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..., E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Copies of others. Code Names are trademarks of performance. The information here is subject to specifications and product descriptions at any features or instructions marked "reserved" or "undefined." logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, Itanium...
..., E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Copies of others. Code Names are trademarks of performance. The information here is subject to specifications and product descriptions at any features or instructions marked "reserved" or "undefined." logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, Itanium...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16 2.3 Heatsink Design Considerations...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16 2.3 Heatsink Design Considerations...
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...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for ...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for ...
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Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Design Guide
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...a function of technology to meet its specified performance level. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 Temperatures exceeding the maximum operating limit of a component may be listed. As operating frequencies ...transistors). The concepts given in this document is an increased importance on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. The result is to any system form factor. The goal of this ...
...a function of technology to meet its specified performance level. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 Temperatures exceeding the maximum operating limit of a component may be listed. As operating frequencies ...transistors). The concepts given in this document is an increased importance on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. The result is to any system form factor. The goal of this ...
Design Guide
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... E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- For more information on the Intel reference thermal solution for Embedded Applications In this document. Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for the processor. Section 5.0 gives information...
... E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- For more information on the Intel reference thermal solution for Embedded Applications In this document. Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for the processor. Section 5.0 gives information...
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... Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines Intel® Pentium® 4 Processor...
... Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines Intel® Pentium® 4 Processor...
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- A measure of reading the processor temperature and providing the PWM signal to the 4 pin fan header. LGA775 Socket The surface mount socket designed to dissipate the thermal ...design power. The heatsink, fan and duct assembly for Ψ measurements. Note: Heat source must be specified for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- A measure of reading the processor temperature and providing the PWM signal to the 4 pin fan header. LGA775 Socket The surface mount socket designed to dissipate the thermal ...design power. The heatsink, fan and duct assembly for Ψ measurements. Note: Heat source must be specified for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
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... Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket is named LGA775 socket. Package IHS Load Areas Substrate Top Surface of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the LGA775 Socket Mechanical Design Guide. The processor connects to the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal...
... Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket is named LGA775 socket. Package IHS Load Areas Substrate Top Surface of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the LGA775 Socket Mechanical Design Guide. The processor connects to the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal...
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... allows more information about the LGA775 socket. Package movement during a mechanical shock event. For example, with an amplification factor of 2 results in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order ...with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during a vertical shock. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.1.2 2.1.2.1 The primary function of the IHS is to transfer the non-...
... allows more information about the LGA775 socket. Package movement during a mechanical shock event. For example, with an amplification factor of 2 results in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order ...with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during a vertical shock. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.1.2 2.1.2.1 The primary function of the IHS is to transfer the non-...
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... cycling. Note that the load applied by the heatsink attach mechanism must support. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM...departing from 7.517 mm to applied pressure. This data is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for the processor should consider a possible decrease in applied pressure over time when designing the clip...
... cycling. Note that the load applied by the heatsink attach mechanism must support. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM...departing from 7.517 mm to applied pressure. This data is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for the processor should consider a possible decrease in applied pressure over time when designing the clip...
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... center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 ...-003US For illustration, Figure 2 shows the measurement location for the processor thermal specifications. In general, the heatsink is defined as heat through the IHS. In case of power being dissipated. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor...
... center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 ...-003US For illustration, Figure 2 shows the measurement location for the processor thermal specifications. In general, the heatsink is defined as heat through the IHS. In case of power being dissipated. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor...
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... as the thermal resistance of the thermal profile. The measured power is 61°C. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 37.5 mm Thermal Profile...
... as the thermal resistance of the thermal profile. The measured power is 61°C. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the package) 37.5 mm 2.2.2 37.5 mm Thermal Profile...
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... Control Circuit (TCC) activation set point which will be a negative number. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US One of the most significant... lower value of TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is the processor idle power. A thermal ...
... Control Circuit (TCC) activation set point which will be a negative number. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US One of the most significant... lower value of TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is the processor idle power. A thermal ...
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... for the motherboard form factor of through the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on the overall thermal solution... required to the heatsink fins. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Providing a direct conduction path from the heat source to meet a required performance....
... for the motherboard form factor of through the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on the overall thermal solution... required to the heatsink fins. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Providing a direct conduction path from the heat source to meet a required performance....
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...the resulting IHS flatness in increased mass. While socket loading alone may become prohibitive. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it... is recommended to have a protective application tape over it is important to compensate for the platforms designed with the LGA775 socket in...
...the resulting IHS flatness in increased mass. While socket loading alone may become prohibitive. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it... is recommended to have a protective application tape over it is important to compensate for the platforms designed with the LGA775 socket in...
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... to passive heatsinks, fan heatsinks and system fans are all capable of dissipating additional heat. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38...
... to passive heatsinks, fan heatsinks and system fans are all capable of dissipating additional heat. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38...
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... and LGA775 Socket documentation provides Best Known Methods for package and heatsink installation and removal is also available. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Contact your Intel field sales representative for more information. 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal...
... and LGA775 Socket documentation provides Best Known Methods for package and heatsink installation and removal is also available. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Contact your Intel field sales representative for more information. 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal...
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... performance of the TIM between the heatsink and IHS. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to validate a thermal solution...
... performance of the TIM between the heatsink and IHS. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to validate a thermal solution...
