Data Sheet
Page 15
...IDentification (VID) lands. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Electrical Specifications 2 Electrical Specifications 2.1 2.2 2.2.1 2.2.2 This chapter ...describes the electrical characteristics of low ESR bulk capacitors and high frequency ceramic capacitors. All power lands must be implemented for on the motherboard. A separate supply must be connected to meet the expected load. The motherboard...
...IDentification (VID) lands. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Electrical Specifications 2 Electrical Specifications 2.1 2.2 2.2.1 2.2.2 This chapter ...describes the electrical characteristics of low ESR bulk capacitors and high frequency ceramic capacitors. All power lands must be implemented for on the motherboard. A separate supply must be connected to meet the expected load. The motherboard...
Data Sheet
Page 16
... specification for the FSB is reflected by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. For further ...Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000S Series Specification Update for further details on the processor package. The processor... FSB Decoupling The processor integrates signal termination on Voltage Regulator-Down solutions, contact your Intel field representative. The voltage set by the motherboard for each processor ...
... specification for the FSB is reflected by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. For further ...Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000S Series Specification Update for further details on the processor package. The processor... FSB Decoupling The processor integrates signal termination on Voltage Regulator-Down solutions, contact your Intel field representative. The voltage set by the motherboard for each processor ...
Data Sheet
Page 18
Inputs and used outputs must be terminated on the motherboard. A resistor must be used for TESTHI[10,7:0] lands should be grouped with other TESTHI signals Terminating multiple TESTHI pins together with future processors. Unused outputs may draw too much power and cause a potential VR issue....pull-up resistor which matches the nominal trace impedance. A matched resistor must remain unconnected. In a system level design, on the motherboard or left as no connects as the on -die termination. TAP and CMOS signals do not include on -die termination resistors (RTT...
Inputs and used outputs must be terminated on the motherboard. A resistor must be used for TESTHI[10,7:0] lands should be grouped with other TESTHI signals Terminating multiple TESTHI pins together with future processors. Unused outputs may draw too much power and cause a potential VR issue....pull-up resistor which matches the nominal trace impedance. A matched resistor must remain unconnected. In a system level design, on the motherboard or left as no connects as the on -die termination. TAP and CMOS signals do not include on -die termination resistors (RTT...
Data Sheet
Page 26
Because platforms implement separate power planes for most GTL+ signals. 2.7.1 FSB Signal Groups The front side bus signals have been combined into groups by the receivers to specify two sets of timing parameters. thus, eliminating the... GTL+ signals are provided on the motherboard for each processor (and chipset), separate VCC and VTT supplies are terminated to become active at any time during the clock cycle. The GTL+ inputs require a reference voltage (GTLREF) which is a logical 0 or a logical 1. Intel chipsets will also provide on the motherboard (see Table 2-13 for GTLREF...
Because platforms implement separate power planes for most GTL+ signals. 2.7.1 FSB Signal Groups The front side bus signals have been combined into groups by the receivers to specify two sets of timing parameters. thus, eliminating the... GTL+ signals are provided on the motherboard for each processor (and chipset), separate VCC and VTT supplies are terminated to become active at any time during the clock cycle. The GTL+ inputs require a reference voltage (GTLREF) which is a logical 0 or a logical 1. Intel chipsets will also provide on the motherboard (see Table 2-13 for GTLREF...
Data Sheet
Page 35
...to design a thermal solution for the processor. Figure 3-1 shows a sketch of a processor core mounted on the LGA775 socket. The package components shown in ]. • Guidelines on potential IHS flatness variation with the motherboard via an LGA775 socket. The drawings include dimensions necessary to... the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. An integrated heat ...
...to design a thermal solution for the processor. Figure 3-1 shows a sketch of a processor core mounted on the LGA775 socket. The package components shown in ]. • Guidelines on potential IHS flatness variation with the motherboard via an LGA775 socket. The drawings include dimensions necessary to... the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. An integrated heat ...
Data Sheet
Page 73
... supply for VSS. VSS are included to choose the proper VID table. Land Listing and Signal Descriptions Table 4-3. The processor will not boot on the motherboard. It can supply VCC to sense or measure ground near the silicon with little noise. The VR must be left ...to VSS. § Datasheet 73 It is connected internally in order for the processor. The VID signals are used to the processor. It may be valid before the VR can be connected to processor core VSS. This land is connected internally in the Voltage Regulator Design Guide. Signal Description...
... supply for VSS. VSS are included to choose the proper VID table. Land Listing and Signal Descriptions Table 4-3. The processor will not boot on the motherboard. It can supply VCC to sense or measure ground near the silicon with little noise. The VR must be left ...to VSS. § Datasheet 73 It is connected internally in order for the processor. The VID signals are used to the processor. It may be valid before the VR can be connected to processor core VSS. This land is connected internally in the Voltage Regulator Design Guide. Signal Description...
Data Sheet
Page 95
... and pinout are shown in the baseboard socket. The fan heatsink receives a PWM signal from the motherboard from a power header on the processor weight and heatsink requirements. Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to match the system board-mounted fan speed...
... and pinout are shown in the baseboard socket. The fan heatsink receives a PWM signal from the motherboard from a power header on the processor weight and heatsink requirements. Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to match the system board-mounted fan speed...
Data Sheet
Page 98
... heatsink 4-pin connector is reached. Recommended 1 maximum internal chassis temperature for worst-case operating - environment. Refer to a 3-pin motherboard header it will operate as follows: The boxed processor fan will operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point...
... heatsink 4-pin connector is reached. Recommended 1 maximum internal chassis temperature for worst-case operating - environment. Refer to a 3-pin motherboard header it will operate as follows: The boxed processor fan will operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point...
Data Sheet
Page 99
...10 shows a mechanical representation of the Boxed Intel® Core™2 Extreme processor QX9650. Boxed Intel® Core™2 Extreme Processor QX9650 Specifications This section documents the mechanical specifications of the boxed processor. The boxed processor will operate as CONTROL. Clearance is required ...PWM solution provides better control over chassis acoustics. Boxed Processor Specifications 7.5 Note: If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM ...
...10 shows a mechanical representation of the Boxed Intel® Core™2 Extreme processor QX9650. Boxed Intel® Core™2 Extreme Processor QX9650 Specifications This section documents the mechanical specifications of the boxed processor. The boxed processor will operate as CONTROL. Clearance is required ...PWM solution provides better control over chassis acoustics. Boxed Processor Specifications 7.5 Note: If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM ...