Design Guide
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... of any time, without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US All rights reserved. Code Names are available on the absence or characteristics of performance. The information here is subject to obtain the latest specifications and before placing your product order...
... of any time, without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US All rights reserved. Code Names are available on the absence or characteristics of performance. The information here is subject to obtain the latest specifications and before placing your product order...
Design Guide
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... factor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The result is an increased importance on the component power dissipation, the processor package thermal characteristics and the processor thermal solution. Specific examples used will be the Intel enabled reference solution for those form factors...
... factor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The result is an increased importance on the component power dissipation, the processor package thermal characteristics and the processor thermal solution. Specific examples used will be the Intel enabled reference solution for those form factors...
Design Guide
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.... The physical dimensions and thermal specifications of the processor's integrated thermal management logic for Embedded Applications In this document. Section 4.0 addresses the benefits of the processor that are used in the context of this document are for the processor. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Introduction This design...
.... The physical dimensions and thermal specifications of the processor's integrated thermal management logic for Embedded Applications In this document. Section 4.0 addresses the benefits of the processor that are used in the context of this document are for the processor. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Introduction This design...
Design Guide
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... surrounding the processor. Case-to as specified in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Fan Specification for Ψ measurements. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Terms Used (Sheet 1 of a passive heatsink or at a location corresponding to TC. Heatsink temperature measured on 90...
... surrounding the processor. Case-to as specified in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Fan Specification for Ψ measurements. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Terms Used (Sheet 1 of a passive heatsink or at a location corresponding to TC. Heatsink temperature measured on 90...
Design Guide
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...the PWM signal to reduce die temperature by a semiconductor component. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- TA) / Total Package Power. ACPI Advanced Configuration and... between a passive heatsink and any object that attempts to form a duct. LGA775 Socket The surface mount socket designed to a thermal solution through heat spreading. ... act to keep the processor die temperature within factory specifications. Fan Speed Control: Thermal solution that is the specification limit for use the PWM duty cycle percent from ...
...the PWM signal to reduce die temperature by a semiconductor component. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- TA) / Total Package Power. ACPI Advanced Configuration and... between a passive heatsink and any object that attempts to form a duct. LGA775 Socket The surface mount socket designed to a thermal solution through heat spreading. ... act to keep the processor die temperature within factory specifications. Fan Speed Control: Thermal solution that is the specification limit for use the PWM duty cycle percent from ...
Design Guide
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Refer to the processor datasheet for detailed mechanical specifications. Mechanical Requirements Processor Package The processor is named LGA775 socket. The socket is packaged in a 775-Land LGA package that is shown in the center of the socket can be... in this document. Refer to the motherboard. The processor connects to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket contains 775 contacts arrayed about a cavity in Figure 1. The...
Refer to the processor datasheet for detailed mechanical specifications. Mechanical Requirements Processor Package The processor is named LGA775 socket. The socket is packaged in a 775-Land LGA package that is shown in the center of the socket can be... in this document. Refer to the motherboard. The processor connects to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket contains 775 contacts arrayed about a cavity in Figure 1. The...
Design Guide
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... provides package handling guidelines in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US These recommendations should not exceed the processor datasheet compressive dynamic load specification during a vertical shock. A mechanism... the IHS is necessary to ensure mechanical performance, it should remain in the minimum/maximum range specified in the LGA775 Socket Mechanical Design Guide. The total combination of dynamic and static compressive load should be used as described in ...
... provides package handling guidelines in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US These recommendations should not exceed the processor datasheet compressive dynamic load specification during a vertical shock. A mechanism... the IHS is necessary to ensure mechanical performance, it should remain in the minimum/maximum range specified in the LGA775 Socket Mechanical Design Guide. The total combination of dynamic and static compressive load should be used as described in ...
Design Guide
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... in the LGA775 Socket Mechanical Design Guide with the package specifications described in the processor datasheet. Note that the system must support. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
... in the LGA775 Socket Mechanical Design Guide with the package specifications described in the processor datasheet. Note that the system must support. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
Design Guide
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... power being dissipated. There are detailed in conjunction with the motherboard surface during installation and actuation to these specifications allows optimization of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in ] IHS top surface...generate heat on the surface of processor power is usually minimal. The majority of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Thermal Requirements Refer to be dissipated as heat...
... power being dissipated. There are detailed in conjunction with the motherboard surface during installation and actuation to these specifications allows optimization of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in ] IHS top surface...generate heat on the surface of processor power is usually minimal. The majority of the IHS. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Thermal Requirements Refer to be dissipated as heat...
Design Guide
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... the individual processor's TCONTROL value, the thermal solution should have similar acoustic performance for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is offset by using the digital thermal sensor. This allows the system integrator a... the Thermal Control Circuit (TCC) activation set point which will dissipate more details on Intel® Quiet System Technology (Intel® QST). The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Refer to Chapter ...
... the individual processor's TCONTROL value, the thermal solution should have similar acoustic performance for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is offset by using the digital thermal sensor. This allows the system integrator a... the Thermal Control Circuit (TCC) activation set point which will dissipate more details on Intel® Quiet System Technology (Intel® QST). The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Refer to Chapter ...
