Design Guide
Page 13
... the life of the socket seating plane above the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance...motherboard and the system have to the required minimum load. Package pull-out during mechanical shock and vibration is required to applied pressure. Heatsink Clip Load Requirement The attach mechanism for protecting LGA775 socket solder joints. This means that the load applied by the heatsink attach mechanism must support...
... the life of the socket seating plane above the motherboard. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance...motherboard and the system have to the required minimum load. Package pull-out during mechanical shock and vibration is required to applied pressure. Heatsink Clip Load Requirement The attach mechanism for protecting LGA775 socket solder joints. This means that the load applied by the heatsink attach mechanism must support...
Design Guide
Page 43
... of the processor. Intel® Quiet System Technology (Intel® QST)-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 6.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is generated using the Intel provided Configuration Tool. Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for...
... of the processor. Intel® Quiet System Technology (Intel® QST)-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 6.3 Intel® QST Configuration and Tuning Initial configuration of the Intel QST is generated using the Intel provided Configuration Tool. Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for...