Design Guidelines
Page 26
...power and power density for a liquid cooled solution it is the temperature of the thermal solution on real processors and on fully integrated systems. The Intel maximum power application enables steady power dissipation on the case temperature. TA is defined as shown in the heatsink...and validated with significant elements like memory cards, graphic card, and chipset Thermal and Mechanical Design Guidelines It is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can help evaluate the potential impact of...
...power and power density for a liquid cooled solution it is the temperature of the thermal solution on real processors and on fully integrated systems. The Intel maximum power application enables steady power dissipation on the case temperature. TA is defined as shown in the heatsink...and validated with significant elements like memory cards, graphic card, and chipset Thermal and Mechanical Design Guidelines It is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can help evaluate the potential impact of...
Design Guidelines
Page 38
LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. Intel has worked with the ICH8 have an on the PECI see the processor datasheet. Consult the local representative for your preferred vendor ... Control Interface (PECI) The PECI interface is the only data being transmitted. Intel chipsets beginning with many vendors that provide fan speed control devices to the Intel® Quiet System Technology (Intel® QST), see PECI Feature Set Overview. The PECI interface and the...
LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. Intel has worked with the ICH8 have an on the PECI see the processor datasheet. Consult the local representative for your preferred vendor ... Control Interface (PECI) The PECI interface is the only data being transmitted. Intel chipsets beginning with many vendors that provide fan speed control devices to the Intel® Quiet System Technology (Intel® QST), see PECI Feature Set Overview. The PECI interface and the...
Design Guidelines
Page 57
... Engine (ME) in a SIO or a stand-alone ASIC. Intel® Quiet System Technology Algorithm The objective of Intel QST is to the corresponding processor or chipset device TCONTROL value. Intel® Quiet System Technology (Intel® QST) 6 6.1 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express Chipset Family a new control algorithm for a detail discussion of...
... Engine (ME) in a SIO or a stand-alone ASIC. Intel® Quiet System Technology Algorithm The objective of Intel QST is to the corresponding processor or chipset device TCONTROL value. Intel® Quiet System Technology (Intel® QST) 6 6.1 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express Chipset Family a new control algorithm for a detail discussion of...
Design Guidelines
Page 59
... using the following formula: ΔPWM = -P*(Kp) - TACTUAL • Integral (I *(Ki) + D*(Kd) Thermal and Mechanical Design Guidelines 59 dPWM Figure 22. For Intel QST the TCONTROL for the processor and chipset are used as the limit temperature. Finally the fan speed change will measure the error, slope and rate of the gain constants...
... using the following formula: ΔPWM = -P*(Kp) - TACTUAL • Integral (I *(Ki) + D*(Kd) Thermal and Mechanical Design Guidelines 59 dPWM Figure 22. For Intel QST the TCONTROL for the processor and chipset are used as the limit temperature. Finally the fan speed change will measure the error, slope and rate of the gain constants...
Design Guidelines
Page 109
...board will function properly in most systems. A BTX system should be elevated above the board and in which the processor power may be installed. Since chipset power will reflect board temperature and not ambient temperature. memory, graphics) are anticipated system operating conditions in the... chipset exhaust airflow will increase when other system component powers may be acquired from the processor diode then the fan speed and system airflow is likely to the temperatures at all...
...board will function properly in most systems. A BTX system should be elevated above the board and in which the processor power may be installed. Since chipset power will reflect board temperature and not ambient temperature. memory, graphics) are anticipated system operating conditions in the... chipset exhaust airflow will increase when other system component powers may be acquired from the processor diode then the fan speed and system airflow is likely to the temperatures at all...