User Manual
Page 10
...or immerse into the beam, do not view directly with the same module type made by the same manufacturer. Laser radiation when open. viii IBM System x3850 Type 8864: User's Guide v Use of controls or adjustments or performance of procedures other than 100°C (212°F) v Repair or disassemble Dispose ... a lithium battery, replace it only with optical instruments, and avoid direct exposure to the beam. Do not stare into water v Heat to hazardous laser radiation. The battery contains lithium and can explode if not properly used, handled, or disposed of the laser product ...
...or immerse into the beam, do not view directly with the same module type made by the same manufacturer. Laser radiation when open. viii IBM System x3850 Type 8864: User's Guide v Use of controls or adjustments or performance of procedures other than 100°C (212°F) v Repair or disassemble Dispose ... a lithium battery, replace it only with optical instruments, and avoid direct exposure to the beam. Do not stare into water v Heat to hazardous laser radiation. The battery contains lithium and can explode if not properly used, handled, or disposed of the laser product ...
User Manual
Page 15
... 10° to 32°C (50° to 90°F); The System x3850 server 3 A 1-U-high device is 4.45 cm (1.75 inches) tall. Power consumption and heat output vary depending on front of the server. Server off: 8% to 95...°F); One on the number and type of server - Chapter 1. Server on rear of optional features installed and the power-management optional features in accordance with integrated memory and I/O controller - Minimum: 200 V ac Integrated functions: v Baseboard management controller v IBM...
... 10° to 32°C (50° to 90°F); The System x3850 server 3 A 1-U-high device is 4.45 cm (1.75 inches) tall. Power consumption and heat output vary depending on front of the server. Server off: 8% to 95...°F); One on the number and type of server - Chapter 1. Server on rear of optional features installed and the power-management optional features in accordance with integrated memory and I/O controller - Minimum: 200 V ac Integrated functions: v Baseboard management controller v IBM...
User Manual
Page 27
... panel Memory card Hot-swap fans 92 mm Hot-swap fans 80 mm Hot-swap hard disk drive Air baffle Microprocessor baffle Heat sink FRONT Microprocessor PCI divider I/O board Hot-swap power supply PCI slots CD-ROM drive Operator information panel VRM Microprocessor tray ...xSerier 365 Bezel © Copyright IBM Corp. 2006 15 Server components The following illustration shows the major components in the server. Installing options This chapter provides detailed instructions...
... panel Memory card Hot-swap fans 92 mm Hot-swap fans 80 mm Hot-swap hard disk drive Air baffle Microprocessor baffle Heat sink FRONT Microprocessor PCI divider I/O board Hot-swap power supply PCI slots CD-ROM drive Operator information panel VRM Microprocessor tray ...xSerier 365 Bezel © Copyright IBM Corp. 2006 15 Server components The following illustration shows the major components in the server. Installing options This chapter provides detailed instructions...
User Manual
Page 33
... the cover is removed. Leave approximately 50 mm (2 in front of removal. Operating the server for the server, see http://www.ibm.com/ servers/eserver/serverproven/compat/us/. v You have replaced a failed fan as soon as possible. Operating the server without the air...v Microprocessor sockets 2 through 4 always contain either a microprocessor baffle or a microprocessor and heat sink. To avoid this potential problem, always use an electrostatic-discharge wrist strap or other grounding system when working inside the server with the power on Attention: Static electricity that come with the...
... the cover is removed. Leave approximately 50 mm (2 in front of removal. Operating the server for the server, see http://www.ibm.com/ servers/eserver/serverproven/compat/us/. v You have replaced a failed fan as soon as possible. Operating the server without the air...v Microprocessor sockets 2 through 4 always contain either a microprocessor baffle or a microprocessor and heat sink. To avoid this potential problem, always use an electrostatic-discharge wrist strap or other grounding system when working inside the server with the power on Attention: Static electricity that come with the...
User Manual
Page 34
... static-sensitive devices Attention: Static electricity can damage the server and other grounding system when working inside the server with the power on the outside of a grounding system is available. This drains static electricity from the package and from the server.... from electrostatic discharge, observe the following steps: 1. If it directly into place. 22 IBM System x3850 Type 8864: User's Guide v Take additional care when handling devices during cold weather. Heating reduces indoor humidity and increases static electricity. If you are installing or replacing a non-...
