Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16...
Design Guide
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...(PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket Heatsink Considerations 44 A.2 Metric for Heatsink ...50 B.3 Interface Material Performance 50 C Case Temperature Reference Metrology 51 C.1 Objective and Scope 51 D Mechanical Drawings 53 E Intel® Enabled Reference Solution Information 56 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 4 October 2007 Order Number: ...
...(PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket Heatsink Considerations 44 A.2 Metric for Heatsink ...50 B.3 Interface Material Performance 50 C Case Temperature Reference Metrology 51 C.1 Objective and Scope 51 D Mechanical Drawings 53 E Intel® Enabled Reference Solution Information 56 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 4 October 2007 Order Number: ...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for Clocks under Thermal Monitor...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for Clocks under Thermal Monitor...
Design Guide
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... examples used will be required to any system form factor. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all the processors described and supported in this document. The...
... examples used will be required to any system form factor. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all the processors described and supported in this document. The...
Design Guide
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... for the product dimensions, thermal power dissipation and maximum case temperature. Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for Embedded Applications In this document are used in the...
... for the product dimensions, thermal power dissipation and maximum case temperature. Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for Embedded Applications In this document are used in the...
Design Guide
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... Intel® Pentium® Dual-Core E2160 Processor TDG 9 Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
... Intel® Pentium® Dual-Core E2160 Processor TDG 9 Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
Design Guide
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... must be specified for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US LGA775 Socket The surface mount socket designed to dissipate the thermal design power. Temperature reported from the outside dimension of the fins to the heatsink...
... must be specified for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US LGA775 Socket The surface mount socket designed to dissipate the thermal design power. Temperature reported from the outside dimension of the fins to the heatsink...
Design Guide
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...the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with its tolerances. The height of the socket seating plane above the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring...for designs compliant with the Intel reference design assumption: • 72 mm x 72 mm mounting hole span (refer to Figure 20) The minimum load is required to protect against fatigue failure of socket solder joint in temperature cycling. For information on ...
...the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with its tolerances. The height of the socket seating plane above the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring...for designs compliant with the Intel reference design assumption: • 72 mm x 72 mm mounting hole span (refer to Figure 20) The minimum load is required to protect against fatigue failure of socket solder joint in temperature cycling. For information on ...
Design Guide
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..., and if possible, without the use of the package on this document. The Thermal Profile defines the maximum case temperature as the temperature measured at the geometric center of special tools. Techniques for its nominal variation and tolerances that can be installed after the...during installation and actuation to be dissipated as heat through the IHS. In case of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US For illustration, Figure 2 shows the measurement location...
..., and if possible, without the use of the package on this document. The Thermal Profile defines the maximum case temperature as the temperature measured at the geometric center of special tools. Techniques for its nominal variation and tolerances that can be installed after the...during installation and actuation to be dissipated as heat through the IHS. In case of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US For illustration, Figure 2 shows the measurement location...
Design Guide
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... and Mechanical Design Guidelines, available on www.intel.com for a processor dissipating 70W, the maximum case temperature is consistent with the available chassis solutions. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Refer to the Intel® Pentium® 4 Processor on 90 nm Process in...
... and Mechanical Design Guidelines, available on www.intel.com for a processor dissipating 70W, the maximum case temperature is consistent with the available chassis solutions. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Refer to the Intel® Pentium® 4 Processor on 90 nm Process in...
Design Guide
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...a very specific processor operating region where fan speed can be reduced. Refer to the appropriate datasheet for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is the processor idle power. The higher power of some parts is offset by the system BIOS ...Profile 50 TDP 45 40 35 30 30 40 50 60 70 80 90 100 110 Watts TCONTROL TCONTROL defines the maximum operating temperature for TCONTROL is calculated such that they should have similar acoustic performance for a discussion on thermal management logic and features and ...
...a very specific processor operating region where fan speed can be reduced. Refer to the appropriate datasheet for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is the processor idle power. The higher power of some parts is offset by the system BIOS ...Profile 50 TDP 45 40 35 30 30 40 50 60 70 80 90 100 110 Watts TCONTROL TCONTROL defines the maximum operating temperature for TCONTROL is calculated such that they should have similar acoustic performance for a discussion on thermal management logic and features and ...
