Design Guide
Page 13
...on the mass of the heatsink and the level of shock and vibration that must support. The height of the socket seating plane above , the heatsink attach mechanism for more ...motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in particular on the thermal interface material. One of the key design parameters is implemented by the heatsink attach mechanism must comply with its tolerances. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
...on the mass of the heatsink and the level of shock and vibration that must support. The height of the socket seating plane above , the heatsink attach mechanism for more ...motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in particular on the thermal interface material. One of the key design parameters is implemented by the heatsink attach mechanism must comply with its tolerances. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
Design Guide
Page 43
... % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43 Care needs to be modified to support the other system components. In the tuning process, the Intel QST can work in optimizing the fan management and achieve the acoustic goal...
... % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43 Care needs to be modified to support the other system components. In the tuning process, the Intel QST can work in optimizing the fan management and achieve the acoustic goal...