datasheets and processor specification updates 103 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to thermal changes. The MTBF data is based on the... to cool the board. The operating temperature, current load, or operating frequency could affect case temperatures. The MTBF for the D945PAW board is calculated using component and subassembly random failure rates. Maximum case temperatures are sensitive to Section 1.3, page 15 2.13 ...