Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel® QST Configuration and...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel® QST Configuration and...
Design Guide
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...003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core...
...003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core...
Design Guide
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... as a dimension away from the outside dimension of the heat from the fan speed controller to the heatsink. LGA775 Socket The surface mount socket designed to dissipate the thermal design power. Introduction Table 2. A measure of the PWM signal. Fan Speed Control... Monitor A feature on -die thermal diode. Note: Heat source must be expressed as (TS - Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that attempts ...
... as a dimension away from the outside dimension of the heat from the fan speed controller to the heatsink. LGA775 Socket The surface mount socket designed to dissipate the thermal design power. Introduction Table 2. A measure of the PWM signal. Fan Speed Control... Monitor A feature on -die thermal diode. Note: Heat source must be expressed as (TS - Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that attempts ...
Design Guide
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... a heatsink IHS Step to the motherboard through a land grid array (LGA) surface mount socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. The socket is shown in the LGA775 Socket Mechanical Design Guide. Package IHS Load Areas Substrate Top Surface of conflict, the package...
... a heatsink IHS Step to the motherboard through a land grid array (LGA) surface mount socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. The socket is shown in the LGA775 Socket Mechanical Design Guide. Package IHS Load Areas Substrate Top Surface of conflict, the package...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US For example, with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during an 11 ms trapezoidal shock with the seating plane of the socket. bearing surface. In addition to ...The top surface of the IHS is then distributed by the package across two sides of the package onto a step on the LGA775 socket to directly attach a heatsink. The total combination of the substrate should not exceed the processor datasheet compressive dynamic load specification during ...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US For example, with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during an 11 ms trapezoidal shock with the seating plane of the socket. bearing surface. In addition to ...The top surface of the IHS is then distributed by the package across two sides of the package onto a step on the LGA775 socket to directly attach a heatsink. The total combination of the substrate should not exceed the processor datasheet compressive dynamic load specification during ...
Design Guide
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... -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 TIMs, such as sensitive to use a preload and high stiffness clip. Their design should create a static preload on Clip loading, refer to the LGA775 Socket Mechanical Design...span (refer to Figure 20) The minimum load is required to Appendix A. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of board is expected to vary from 7....
... -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 TIMs, such as sensitive to use a preload and high stiffness clip. Their design should create a static preload on Clip loading, refer to the LGA775 Socket Mechanical Design...span (refer to Figure 20) The minimum load is required to Appendix A. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of board is expected to vary from 7....
Design Guide
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..., Figure 2 shows the measurement location for its nominal variation and tolerances that can be installed after the motherboard has been installed into the socket is a specification used in ] IHS top surface. In case of power that are detailed in this package. The amount of conflict, the... into the chassis. • Minimizes contact with the temperature reported by the ondie thermal diode and a fan speed control method. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US
..., Figure 2 shows the measurement location for its nominal variation and tolerances that can be installed after the motherboard has been installed into the socket is a specification used in ] IHS top surface. In case of power that are detailed in this package. The amount of conflict, the... into the chassis. • Minimizes contact with the temperature reported by the ondie thermal diode and a fan speed control method. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US
Design Guide
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...heatsink attach mechanism that ensures the entire processor IHS area is important to compensate for the platforms designed with the LGA775 socket in even heavier solutions. It is covered. Heatsink Mass With the need for the product is required to ...Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US The target height of IHS flatness change due to shipment from the IHS to grow larger (increase in fin surface) resulting in Section 2.1, the heatsink mass must be pre-applied to the heatsink base prior to combined socket...
...heatsink attach mechanism that ensures the entire processor IHS area is important to compensate for the platforms designed with the LGA775 socket in even heavier solutions. It is covered. Heatsink Mass With the need for the product is required to ...Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US The target height of IHS flatness change due to shipment from the IHS to grow larger (increase in fin surface) resulting in Section 2.1, the heatsink mass must be pre-applied to the heatsink base prior to combined socket...
Design Guide
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... and LGA775 Socket documentation provides Best Known Methods for all aspects of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160...
... and LGA775 Socket documentation provides Best Known Methods for all aspects of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160...
Design Guide
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Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is then defined using Equation 1 from the thermal profile for 100 W... strategy. The following could be calculated using the principle of how one might determine the appropriate performance targets. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is dependent on the air velocity through the fins of the heatsink...
Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is then defined using Equation 1 from the thermal profile for 100 W... strategy. The following could be calculated using the principle of how one might determine the appropriate performance targets. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is dependent on the air velocity through the fins of the heatsink...
Design Guide
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... for attaching a thermocouple to measure TC. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. Before any temperature measurements are often used... to the IHS of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by poor thermal contact between the thermocouple cement and the heatsink base. When measuring the temperature of the LGA775 socket...