Design Guide
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...surface exposed to the flow includes in the chassis. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for the motherboard form factor of interest. A heatsink can... (and heavier) than active heatsinks due to the increase in the area potentially impacted by the local ambient temperature of the heatsink must comply with the requirements and recommendations published for details on which heat transfer takes place....
...surface exposed to the flow includes in the chassis. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for the motherboard form factor of interest. A heatsink can... (and heavier) than active heatsinks due to the increase in the area potentially impacted by the local ambient temperature of the heatsink must comply with the requirements and recommendations published for details on which heat transfer takes place....
Design Guide
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...Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38-40°C with 15-25 CFM of airflow at the inlet of fans and vents determine the chassis thermal performance, and the resulting ambient temperature... TDP. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Additional constraints are described in air...
...Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38-40°C with 15-25 CFM of airflow at the inlet of fans and vents determine the chassis thermal performance, and the resulting ambient temperature... TDP. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Additional constraints are described in air...
Design Guide
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...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 The case-to-local ambient thermal characterization parameter ...characterization parameter of the TIM between the heatsink and IHS. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and ...
...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 The case-to-local ambient thermal characterization parameter ...characterization parameter of the TIM between the heatsink and IHS. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and ...
Design Guide
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...E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink. It is 100 W and the maximum case temperature from above : • The case temperature TC-MAX...LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is dependent on the air velocity through the fins of the heatsink to establish a design strategy. TA) / TDP = (67 - 38) / 100 = 0.29 °C/W Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160...
...E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink. It is 100 W and the maximum case temperature from above : • The case temperature TC-MAX...LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is dependent on the air velocity through the fins of the heatsink to establish a design strategy. TA) / TDP = (67 - 38) / 100 = 0.29 °C/W Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160...
Design Guide
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... 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 23 for a copy of the latest release of the thermal solution on real processors and on fully integrated systems The Intel maximum power application enables steady power dissipation on the case temperature. Typical distance from actual processors...
... 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 23 for a copy of the latest release of the thermal solution on real processors and on fully integrated systems The Intel maximum power application enables steady power dissipation on the case temperature. Typical distance from actual processors...
Design Guide
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... active heatsink with a live motherboard, add-in these conditions, it is meant to minimize the effect of the temperature sensor used by the fan to Scale Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 24 October 2007 Order Number: 315279 - 003US Otherwise, when doing a bench top test at its...
... active heatsink with a live motherboard, add-in these conditions, it is meant to minimize the effect of the temperature sensor used by the fan to Scale Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 24 October 2007 Order Number: 315279 - 003US Otherwise, when doing a bench top test at its...
Design Guide
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... Appendix C defines a reference procedure for attaching a thermocouple to ensure an accurate temperature measurement. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. This procedure takes into account the specific features of the 775-...the geometric center of the LGA775 socket for TC measurement. The measurement errors could be introduced in the datasheet. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 25 Figure ...
... Appendix C defines a reference procedure for attaching a thermocouple to ensure an accurate temperature measurement. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. This procedure takes into account the specific features of the 775-...the geometric center of the LGA775 socket for TC measurement. The measurement errors could be introduced in the datasheet. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 25 Figure ...
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..., F = frequency). An on the processor. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor Feature 4.0... 4.1 4.2 Thermal Management Logic and Thermal Monitor Feature Processor Power Dissipation An increase in Section 4.2.3. Thermal Monitor Implementation The Thermal Monitor consists of TCC via PROCHOT# signal). • FORCEPR# signal that will attempt to reduce processor temperature...
..., F = frequency). An on the processor. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor Feature 4.0... 4.1 4.2 Thermal Management Logic and Thermal Monitor Feature Processor Power Dissipation An increase in Section 4.2.3. Thermal Monitor Implementation The Thermal Monitor consists of TCC via PROCHOT# signal). • FORCEPR# signal that will attempt to reduce processor temperature...
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... to lower the processor temperature by the PROCHOT# signal going active. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are disabled is fixed for a particular processor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 27 Thermal...
... to lower the processor temperature by the PROCHOT# signal going active. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are disabled is fixed for a particular processor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 27 Thermal...