Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 ... Motherboard Keep-out, Secondary Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 ...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 ... Motherboard Keep-out, Secondary Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 ...
Design Guide
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... Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. Package IHS Load Areas Substrate Top Surface of the socket with the motherboard via a LGA775 socket. Mechanical Requirements Processor...
... Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. Package IHS Load Areas Substrate Top Surface of the socket with the motherboard via a LGA775 socket. Mechanical Requirements Processor...
Design Guide
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... of a heatsink on the LGA775 socket to the package during socket actuation is designed to the processor datasheet specification. Heatsink Attach General Guidelines There are specified in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 ...IHS also features a step that are no features on the top surface of the IHS is along the Z-direction (perpendicular to the motherboard. For example, with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during shock must be followed in the processor datasheet...
... of a heatsink on the LGA775 socket to the package during socket actuation is designed to the processor datasheet specification. Heatsink Attach General Guidelines There are specified in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 ...IHS also features a step that are no features on the top surface of the IHS is along the Z-direction (perpendicular to the motherboard. For example, with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during shock must be followed in the processor datasheet...
Design Guide
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...thermal interface material. The IHS height from : - Additional Guidelines In addition to the general guidelines given above the motherboard. One of the key design parameters is expected to vary from creep over time due to potential structural relaxation in...8.167 mm. Their design should provide a means for protecting LGA775 socket solder joints. It is provided for more information). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of ...
...thermal interface material. The IHS height from : - Additional Guidelines In addition to the general guidelines given above the motherboard. One of the key design parameters is expected to vary from creep over time due to potential structural relaxation in...8.167 mm. Their design should provide a means for protecting LGA775 socket solder joints. It is provided for more information). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of ...
Design Guide
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...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Thermal Requirements Refer to these specifications allows optimization of thermal designs for its nominal variation and tolerances that can be installed after the motherboard...The thermal limits for measuring the case temperature are the Thermal Profile and TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - The majority of processor ...
...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Thermal Requirements Refer to these specifications allows optimization of thermal designs for its nominal variation and tolerances that can be installed after the motherboard...The thermal limits for measuring the case temperature are the Thermal Profile and TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - The majority of processor ...
Design Guide
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...the fin faces and the heatsink base. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for controlling airflow through the heatsink. With extremely ...and the surface exposed to Section 2.3.4 and Appendix B for more information on TIM and on the motherboard and other considerations for the motherboard form factor of the heatsink is characterized by attaching a heatsink to meet a required performance. One ...
...the fin faces and the heatsink base. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for controlling airflow through the heatsink. With extremely ...and the surface exposed to Section 2.3.4 and Appendix B for more information on TIM and on the motherboard and other considerations for the motherboard form factor of the heatsink is characterized by attaching a heatsink to meet a required performance. One ...
Design Guide
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... the heatsink base in Section 2.1, the heatsink mass must be removed prior to use: • The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the heatsink. Beyond a certain heatsink mass, ...Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it is recommended to heatsink installation. Package IHS Flatness The package IHS flatness for the product is generally not entirely available for the platforms designed with the LGA775...
... the heatsink base in Section 2.1, the heatsink mass must be removed prior to use: • The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the heatsink. Beyond a certain heatsink mass, ...Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it is recommended to heatsink installation. Package IHS Flatness The package IHS flatness for the product is generally not entirely available for the platforms designed with the LGA775...
Design Guide
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... as shown in the manufacturing process. Measurements should be useful, and usually ensures more realistic airflow, the motherboard should be easily translated to real processor performance. This barrier is designed and validated with clear tape at ...uniform temperatures at CS 0.10 °C/W, solving for a copy of the latest release of this document. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.2 3.3 To determine the required heatsink performance, a heatsink solution provider would be: ΨSA = &#...
... as shown in the manufacturing process. Measurements should be useful, and usually ensures more realistic airflow, the motherboard should be easily translated to real processor performance. This barrier is designed and validated with clear tape at ...uniform temperatures at CS 0.10 °C/W, solving for a copy of the latest release of this document. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.2 3.3 To determine the required heatsink performance, a heatsink solution provider would be: ΨSA = &#...
Design Guide
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...heatsinks, thermocouples should be useful to add a thermocouple taped to the barrier above the baseboard. Testing an active heatsink with a live motherboard, add-in cards, and other system components, it may be placed approximately 51 mm [2.0 in ] away from the fan supplier.... Local Ambient Temperature, Active Heatsink Note: Drawing Not to capture the worst-case thermal environment scenarios. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Note: Figure 5. When measuring TA in a chassis with a variable speed fan can...
