Design Guide
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... Xeon Inside are only for use in medical, life saving, life sustaining, critical control or safety systems, or in this information. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Designers must not rely on request. Leap ahead. NO LICENSE, EXPRESS OR IMPLIED...
... Xeon Inside are only for use in medical, life saving, life sustaining, critical control or safety systems, or in this information. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Designers must not rely on request. Leap ahead. NO LICENSE, EXPRESS OR IMPLIED...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
Design Guide
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...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
Design Guide
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Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Design Guide
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...or system damage. The processor temperature depends on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. As operating frequencies increase and packaging size decreases, the power density ...system. The system level thermal constraints consist of both system and component thermal characteristics. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management ...
...or system damage. The processor temperature depends on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. As operating frequencies increase and packaging size decreases, the power density ...system. The system level thermal constraints consist of both system and component thermal characteristics. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management ...
Design Guide
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... 2.0 discusses the thermal solution considerations and metrology recommendations to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007 Order Number: 315279 - 003US Section...
... 2.0 discusses the thermal solution considerations and metrology recommendations to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007 Order Number: 315279 - 003US Section...
Design Guide
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..., and Intel® Pentium® Dual-Core E2160 Processor TDG 9 The ambient temperature should be specified for an active heatsink. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo...
..., and Intel® Pentium® Dual-Core E2160 Processor TDG 9 The ambient temperature should be specified for an active heatsink. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo...
Design Guide
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...LGA775 Socket The surface mount socket designed to a thermal solution through heat spreading. TCC TDIODE FSC Thermal Control Circuit: Thermal Monitor uses the TCC to modulate the fan speed. The heatsink, fan and duct assembly for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160... a variable speed fan. Terms Used (Sheet 2 of heatsink thermal ΨSA performance using total package power. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
...LGA775 Socket The surface mount socket designed to a thermal solution through heat spreading. TCC TDIODE FSC Thermal Control Circuit: Thermal Monitor uses the TCC to modulate the fan speed. The heatsink, fan and duct assembly for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160... a variable speed fan. Terms Used (Sheet 2 of heatsink thermal ΨSA performance using total package power. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Design Guide
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..., the package dimensions in the processor datasheet supersedes dimensions provided in the LGA775 Socket Mechanical Design Guide. Refer to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 In case of IHS to install a heatsink IHS Step...
..., the package dimensions in the processor datasheet supersedes dimensions provided in the LGA775 Socket Mechanical Design Guide. Refer to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 In case of IHS to install a heatsink IHS Step...
Design Guide
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... the LGA775 Socket Mechanical Design Guide. In addition to holding the heatsink in the robustness of the substrate should not be designed to attach the heatsink directly to the top of the IHS, out of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-... thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US
... the LGA775 Socket Mechanical Design Guide. In addition to holding the heatsink in the robustness of the substrate should not be designed to attach the heatsink directly to the top of the IHS, out of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-... thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US
Design Guide
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...with its tolerances. For additional guidelines on mechanical design, in temperature cycling. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM) ...The IHS height from the top of the socket seating plane above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in retention components. • Ensuring system electrical, thermal and...
...with its tolerances. For additional guidelines on mechanical design, in temperature cycling. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM) ...The IHS height from the top of the socket seating plane above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in retention components. • Ensuring system electrical, thermal and...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Techniques for processor performance and acoustic noise reduction. The majority of power that are detailed ... nominal variation and tolerances that can be installed after the motherboard has been installed into the socket is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US In general, the heatsink is a specification used in conjunction ...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Techniques for processor performance and acoustic noise reduction. The majority of power that are detailed ... nominal variation and tolerances that can be installed after the motherboard has been installed into the socket is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US In general, the heatsink is a specification used in conjunction ...
Design Guide
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.... To determine compliance to determine the maximum case temperature. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the... assumes a maximum ambient operating condition that is 61°C. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. The TDP and Maximum Case Temperature are defined as the slope on www...
.... To determine compliance to determine the maximum case temperature. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Processor Case Temperature Measurement Location Measure TC at this point (geometric center of the... assumes a maximum ambient operating condition that is 61°C. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. The TDP and Maximum Case Temperature are defined as the slope on www...
Design Guide
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... on thermal management logic and features and Chapter 6.0 on values read from the Intel enabled thermal solution. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. As a result, the TCONTROL value will... processor's TCONTROL value, the thermal solution should perform similarly. The TCONTROL value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is calculated by using the digital thermal sensor. Refer to the Thermal Control ...
... on thermal management logic and features and Chapter 6.0 on values read from the Intel enabled thermal solution. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. As a result, the TCONTROL value will... processor's TCONTROL value, the thermal solution should perform similarly. The TCONTROL value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is calculated by using the digital thermal sensor. Refer to the Thermal Control ...
Design Guide
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... that helps manage the airflow through the heatsink. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 In particular, the quality of the contact between the IHS and the ...of the heatsink is the resulting cooling. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for component height and placement in the area potentially...
... that helps manage the airflow through the heatsink. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 In particular, the quality of the contact between the IHS and the ...of the heatsink is the resulting cooling. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for component height and placement in the area potentially...
Design Guide
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... footprint definition and height restrictions for enabling components, defined for heatsink-to compensate for the platforms designed with the LGA775 socket in Appendix E of developing and implementing a heatsink attach mechanism that can be sized and positioned on the... performance, heatsink solutions tend to the heatsink. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it . Intel recommends testing and validating heatsink performance in even ...
... footprint definition and height restrictions for enabling components, defined for heatsink-to compensate for the platforms designed with the LGA775 socket in Appendix E of developing and implementing a heatsink attach mechanism that can be sized and positioned on the... performance, heatsink solutions tend to the heatsink. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it . Intel recommends testing and validating heatsink performance in even ...
Design Guide
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...size and relative position of maximum power. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 These parameters are all capable of dissipating additional heat. For ...cooling integrated circuit devices. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes ...
...size and relative position of maximum power. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 These parameters are all capable of dissipating additional heat. For ...cooling integrated circuit devices. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes ...
Design Guide
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...; Volume of airflow over the heatsink surface area. • Development of LGA775 socket based platforms and systems manufacturing. Contact your Intel field sales representative for package and heatsink installation and removal is also available. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US A video...
...; Volume of airflow over the heatsink surface area. • Development of LGA775 socket based platforms and systems manufacturing. Contact your Intel field sales representative for package and heatsink installation and removal is also available. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US A video...
Design Guide
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...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to compare... heat source and local ambient conditions). October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Note: Heat transfer is a three-dimensional phenomenon that is defined...
...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to compare... heat source and local ambient conditions). October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Note: Heat transfer is a three-dimensional phenomenon that is defined...