... static-sensitive devices Attention: Static electricity can damage the server and other grounding system when working inside the server with the power on the outside of a grounding system is available. This drains static electricity from the package and from the server.... from electrostatic discharge, observe the following steps: 1. If it directly into place. 22 IBM System x3850 Type 8864: User's Guide v Take additional care when handling devices during cold weather. Heating reduces indoor humidity and increases static electricity. If you are installing or replacing a non-...
User Manual
Page 57
Air baffle Heat sink FRONT Microprocessor FRONT FRONT FRONT Microprocessor baffle VRM 4 Note: The new microprocessor comes in a kit with a microprocessor that is installed in socket 3 or 4. 4. Lift ... a microprocessor socket and store it for future use. 6. Lift the air baffle out of the microprocessor socket, if any is used only with a VRM and a heat sink. These sockets are mounted on the microprocessor board with the microprocessor-release lever on the microprocessor board. The VRM is present. 7.
Air baffle Heat sink FRONT Microprocessor FRONT FRONT FRONT Microprocessor baffle VRM 4 Note: The new microprocessor comes in a kit with a microprocessor that is installed in socket 3 or 4. 4. Lift ... a microprocessor socket and store it for future use. 6. Lift the air baffle out of the microprocessor socket, if any is used only with a VRM and a heat sink. These sockets are mounted on the microprocessor board with the microprocessor-release lever on the microprocessor board. The VRM is present. 7.
User Manual
Page 58
...on the microprocessor, do so now; Microprocessor Microprocessor orientation indicator Microprocessor connector Microprocessorrelease lever 10. then, press the heat sink into the socket. d. Reinstall the fans and memory cards in the server. b. then, remove the ...heat sink above the microprocessor; If you have other options to install, do so now by repeating steps 5 through 13. 15. Make sure that they are securely latched. then, push the microprocessor tray into the socket 9. c. otherwise, go to complete the installation: 46 IBM System x3850 Type 8864...
...on the microprocessor, do so now; Microprocessor Microprocessor orientation indicator Microprocessor connector Microprocessorrelease lever 10. then, press the heat sink into the socket. d. Reinstall the fans and memory cards in the server. b. then, remove the ...heat sink above the microprocessor; If you have other options to install, do so now by repeating steps 5 through 13. 15. Make sure that they are securely latched. then, push the microprocessor tray into the socket 9. c. otherwise, go to complete the installation: 46 IBM System x3850 Type 8864...
Service Guide
Page 14
..., note the following . Do not stare into water v Heat to more than those specified herein might result in exposure to the beam. Laser radiation when open. DANGER Some laser products contain an embedded Class 3A or Class 3B laser diode. xii IBM System x3850 Type 8864: Problem Determination and Service Guide The battery contains lithium...
..., note the following . Do not stare into water v Heat to more than those specified herein might result in exposure to the beam. Laser radiation when open. DANGER Some laser products contain an embedded Class 3A or Class 3B laser diode. xii IBM System x3850 Type 8864: Problem Determination and Service Guide The battery contains lithium...
Service Guide
Page 19
...x8 hot-plug slots v Two PCI-X 2.0 hot-plug 266 MHz/64-bit slots Upgradeable microcode: System BIOS, diagnostics, service processor, BMC, and SAS microcode Power supply: v Standard: One dual-rated ...-60 Hz) required v Input voltage high range: - Minimum: 0.08 kVA - Chapter 1. Power consumption and heat output vary depending on : - 10° to 35°C (50° to as a unit, or...914 m to 80% - Minimum: 200 V ac Integrated functions: v Baseboard management controller v IBM EXA-32 Chipset with ISO v Serial connector 9296. These levels were measured in vertical increments ...
...x8 hot-plug slots v Two PCI-X 2.0 hot-plug 266 MHz/64-bit slots Upgradeable microcode: System BIOS, diagnostics, service processor, BMC, and SAS microcode Power supply: v Standard: One dual-rated ...-60 Hz) required v Input voltage high range: - Minimum: 0.08 kVA - Chapter 1. Power consumption and heat output vary depending on : - 10° to 35°C (50° to as a unit, or...914 m to 80% - Minimum: 200 V ac Integrated functions: v Baseboard management controller v IBM EXA-32 Chipset with ISO v Serial connector 9296. These levels were measured in vertical increments ...