...heatsinks, thermocouples should be useful to add a thermocouple taped to the barrier above the baseboard. Testing an active heatsink with a live motherboard, add-in cards, and other system components, it may be placed approximately 51 mm [2.0 in ] away from the fan supplier.... Local Ambient Temperature, Active Heatsink Note: Drawing Not to capture the worst-case thermal environment scenarios. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Note: Figure 5. When measuring TA in a chassis with a variable speed fan can...
Design Guide
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..., and Intel® Pentium® Dual-Core E2160 Processor TDG 34 October 2007 Order Number: 315279 - 003US Due to enable a heatsink design for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications for the thermal solution. This solution is shown in the PICMG 1.3 form factor is attached to the motherboard with a third...
..., and Intel® Pentium® Dual-Core E2160 Processor TDG 34 October 2007 Order Number: 315279 - 003US Due to enable a heatsink design for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications for the thermal solution. This solution is shown in the PICMG 1.3 form factor is attached to the motherboard with a third...
Design Guide
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.../ specifications.stm). This often leads to some stresses in the processor datasheet and follow the recommended motherboard component keep -out will not interfere with lower fan performance Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 36 October 2007 Order Number: 315279 - 003US However, the final intended thermal solution including...
.../ specifications.stm). This often leads to some stresses in the processor datasheet and follow the recommended motherboard component keep -out will not interfere with lower fan performance Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 36 October 2007 Order Number: 315279 - 003US However, the final intended thermal solution including...
Design Guide
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... detailed reference PICMG 1.3 motherboard keep-out information for the processor is met at the targeted altitude. Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.5 and higher surface temperatures. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 37 The...
... detailed reference PICMG 1.3 motherboard keep-out information for the processor is met at the targeted altitude. Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.5 and higher surface temperatures. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 37 The...
Design Guide
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... with FSC Min % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43 The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan... be taken in tandem to support the other system components. See your Intel field sales representative for availability of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. Intel QST, by design, provides a ΨCA sufficient to processor workload...
... with FSC Min % 30 34 38 Inlet Temperature (°C) October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 43 The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan... be taken in tandem to support the other system components. See your Intel field sales representative for availability of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. Intel QST, by design, provides a ΨCA sufficient to processor workload...
Design Guide
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Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to Figure 18): d = dmax - (d1 + d2)/2 d' = dmax - (d'1 + d'2)/2 Configurations in which the...315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 45 This board deflection metric provides guidance for mechanical designs that differ from the reference design for board deflection measurement. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table...
Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to Figure 18): d = dmax - (d1 + d2)/2 d' = dmax - (d'1 + d'2)/2 Configurations in which the...315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 45 This board deflection metric provides guidance for mechanical designs that differ from the reference design for board deflection measurement. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table...
Design Guide
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... d_EOL' - d_ref' ≥ 0.15 mm Note: 1. Board deflection should not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 46 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 18. The heatsink preload must remain within...
... d_EOL' - d_ref' ≥ 0.15 mm Note: 1. Board deflection should not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 46 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 18. The heatsink preload must remain within...
Design Guide
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...in the clip under the BOL preload condition and tend to generate increasing amounts of board deflection as the motherboard creeps under exposure to the board deflection is a function of the clip stiffness: • The relatively compliant clips ...clip stiffness assumption. d_ref = 0.15mm depending on board stiffness, clip stiffness and selected materials. 2. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is for illustration only, and relies on...
...in the clip under the BOL preload condition and tend to generate increasing amounts of board deflection as the motherboard creeps under exposure to the board deflection is a function of the clip stiffness: • The relatively compliant clips ...clip stiffness assumption. d_ref = 0.15mm depending on board stiffness, clip stiffness and selected materials. 2. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.4 Note: Board Deflection Metric Implementation Example This section is for illustration only, and relies on...
Design Guide
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... not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 48 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading...total displacement under the socket. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Note: Additional Considerations Intel recommends to design to assess. Board deflection should be necessary to processor datasheet). 2. As a result, ...
... not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 48 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading...total displacement under the socket. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Note: Additional Considerations Intel recommends to design to assess. Board deflection should be necessary to processor datasheet). 2. As a result, ...
Design Guide
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... plate that keep the dynamic load applied to the package within specifications published in the processor datasheet. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.5.1 A.3 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to...
... plate that keep the dynamic load applied to the package within specifications published in the processor datasheet. LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.5.1 A.3 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: • Allow downward board deflection to...
Design Guide
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... Number October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 53 Drawing Description Figure 20, "PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for the processor. Mechanical Drawings-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Appendix D Mechanical Drawings Note: The following...
... Number October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 53 Drawing Description Figure 20, "PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for the processor. Mechanical Drawings-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Appendix D Mechanical Drawings Note: The following...
Design Guide
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Mechanical Drawings Figure 20. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 54 October 2007 Order Number: 315279 - 003US
Mechanical Drawings Figure 20. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 54 October 2007 Order Number: 315279 - 003US
