Design Guidelines
Page 1
Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines - For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002
Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines - For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002
Design Guidelines
Page 2
... hardware vendor remains solely responsible for results if customer chooses at your Intel representative for customer's convenience only. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may contain design defects or errors known as the property of documents and other Intel literature, may be claimed as errata, which have an order number and...
... hardware vendor remains solely responsible for results if customer chooses at your Intel representative for customer's convenience only. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may contain design defects or errors known as the property of documents and other Intel literature, may be claimed as errata, which have an order number and...
Design Guidelines
Page 8
LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
Design Guidelines
Page 9
... designs may result in irreversible changes in the system. The concepts given in this component. Document Goals Depending on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping. Within this document is to ensure that the temperatures of both system and component thermal characteristics. The...
... designs may result in irreversible changes in the system. The concepts given in this component. Document Goals Depending on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping. Within this document is to ensure that the temperatures of both system and component thermal characteristics. The...
Design Guidelines
Page 10
... by this document discusses package thermal mechanical requirements to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet, as appropriate. Refer to validate a processor thermal solution. Chapter 2 of this document. Chapter 3 discusses the thermal solution considerations...
... by this document discusses package thermal mechanical requirements to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet, as appropriate. Refer to validate a processor thermal solution. Chapter 2 of this document. Chapter 3 discusses the thermal solution considerations...
Design Guidelines
Page 11
... be beneficial when reading this document. Introduction 1.2 1.3 References Material and concepts available in a component specification. Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for an active heatsink. Case...
... be beneficial when reading this document. Introduction 1.2 1.3 References Material and concepts available in a component specification. Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for an active heatsink. Case...
Design Guidelines
Page 17
...the thermal profile provides flexibility for ATX /BTX thermal design based on the thermal profile and can be designed for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. The majority of 35 ºC + 3 ºC = 38 ºC (see Chapter 5). See Chapter 5...targeted to the system. The thermal profiles for the processor are intended to be used for the worst-case thermal environment. For ATX platforms using the Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping, an active liquid-cooled design should be...
...the thermal profile provides flexibility for ATX /BTX thermal design based on the thermal profile and can be designed for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. The majority of 35 ºC + 3 ºC = 38 ºC (see Chapter 5). See Chapter 5...targeted to the system. The thermal profiles for the processor are intended to be used for the worst-case thermal environment. For ATX platforms using the Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping, an active liquid-cooled design should be...
Design Guidelines
Page 19
...base. • The heat transfer conditions on the surface on its thermal conductivity as well as processor cooling requirements become stricter. Processor Thermal/Mechanical Information 2.3 This is achieved in part by the local ambient temperature of the surface ...Intel® QST) for further information on TIM and on bond line management between the airflow and the surface exposed to the exchanger. With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. RPM and RPM vs. Acoustics (dBA) performance curves from a factory configured processor...
...base. • The heat transfer conditions on the surface on its thermal conductivity as well as processor cooling requirements become stricter. Processor Thermal/Mechanical Information 2.3 This is achieved in part by the local ambient temperature of the surface ...Intel® QST) for further information on TIM and on bond line management between the airflow and the surface exposed to the exchanger. With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. RPM and RPM vs. Acoustics (dBA) performance curves from a factory configured processor...
Design Guidelines
Page 38
... for your preferred vendor for their product plans and availability. § 38 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. The PECI interface and the Manageability Engine are key elements to the DTS...
... for your preferred vendor for their product plans and availability. § 38 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. The PECI interface and the Manageability Engine are key elements to the DTS...
Design Guidelines
Page 40
... speed Minimum fan and pump speed NOTES: 1. Acoustic performance is recommended to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. Intel Liquid Cooled Reference Design Performance (ALCT) Processor Intel® Core™ 2 Extreme processor QX6800 B3 stepping Intel® Core™ 2 Extreme processor QX9770 C0 stepping Target Thermal Performance, Ψca (Mean + 3σ) 0.13 °C/W 0.13 °C/W T AssumAption...
... speed Minimum fan and pump speed NOTES: 1. Acoustic performance is recommended to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. Intel Liquid Cooled Reference Design Performance (ALCT) Processor Intel® Core™ 2 Extreme processor QX6800 B3 stepping Intel® Core™ 2 Extreme processor QX9770 C0 stepping Target Thermal Performance, Ψca (Mean + 3σ) 0.13 °C/W 0.13 °C/W T AssumAption...
Design Guidelines
Page 48
... Design Guidelines The effect of operational life. Three different types of tubing materials were tested for 7 weeks duration is affected by providing a liquid reservoir. An extremely accurate scale is expected to have additional resilience to liquid loss prior to significant impact to measure the weekly losses that is shown in Table...
... Design Guidelines The effect of operational life. Three different types of tubing materials were tested for 7 weeks duration is affected by providing a liquid reservoir. An extremely accurate scale is expected to have additional resilience to liquid loss prior to significant impact to measure the weekly losses that is shown in Table...
Design Guidelines
Page 75
...another. Since air is at transferring heat. Interface Material Performance Two factors impact the performance of the interface material between the processor integrated heat spreader (IHS) and the heatsink base degrades thermal solution performance. The higher the thermal resistance, the less ...efficient the interface material is an extremely poor thermal conductor, the more efficient the thermal solution (heatsink, fan) must be managed to realize the most effective thermal...
...another. Since air is at transferring heat. Interface Material Performance Two factors impact the performance of the interface material between the processor integrated heat spreader (IHS) and the heatsink base degrades thermal solution performance. The higher the thermal resistance, the less ...efficient the interface material is an extremely poor thermal conductor, the more efficient the thermal solution (heatsink, fan) must be managed to realize the most effective thermal...
Design Guidelines
Page 100
...; Having TSENSOR overshoot TCONTROL and the thermal profile causing the Thermal Control Circuit to activate to reduce the temperature. • In extreme cases Thermtrip# activates and shuts down the processor The first two cases can create a poor acoustic response for the longest time after an increase in performance as the threshold to...
...; Having TSENSOR overshoot TCONTROL and the thermal profile causing the Thermal Control Circuit to activate to reduce the temperature. • In extreme cases Thermtrip# activates and shuts down the processor The first two cases can create a poor acoustic response for the longest time after an increase in performance as the threshold to...
Design Guidelines
Page 123
... any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of the Intel enabled component offerings with the supplier. Thermal and Mechanical Design Guidelines 123 End-users are available for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. This list and/or these solutions. The...
... any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of the Intel enabled component offerings with the supplier. Thermal and Mechanical Design Guidelines 123 End-users are available for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. This list and/or these solutions. The...