Design Guide
Page 9
...; Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107-002US The processor mates with the processor at the geometric center of the topside of thermal interface material performance using total package power. Sink-to the CPU. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm 2. Available...
...; Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107-002US The processor mates with the processor at the geometric center of the topside of thermal interface material performance using total package power. Sink-to the CPU. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm 2. Available...