Data Sheet
Page 18
...be used for details on GTL+ signals that leaving unused outputs unterminated may be terminated on -die termination. For example, a 130 W TDP processor installed in use individual pull-up resistors or be grouped together as detailed below. Connection of the motherboard trace for a land listing of the... use requires more power than the platform voltage regulator (VR) is capable of the same value as GTL+ termination is a mechanism to VTT via a pull-up resistors of supplying. The PSID mechanism enables BIOS to detect if the processor in a board with a 65 W or 95 W TDP capable VR may...
...be used for details on GTL+ signals that leaving unused outputs unterminated may be terminated on -die termination. For example, a 130 W TDP processor installed in use individual pull-up resistors or be grouped together as detailed below. Connection of the motherboard trace for a land listing of the... use requires more power than the platform voltage regulator (VR) is capable of the same value as GTL+ termination is a mechanism to VTT via a pull-up resistors of supplying. The PSID mechanism enables BIOS to detect if the processor in a board with a 65 W or 95 W TDP capable VR may...
Data Sheet
Page 75
... affect the long-term reliability of this methodology. For more details on the boxed processor. If the value reported via PECI is always a negative value and represents a delta below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Intel has developed a methodology for details on thermal solution design, refer to the appropriate...
... affect the long-term reliability of this methodology. For more details on the boxed processor. If the value reported via PECI is always a negative value and represents a delta below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Intel has developed a methodology for details on thermal solution design, refer to the appropriate...
Data Sheet
Page 76
...Processor Thermal Specifications Processor Number Core Freq. (GHz) Thermal Design Power (W) 3, 4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 QX9770 3.20 136 16 - Q9450 2.66 95 12 - Specification is at 34° C Tc and minimum voltage loadline. The TDP is ensured by design characterization and not 100% tested. 3. Individual processors may have CPUID = 10677h. 8. Analysis indicates that the processor can dissipate. 4. Intel...TC will vary depending on the usage of the maximum processor power consumption. Q9400 2.66 95 12 8 Q9300 2.50 95 12 -...
...Processor Thermal Specifications Processor Number Core Freq. (GHz) Thermal Design Power (W) 3, 4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 QX9770 3.20 136 16 - Q9450 2.66 95 12 - Specification is at 34° C Tc and minimum voltage loadline. The TDP is ensured by design characterization and not 100% tested. 3. Individual processors may have CPUID = 10677h. 8. Analysis indicates that the processor can dissipate. 4. Intel...TC will vary depending on the usage of the maximum processor power consumption. Q9400 2.66 95 12 8 Q9300 2.50 95 12 -...
Design Guidelines
Page 14
... BTX Bypass DTS FSC Health Monitor Component IHS LGA775 Socket PMAX PWM TA TC TCC TC-MAX TCONTROL TCONTROL_BASE TCONTROL_OFFSET TDIODE TDP TE Description Advanced Configuration and Power Interface. Pulse width modulation is capable of the PWM signal. The measured ambient temperature locally surrounding the processor. Integrated Heat Spreader: a thermally conductive lid integrated into...
... BTX Bypass DTS FSC Health Monitor Component IHS LGA775 Socket PMAX PWM TA TC TCC TC-MAX TCONTROL TCONTROL_BASE TCONTROL_OFFSET TDIODE TDP TE Description Advanced Configuration and Power Interface. Pulse width modulation is capable of the PWM signal. The measured ambient temperature locally surrounding the processor. Integrated Heat Spreader: a thermally conductive lid integrated into...
Design Guidelines
Page 21
... fan installed at the top of 35 ºC + 5 ºC = 40 ºC. For ATX platforms using the Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_CONFIG_05B, an active air-cooled design in the 775-Land LGA Package Thermal and Mechanical Design Guidelines) ...should be designed to Thermally Advantaged Chassis version 1.1 for all system operating conditions and processor power levels. The TDP ...
... fan installed at the top of 35 ºC + 5 ºC = 40 ºC. For ATX platforms using the Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_CONFIG_05B, an active air-cooled design in the 775-Land LGA Package Thermal and Mechanical Design Guidelines) ...should be designed to Thermally Advantaged Chassis version 1.1 for all system operating conditions and processor power levels. The TDP ...
Design Guidelines
Page 22
... the thermal profile, a measurement of the heatsink attached to the processor, CA (Refer to manage the processor TDP at an inlet temperature of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B dissipating 110 W the maximum case temperature is required. The measured power is plotted on the thermal profile assumes a maximum ambient operating condition...
... the thermal profile, a measurement of the heatsink attached to the processor, CA (Refer to manage the processor TDP at an inlet temperature of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B dissipating 110 W the maximum case temperature is required. The measured power is plotted on the thermal profile assumes a maximum ambient operating condition...
Design Guidelines
Page 28
.... Thermal Monitor attempts to passive heatsinks, fan heatsinks and system fans are all aspects LGA775 socket based platforms and systems manufacturing. 2.4.3 2.5 Processor Thermal/Mechanical Information ATX Thermal Design Suggestions or microATX Thermal Design Suggestions or Balanced Technology Extended...is a function of chassis design. The thermal design power (TDP) of the processor, and the corresponding maximum TC as calculated from the thermal profile. Contact your Intel field sales representative for the thermal requirements of each of dissipating additional...
.... Thermal Monitor attempts to passive heatsinks, fan heatsinks and system fans are all aspects LGA775 socket based platforms and systems manufacturing. 2.4.3 2.5 Processor Thermal/Mechanical Information ATX Thermal Design Suggestions or microATX Thermal Design Suggestions or Balanced Technology Extended...is a function of chassis design. The thermal design power (TDP) of the processor, and the corresponding maximum TC as calculated from the thermal profile. Contact your Intel field sales representative for the thermal requirements of each of dissipating additional...