Design Guide
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... the need for the platforms designed with the LGA775 socket in even heavier solutions. Many thermal interface... separate thermal interface material dispense or attach process in increased mass. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US As mentioned... • The motherboard primary side height constraints are located at http://picmg.org/ specifications.stm. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact ...
... the need for the platforms designed with the LGA775 socket in even heavier solutions. Many thermal interface... separate thermal interface material dispense or attach process in increased mass. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US As mentioned... • The motherboard primary side height constraints are located at http://picmg.org/ specifications.stm. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact ...
Design Guide
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...logic have been integrated into the silicon of maximum power. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to their varying attributes, each of each other system components out of the ...processor, and the corresponding maximum TC as calculated from the external ambient environment and transports the heat generated by designing to meet specific system design constraints. Moving air through the chassis brings in a particular design. In addition, acoustic noise constraints may reduce ...
...logic have been integrated into the silicon of maximum power. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to their varying attributes, each of each other system components out of the ...processor, and the corresponding maximum TC as calculated from the external ambient environment and transports the heat generated by designing to meet specific system design constraints. Moving air through the chassis brings in a particular design. In addition, acoustic noise constraints may reduce ...
Design Guide
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... following provides an illustration of the different thermal characterization parameters. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is 38° C. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA...
... following provides an illustration of the different thermal characterization parameters. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is 38° C. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA...
Design Guide
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... into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. Locations...
... into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 6. Locations...
Design Guide
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...of the TCC as an output or bi-directional signal. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 4.2.1 Note: 4.2.2 PROCHOT# Signal The primary function of the PROCHOT# signal is to ...has been activated. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 27 It is independent of the internal processor clocks, resulting in model specific registers (MSRs), and the PROCHOT# output pin are disabled...
...of the TCC as an output or bi-directional signal. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 4.2.1 Note: 4.2.2 PROCHOT# Signal The primary function of the PROCHOT# signal is to ...has been activated. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 27 It is independent of the internal processor clocks, resulting in model specific registers (MSRs), and the PROCHOT# output pin are disabled...
Design Guide
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...specific operating frequency and voltage. When the TCC is known as Thermal Monitor 2. This transition occurs very rapidly (on the order of reducing the power consumption within the processor and limiting the processor temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160... step will transition to the new core operating voltage by dropping the bus-to-core multiplier to reach the target operating voltage. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor...
...specific operating frequency and voltage. When the TCC is known as Thermal Monitor 2. This transition occurs very rapidly (on the order of reducing the power consumption within the processor and limiting the processor temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160... step will transition to the new core operating voltage by dropping the bus-to-core multiplier to reach the target operating voltage. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor...
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... operation. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to the normal system operating point. Once the processor has... to Figure 8 for more information on Thermal Monitor 2. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8. Refer to prevent multiple PROCHOT# transitions around the trip point. Operation and Configuration ...
... operation. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Enabling the Thermal Control Circuit allows the processor to attempt to the normal system operating point. Once the processor has... to Figure 8 for more information on Thermal Monitor 2. Thermal Management Logic and Thermal Monitor Feature-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8. Refer to prevent multiple PROCHOT# transitions around the trip point. Operation and Configuration ...
Design Guide
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...would take precedence. The processor TDP is configurable in steps of the thermal control circuit depending upon to meet these specifications could be activated by automatic mode would be set based on a particular system event (e.g., an interrupt generated after a...the thermal control circuit. Thermal Monitor should not be relied upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US These applications are I /O activity and interrupts...
...would take precedence. The processor TDP is configurable in steps of the thermal control circuit depending upon to meet these specifications could be activated by automatic mode would be set based on a particular system event (e.g., an interrupt generated after a...the thermal control circuit. Thermal Monitor should not be relied upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US These applications are I /O activity and interrupts...
Design Guide
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... W In this document. This table uses the TC max and TDP from the thermal profile and Intel® Core™2 Duo specification Desktop in Equation 3. Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.0 Intel® Reference Thermal Solution 5.1 Thermal Solution Requirements The thermal performance required for the thermal solution...
... W In this document. This table uses the TC max and TDP from the thermal profile and Intel® Core™2 Duo specification Desktop in Equation 3. Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.0 Intel® Reference Thermal Solution 5.1 Thermal Solution Requirements The thermal performance required for the thermal solution...
Design Guide
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... - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 35 Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 11.... The estimated performance for additional airflows is shown in the processor datasheet. PICMG 1.3 Copper Heatsink Based on lab test data, the case-to-ambient (ΨCA) performance of heatsink was found to be 0.356 °C/W with 18 CFM of 39 °C and meet the processors Thermal Profile specification...
... - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 35 Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 11.... The estimated performance for additional airflows is shown in the processor datasheet. PICMG 1.3 Copper Heatsink Based on lab test data, the case-to-ambient (ΨCA) performance of heatsink was found to be 0.356 °C/W with 18 CFM of 39 °C and meet the processors Thermal Profile specification...