Design Guide
Page 12
... 2 results in the processor datasheet. • The heatsink mass can also generate additional dynamic compressive load to the package during their respective stress conditions. bearing ...be taken into account in the processor datasheet. A mechanism must be followed in the LGA775 Socket Mechanical Design Guide. The top surface of the IHS is designed to the ..., the processor datasheet provides package handling guidelines in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US ...
... 2 results in the processor datasheet. • The heatsink mass can also generate additional dynamic compressive load to the package during their respective stress conditions. bearing ...be taken into account in the processor datasheet. A mechanism must be followed in the LGA775 Socket Mechanical Design Guide. The top surface of the IHS is designed to the ..., the processor datasheet provides package handling guidelines in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US ...
Design Guide
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... actuation to the top of the IHS. The amount of power that are no additional components, e.g., BSRAMs, which generate heat on the surface of the IHS, and accounting for measuring the case temperature are the Thermal Profile and TCONTROL.... at the geometric center of power being dissipated. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: ...
... actuation to the top of the IHS. The amount of power that are no additional components, e.g., BSRAMs, which generate heat on the surface of the IHS, and accounting for measuring the case temperature are the Thermal Profile and TCONTROL.... at the geometric center of power being dissipated. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: ...
Design Guide
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... Temperature are defined as a function of the thermal profile. The slope of the thermal profile was established assuming a generational improvement in the 775-Land LGA Package Thermal and Mechanical Design Guidelines, available on the thermal profile and can be ... the maximum case temperature. Refer to Section 3.1). This performance is required. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. Refer to the thermal profile, a measurement of the actual processor power dissipation is...
... Temperature are defined as a function of the thermal profile. The slope of the thermal profile was established assuming a generational improvement in the 775-Land LGA Package Thermal and Mechanical Design Guidelines, available on the thermal profile and can be ... the maximum case temperature. Refer to Section 3.1). This performance is required. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. Refer to the thermal profile, a measurement of the actual processor power dissipation is...
Design Guide
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... exist for the thermal requirements of maximum power. Improving Chassis Thermal Performance The heat generated by designing to their varying attributes, each component. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 These parameters are described in a single lump cooling performance parameter, Ψ...
... exist for the thermal requirements of maximum power. Improving Chassis Thermal Performance The heat generated by designing to their varying attributes, each component. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 These parameters are described in a single lump cooling performance parameter, Ψ...
Design Guide
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...been reduced below the thermal trip point, although a small time-based hysteresis has been included to generate an October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 29 PROCHOT# can also be reduced after the thermal sensor detects a high temperature,... activation time has expired, the operating frequency and voltage transition back to -active. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8.
...been reduced below the thermal trip point, although a small time-based hysteresis has been included to generate an October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 29 PROCHOT# can also be reduced after the thermal sensor detects a high temperature,... activation time has expired, the operating frequency and voltage transition back to -active. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8.
Design Guide
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...-demand mode can also be set based on a particular system event (e.g., an interrupt generated after a system event), or may also be relied upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US Thermal Monitor should not...
...-demand mode can also be set based on a particular system event (e.g., an interrupt generated after a system event), or may also be relied upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US Thermal Monitor should not...
Design Guide
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... during manufacturing. The value of processor activity and does not generate any bus cycles. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 31 Regardless of degrees C away from TCC activation...would allow the system to warn of cooling system failure. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 4.2.7 4.2.8 4.2.9 4.2.10 power profile. THERMTRIP# Signal In the event of a catastrophic ...
... during manufacturing. The value of processor activity and does not generate any bus cycles. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 31 Regardless of degrees C away from TCC activation...would allow the system to warn of cooling system failure. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 4.2.7 4.2.8 4.2.9 4.2.10 power profile. THERMTRIP# Signal In the event of a catastrophic ...
Design Guide
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... the current generation of the inputs and response. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 38 October 2007 Order Number:315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST) 6.0 Note: 6.1 Intel® Quiet System Technology (Intel® QST) In the Intel® 965...
... the current generation of the inputs and response. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 38 October 2007 Order Number:315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST) 6.0 Note: 6.1 Intel® Quiet System Technology (Intel® QST) In the Intel® 965...
Design Guide
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... acoustic goal. There is generated using the Intel provided Configuration Tool. The BTX reference design includes a thermistor on the fan hub. Care needs to be programmed with FSC Min % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43
... acoustic goal. There is generated using the Intel provided Configuration Tool. The BTX reference design includes a thermistor on the fan hub. Care needs to be programmed with FSC Min % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43
Design Guide
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LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 ... = 900 lb/in at BOL, with degradation that simulates board creep over time and depends on clip stiffness assumption. It assumes no creep to generate increasing amounts of life board deflection. this situation is a function of the clip stiffness: • The relatively compliant clips store strain energy in ...
LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 ... = 900 lb/in at BOL, with degradation that simulates board creep over time and depends on clip stiffness assumption. It assumes no creep to generate increasing amounts of life board deflection. this situation is a function of the clip stiffness: • The relatively compliant clips store strain energy in ...