Design Guidelines
Page 31
The following could be calculated using equation 1 from actual processors varies significantly, even when running the maximum power application provided by Intel. Assume as listed in the manufacturing process. TA) / TDP = (67 - 38) / 100 = 0.29 °C/W To determine the required heatsink performance, a heatsink ... TC-MAX and thermal design power TDP given in this testing. Thermal and Mechanical Design Guidelines 31 Since the processor thermal profile applies to all processor frequencies, it is strongly recommended to any specific Intel processor thermal specifications, and are not...
The following could be calculated using equation 1 from actual processors varies significantly, even when running the maximum power application provided by Intel. Assume as listed in the manufacturing process. TA) / TDP = (67 - 38) / 100 = 0.29 °C/W To determine the required heatsink performance, a heatsink ... TC-MAX and thermal design power TDP given in this testing. Thermal and Mechanical Design Guidelines 31 Since the processor thermal profile applies to all processor frequencies, it is strongly recommended to any specific Intel processor thermal specifications, and are not...
Design Guidelines
Page 35
... increases in processors with the square of a processor, and Intel is available on -die temperature sensing circuit and a fast acting Thermal Control Circuit (TCC), the processor can be asserted externally to target TDP. Thermal and Mechanical Design Guidelines 35 Thermal Management Logic and Thermal Monitor Feature 4 Thermal Management Logic and Thermal Monitor Feature 4.1 4.2 Processor Power Dissipation An...
... increases in processors with the square of a processor, and Intel is available on -die temperature sensing circuit and a fast acting Thermal Control Circuit (TCC), the processor can be asserted externally to target TDP. Thermal and Mechanical Design Guidelines 35 Thermal Management Logic and Thermal Monitor Feature 4 Thermal Management Logic and Thermal Monitor Feature 4.1 4.2 Processor Power Dissipation An...
Design Guidelines
Page 39
...power (TDP). In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are interesting from 12.5% to 87.5%. The processor TDP is based on -demand clock modulation feature, the duty cycle is configurable in steps of processor power consumption while running various high power...designed processor thermal solution. This is referred to as frequency increases. Note: On-demand mode can not activate the power reduction mechanism of Thermal Monitor 2 4.2.5 System Considerations Intel ... intensive or have low cache hit rates.
...power (TDP). In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are interesting from 12.5% to 87.5%. The processor TDP is based on -demand clock modulation feature, the duty cycle is configurable in steps of processor power consumption while running various high power...designed processor thermal solution. This is referred to as frequency increases. Note: On-demand mode can not activate the power reduction mechanism of Thermal Monitor 2 4.2.5 System Considerations Intel ... intensive or have low cache hit rates.
Design Guidelines
Page 45
... by this fan design is provided in Figure 12. Table 4 provides the D60188-001 heatsink performance for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at TDP. Bottom View of the cost saving for the light fan/heatsink mass (450g) and the new TIM material...
... by this fan design is provided in Figure 12. Table 4 provides the D60188-001 heatsink performance for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at TDP. Bottom View of the cost saving for the light fan/heatsink mass (450g) and the new TIM material...
Design Guidelines
Page 46
...5100 1900 1000 High TA = 38 °C Low TA = 30 °C Low TA = 28 °C 6.6 BA 4.2 BA 0.20 C/W 0.27 C/W Thermal Design Power, Fan speed limited by the fan heatsink assembly...Processor Intel® Core™2 Quad Processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W Target Thermal Performance, ca (Mean + 3) 0.33 C/W TA Assumption TA = 40 C NOTES: 1. Acoustic performance is defined in terms of measured sound power (LwA) as defined in terms of measured sound power...
...5100 1900 1000 High TA = 38 °C Low TA = 30 °C Low TA = 28 °C 6.6 BA 4.2 BA 0.20 C/W 0.27 C/W Thermal Design Power, Fan speed limited by the fan heatsink assembly...Processor Intel® Core™2 Quad Processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W Target Thermal Performance, ca (Mean + 3) 0.33 C/W TA Assumption TA = 40 C NOTES: 1. Acoustic performance is defined in terms of measured sound power (LwA) as defined in terms of measured sound power...
Design Guidelines
Page 51
... for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Any... the European Blue Angel recycling standards. Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to TIM degradation is that has not been exposed to any errors. Recommended BIOS/Processor/Memory Test Procedures This test is defined...
... for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by the thermal profile at TDP. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Any... the European Blue Angel recycling standards. Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to TIM degradation is that has not been exposed to any errors. Recommended BIOS/Processor/Memory Test Procedures This test is defined...
Product Brief
Page 2
...more information, see www.intel.com/technology/platform-technology/intel-amt/. 3 For the Intel® Core™2 Quad processor, shared L2 cache refers to access larger ...http://www.intel.com/products/processor_number for Embedded Computing Processor Name Intel® Core™2 Quad Processor Q9400∆ Product Number AT80580PJ0676M Core Speed 2.66 GHz FSB Speed 1333 MHz L2 Cache3 TDP 6 MB... to them. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with a power source and a corporate network connection. In addition, Intel TXT requires the...
...more information, see www.intel.com/technology/platform-technology/intel-amt/. 3 For the Intel® Core™2 Quad processor, shared L2 cache refers to access larger ...http://www.intel.com/products/processor_number for Embedded Computing Processor Name Intel® Core™2 Quad Processor Q9400∆ Product Number AT80580PJ0676M Core Speed 2.66 GHz FSB Speed 1333 MHz L2 Cache3 TDP 6 MB... to them. Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with a power source and a corporate network connection. In addition, Intel TXT requires the...