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... are only for use in development, that have no responsibility whatsoever for use by Intel to function as the property of any time, without notice. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number...: 323107-002US Intel products are not intended for conflicts or incompatibilities arising from published specifications. The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known...
... are only for use in development, that have no responsibility whatsoever for use by Intel to function as the property of any time, without notice. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2 August 2010 Order Number...: 323107-002US Intel products are not intended for conflicts or incompatibilities arising from published specifications. The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known...
Design Guide
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... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
... 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 6 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 3
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... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
... 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket...
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... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
... Evaluation Methodology 35 6-1 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon® Processor LC3518 Thermal Profile 46...
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... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
... 6-12 Intel® Xeon® Processor LC3528 Thermal Profile 45 6-13 Intel® Xeon® Processor LC3518 Thermal Specifications 45 6-14 Intel® Xeon® Processor LC3518 Thermal Profile 46 6-15 GetTemp0() Error Codes 53 7-1 Boundary Conditions and Performance Targets 54 7-2 Fan Speed Control, TCONTROL and DTS Relationship 61 7-3 TCONTROL Guidance 62 8-1 Server Use Conditions Environment (System Level 66 8-2 Server...
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Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
Revision History Revision Number 002 001 Description Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 7
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... assist board and system thermal mechanical designers. • To assist designers and suppliers of processor heatsinks. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 8 Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up Heatsink Socket and ILM Back Plate The goals of...
... assist board and system thermal mechanical designers. • To assist designers and suppliers of processor heatsinks. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 8 Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up Heatsink Socket and ILM Back Plate The goals of...
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... Documents Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay...Total Package Power. The case temperature of heatsink thermal performance using total package power. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107-002US
... Documents Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay...Total Package Power. The case temperature of heatsink thermal performance using total package power. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107-002US
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... temperature is not the maximum power that defines case temperature specification of the heat from the processor case to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 Tcontrol is a static value below...
... temperature is not the maximum power that defines case temperature specification of the heat from the processor case to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 Tcontrol is a static value below...
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... Note: 1. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 11 An integrated heat spreader (IHS) is packaged in Figure 2-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure...
... Note: 1. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 11 An integrated heat spreader (IHS) is packaged in Figure 2-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure...
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Reference datums 6. All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107-002US Top-side and back-side component keep-out ... Figure 2-3. IHS parallelism and tilt 3. Package reference with tolerances (total height, length, width, etc.) 2. The drawings include dimensions necessary to design a thermal solution for the processor. Land dimensions 4. These dimensions include: 1.
Reference datums 6. All drawing dimensions are shown in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107-002US Top-side and back-side component keep-out ... Figure 2-3. IHS parallelism and tilt 3. Package reference with tolerances (total height, length, width, etc.) 2. The drawings include dimensions necessary to design a thermal solution for the processor. Land dimensions 4. These dimensions include: 1.
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...IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. BOX 58119 SANTA CLARA, CA 95052-8119 EMTS DRAWING SIZE DRAWING NUMBER A1 D76126 REV A 7 SCALE: 2:1 DO ...203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. Processor Package Drawing (Sheet 1 of 2) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7 6 THIS DRAWING CONTAINS...
...IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. BOX 58119 SANTA CLARA, CA 95052-8119 EMTS DRAWING SIZE DRAWING NUMBER A1 D76126 REV A 7 SCALE: 2:1 DO ...203 C B F4 0.203 IHS LID 0.05 0.203 C F2 0.02 A DETAIL C SCALE 20:1 A 8 7 6 5 4 3 2 DWG. Processor Package Drawing (Sheet 1 of 2) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7 6 THIS DRAWING CONTAINS...
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...SCALE DRAWING SHEET 2 OF 2 4 3 2 1 Package Mechanical Specifications Figure 2-3. P.O. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. H G F 4X SURFACE TEST PAD AREA E D M C B J A 2X 39 2X 36...DWG. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. Processor Package Drawing (Sheet 2 of 2)
...SCALE DRAWING SHEET 2 OF 2 4 3 2 1 Package Mechanical Specifications Figure 2-3. P.O. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. H G F 4X SURFACE TEST PAD AREA E D M C B J A 2X 39 2X 36...DWG. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. Processor Package Drawing (Sheet 2 of 2)
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...contact the Test Pad Area with conductive material. Decoupling capacitors are for the package constrained by the heatsink and Independent Loading Mechanism (ILM). 3. Processor Loading Specifications Parameter Static Compressive Load Dynamic Compressive Load Maximum 890 N [200 lbf] 1779 N [400 lbf] [max static compressive + dynamic ... 5. The socket should not be experienced during heatsink removal. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 These maximum limits should meet the LGA1366...
...contact the Test Pad Area with conductive material. Decoupling capacitors are for the package constrained by the heatsink and Independent Loading Mechanism (ILM). 3. Processor Loading Specifications Parameter Static Compressive Load Dynamic Compressive Load Maximum 890 N [200 lbf] 1779 N [400 lbf] [max static compressive + dynamic ... 5. The socket should not be experienced during heatsink removal. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 These maximum limits should meet the LGA1366...
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... QDF ES XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US
... QDF ES XXXXX FORECAST-NAME {FPO} {e4} G2L1 G2L2 G3L1 G3L2 Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US
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Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5 shows the bottom view of the processor land coordinates. The coordinates are referred to throughout the document to identify processor lands. Package Mechanical Specifications 2.1.9 Processor Land Coordinates .
Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17 Figure 2-5 shows the bottom view of the processor land coordinates. The coordinates are referred to throughout the document to identify processor lands. Package Mechanical Specifications 2.1.9 Processor Land Coordinates .
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... 41 grid array with 21 x 17 grid depopulation in the center of the socket with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in the Picket Post platform. Socket loading specifications are listed in the center of the array and selective depopulation... The socket must be compatible with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 The socket provides I/O, power and ground contacts. LGA1366 ...
... 41 grid array with 21 x 17 grid depopulation in the center of the socket with lead-free solder balls for the Intel® Xeon® processor C5500/C3500 series in the Picket Post platform. Socket loading specifications are listed in the center of the array and selective depopulation... The socket must be compatible with Pick and Place Cover Removed package socket cavity August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 The socket provides I/O, power and ground contacts. LGA1366 ...
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LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US LGA1366 Socket Figure 3-2.
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LGA1366 Socket Land Pattern (Top View of the Intel® Xeon® 5500 Platform Design Guide (PDG). There is explained in a reduced drill keepout as compared to previous platforms. Drill keepout is no round-off (conversion) ... AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 Figure 3-3. Recommendations for pad definition on a per pad basis do not exist for...
LGA1366 Socket Land Pattern (Top View of the Intel® Xeon® 5500 Platform Design Guide (PDG). There is explained in a reduced drill keepout as compared to previous platforms. Drill keepout is no round-off (conversion) ... AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 20 Figure 3-3. Recommendations for pad definition on a per pad basis do not exist for...
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... will be such that the integrity of approximately 217°C. Socket Body Housing The housing material is not present during the attach (reflow) process. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US See Appendix C for 40 seconds (typical reflow...
... will be such that the integrity of approximately 217°C. Socket Body Housing The housing material is not present during the attach (reflow) process. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number: 323107-002US See Appendix C for 40 seconds (typical reflow...