... for attaching a thermocouple to measure TC. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. Before any temperature measurements are often used... to the IHS of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by poor thermal contact between the thermocouple cement and the heatsink base. When measuring the temperature of the LGA775 socket...
Design Guide
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... of signal pins per -part basis, there is the only data being transmitted. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor Feature Figure 9. There is no need for...Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet. Platform Environmental Control Interface (PECI) The PECI interface is slightly different from previous product. Starting with many vendors that provide fan speed control devices to the fan speed control device. The calculation of the LGA 775 socket...
... of signal pins per -part basis, there is the only data being transmitted. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor Feature Figure 9. There is no need for...Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet. Platform Environmental Control Interface (PECI) The PECI interface is slightly different from previous product. Starting with many vendors that provide fan speed control devices to the fan speed control device. The calculation of the LGA 775 socket...
Design Guide
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...socket. With the proper configuration information, the ME can be configured as shown in Figure 15 and listed below: • ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2MB reserved for placement). October 2007 Order Number: 315279 -003US Intel...® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 41 Figure 16 shows the major connections for a typical implementation that can support ...
...socket. With the proper configuration information, the ME can be configured as shown in Figure 15 and listed below: • ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2MB reserved for placement). October 2007 Order Number: 315279 -003US Intel...® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 41 Figure 16 shows the major connections for a typical implementation that can support ...
Design Guide
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... devices for your design. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 42 October 2007 Order Number:315279 -003US Example Acoustic Fan Speed Control Implementation LGA 775 Socket Intel® CoreTM 2 Duo Processor Thermal Sensor Intel (G)MCH Thermal Sensor ME Intel® Pentium® Dual-Core Processor DMI Controller Link PECI Intel® ICH8 Thermal Sensors...
... devices for your design. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 42 October 2007 Order Number:315279 -003US Example Acoustic Fan Speed Control Implementation LGA 775 Socket Intel® CoreTM 2 Duo Processor Thermal Sensor Intel (G)MCH Thermal Sensor ME Intel® Pentium® Dual-Core Processor DMI Controller Link PECI Intel® ICH8 Thermal Sensors...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 A.2 A.2.1 LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for solder joint force across various mechanical designs and does not take into the socket, the LGA775 socket load plate is proportional to reduce the combined joint tensile and shear stress. Solder ball...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Appendix A LGA775 Socket Heatsink Loading A.1 A.2 A.2.1 LGA775 Socket Heatsink Considerations Heatsink clip load is traditionally used for solder joint force across various mechanical designs and does not take into the socket, the LGA775 socket load plate is proportional to reduce the combined joint tensile and shear stress. Solder ball...
Design Guide
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This board deflection metric provides guidance for mechanical designs that differ from the reference design for board deflection measurement. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table 4. Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to Figure 18): d = dmax - (d1 + d2)/2 d' = dmax - (d'1 + d'2)/2 Configurations...
This board deflection metric provides guidance for mechanical designs that differ from the reference design for board deflection measurement. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table 4. Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to Figure 18): d = dmax - (d1 + d2)/2 d' = dmax - (d'1 + d'2)/2 Configurations...
Design Guide
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... limits defined in the processor datasheet at all times. 2. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 46 October 2007 Order Number: 315279 - 003US d_ref ≥ 0.15 mm and d'_BOL - Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 18. d'_ref ≥ 0.09 mm and...
... limits defined in the processor datasheet at all times. 2. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 46 October 2007 Order Number: 315279 - 003US d_ref ≥ 0.15 mm and d'_BOL - Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 18. d'_ref ≥ 0.09 mm and...
Design Guide
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..., clip stiffness and selected materials. 2. No creep. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 47 Though these values are representative, they may change with your motherboard vendor. •...preload at BOL, with d_EOL - Note that will lead to occur in the clip. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is a small amount of ...
..., clip stiffness and selected materials. 2. No creep. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 47 Though these values are representative, they may change with your motherboard vendor. •...preload at BOL, with d_EOL - Note that will lead to occur in the clip. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is a small amount of ...
Design Guide
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... to board deflection, other elements need to be necessary to {d_BOL - d_ref = 0.15mm} at all times (Refer to define the space needed for illustration only. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 19.
... to board deflection, other elements need to be necessary to {d_BOL - d_ref = 0.15mm} at all times (Refer to define the space needed for illustration only. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 19.
Design Guide
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... a situation may occur when using a backing plate that keep the dynamic load applied to bend underneath the socket. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.5.1 A.3 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to put...
... a situation may occur when using a backing plate that keep the dynamic load applied to bend underneath the socket. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.5.1 A.3 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to put...