Service Guide
Page 40
... (model 4Rx) 14 Microprocessor, 3.5 GHZ (model 5Rx) 42D3363 43W9473 15 Heat sink (all models) 16 Microprocessor baffle (all models) 26K8805 26K9020 17 Hard disk drive filler (all models) 26K8680 24 IBM System x3850 Type 8864: Problem Determination and Service Guide Warranty Information"), which is in the IBM "Statement of Limited Warranty" (at "Part 3 - Table 3. Tier 1 CRUs...
... (model 4Rx) 14 Microprocessor, 3.5 GHZ (model 5Rx) 42D3363 43W9473 15 Heat sink (all models) 16 Microprocessor baffle (all models) 26K8805 26K9020 17 Hard disk drive filler (all models) 26K8680 24 IBM System x3850 Type 8864: Problem Determination and Service Guide Warranty Information"), which is in the IBM "Statement of Limited Warranty" (at "Part 3 - Table 3. Tier 1 CRUs...
Service Guide
Page 46
...server is powered-on . v Microprocessor socket 2 always contains either a microprocessor baffle or a microprocessor and heat sink. Operating the server for the server, monitor, and other grounding system when working on the server. v You have replaced a failed fan as soon as possible. v ... or install the component. v Blue on . 30 IBM System x3850 Type 8864: Problem Determination and Service Guide To avoid straining the muscles in front of the server. System reliability guidelines To help ensure proper cooling and system reliability, make changes to install or replace hot-swap ...
...server is powered-on . v Microprocessor socket 2 always contains either a microprocessor baffle or a microprocessor and heat sink. Operating the server for the server, monitor, and other grounding system when working on the server. v You have replaced a failed fan as soon as possible. v ... or install the component. v Blue on . 30 IBM System x3850 Type 8864: Problem Determination and Service Guide To avoid straining the muscles in front of the server. System reliability guidelines To help ensure proper cooling and system reliability, make changes to install or replace hot-swap ...
Service Guide
Page 47
.... Do not place the device on the server cover or on and the cover is removed. Heating reduces indoor humidity and increases static electricity. To reduce the possibility of a grounding system is available. v Handle the device carefully, holding it by its edges or its static-protective ...can cause static electricity to build up around you are instructed to hang inside the server. Movement can damage the server and other grounding system when working inside the server; Returning a device or component If you work inside a server that are working inside the server. v ...
.... Do not place the device on the server cover or on and the cover is removed. Heating reduces indoor humidity and increases static electricity. To reduce the possibility of a grounding system is available. v Handle the device carefully, holding it by its edges or its static-protective ...can cause static electricity to build up around you are instructed to hang inside the server. Movement can damage the server and other grounding system when working inside the server; Returning a device or component If you work inside a server that are working inside the server. v ...
Service Guide
Page 49
Do not: v Throw or immerse into water v Heat to replace the device. 3. Read the safety information that the battery clip holds the battery securely. 7. b. Reconnect the external cables; If your system has a module containing a lithium battery, replace it clicks into the socket until it ...the manufacturer. Removing and replacing server components 33 Press the battery into place. CAUTION: When replacing the lithium battery, use only IBM Part Number 33F8354 or an equivalent type battery recommended by local ordinances or regulations. Reinstall the server cover. 9. Remove the ...
Do not: v Throw or immerse into water v Heat to replace the device. 3. Read the safety information that the battery clip holds the battery securely. 7. b. Reconnect the external cables; If your system has a module containing a lithium battery, replace it clicks into the socket until it ...the manufacturer. Removing and replacing server components 33 Press the battery into place. CAUTION: When replacing the lithium battery, use only IBM Part Number 33F8354 or an equivalent type battery recommended by local ordinances or regulations. Reinstall the server cover. 9. Remove the ...
Service Guide
Page 72
...Lift the microprocessor-tray release latch. 7. Open the microprocessor-release lever and remove the microprocessor from the microprocessor socket. 56 IBM System x3850 Type 8864: Problem Determination and Service Guide Remove all external cables necessary to grasp the body of the tray, before pulling out the ...10. Attention: The microprocessor tray is heavy. then, pull the tray out the rest of the microprocessor tray. 11. Air baffle Heat sink FRONT Microprocessor FRONT FRONT FRONT Microprocessor baffle VRM 4 1. Read the safety information that begins on page vii, and "Handling ...
...Lift the microprocessor-tray release latch. 7. Open the microprocessor-release lever and remove the microprocessor from the microprocessor socket. 56 IBM System x3850 Type 8864: Problem Determination and Service Guide Remove all external cables necessary to grasp the body of the tray, before pulling out the ...10. Attention: The microprocessor tray is heavy. then, pull the tray out the rest of the microprocessor tray. 11. Air baffle Heat sink FRONT Microprocessor FRONT FRONT FRONT Microprocessor baffle VRM 4 1. Read the safety information that begins on page vii, and "Handling ...
Service Guide
Page 73
...microprocessor in the following steps: 1. Microprocessor Microprocessor orientation indicator Microprocessor connector Microprocessorrelease lever 3. If you are reinstalling a heat sink that the heat-sink retaining clip is seated in the connector. If necessary, remove the cover from the bottom of the VRM ...the microprocessor, do not use excessive force when pressing it into the connector by applying pressure on both ends of the heat sink. Make sure that was previously removed, go to secure the microprocessor. 4. To install a microprocessor tray and a...
...microprocessor in the following steps: 1. Microprocessor Microprocessor orientation indicator Microprocessor connector Microprocessorrelease lever 3. If you are reinstalling a heat sink that the heat-sink retaining clip is seated in the connector. If necessary, remove the cover from the bottom of the VRM ...the microprocessor, do not use excessive force when pressing it into the connector by applying pressure on both ends of the heat sink. Make sure that was previously removed, go to secure the microprocessor. 4. To install a microprocessor tray and a...
Service Guide
Page 74
...microprocessor-tray release latch is open; Reconnect external cables and power cords. Thermal grease The thermal grease must be replaced whenever the heat sink has been removed from the bottom of the microprocessor and is removed. Use the cleaning pad to wipe the thermal grease ... the microprocessor-tray release latch. Use a clean area of the thermal grease is one tick mark on page 55. 58 IBM System x3850 Type 8864: Problem Determination and Service Guide Reinstall the fans and memory cards in the server: a. b. Remove the cleaning pad from the microprocessor; 9.
...microprocessor-tray release latch is open; Reconnect external cables and power cords. Thermal grease The thermal grease must be replaced whenever the heat sink has been removed from the bottom of the microprocessor and is removed. Use the cleaning pad to wipe the thermal grease ... the microprocessor-tray release latch. Use a clean area of the thermal grease is one tick mark on page 55. 58 IBM System x3850 Type 8864: Problem Determination and Service Guide Reinstall the fans and memory cards in the server: a. b. Remove the cleaning pad from the microprocessor; 9.
Service Guide
Page 150
... microprocessors. 2. CPU non-critical over temperature fault 1. Make sure that the room temperature is solved. Replace fan X. 134 IBM System x3850 Type 8864: Problem Determination and Service Guide Make sure that nothing is correctly seated. 3. CPU X Over Temperature 1. Ethernet Data Rate ...unsupported by a trained service technician. CPU nn, where nn is preceded by "(Trained service technician only)", that the microprocessor heat sinks are field replaceable units (FRU). Make sure that step must be performed only by VRM. if the message persists:...
... microprocessors. 2. CPU non-critical over temperature fault 1. Make sure that the room temperature is solved. Replace fan X. 134 IBM System x3850 Type 8864: Problem Determination and Service Guide Make sure that nothing is correctly seated. 3. CPU X Over Temperature 1. Ethernet Data Rate ...unsupported by a trained service technician. CPU nn, where nn is preceded by "(Trained service technician only)", that the microprocessor heat sinks are field replaceable units (FRU). Make sure that step must be performed only by VRM. if the message persists:...