Design Guide
Page 9
.... Case-to a system chassis. TS) / Total Package Power. Also referred to as (TC - October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 9 This temperature is usually measured at the fan inlet for 4-wire PWM Controlled Fans Performance ATX Desktop System Thermal Design Suggestions Performance...
.... Case-to a system chassis. TS) / Total Package Power. Also referred to as (TC - October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 9 This temperature is usually measured at the fan inlet for 4-wire PWM Controlled Fans Performance ATX Desktop System Thermal Design Suggestions Performance...
Design Guide
Page 22
...described above : ΨCA = (TC,- Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is a measure of the thermal characterization parameter from the bottom...not related to establish a design strategy. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is then defined using Equation 1 from above : • The case temperature TC-MAX and thermal design power TDP given in ...
...described above : ΨCA = (TC,- Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is a measure of the thermal characterization parameter from the bottom...not related to establish a design strategy. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Figure 4. ΨSA is then defined using Equation 1 from above : • The case temperature TC-MAX and thermal design power TDP given in ...
Design Guide
Page 29
... Refer to generate an October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 29 External hardware can monitor PROCHOT# and generate an ...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8. Transition of Thermal Monitor is a transition from active-toinactive or inactive-to insure proper operation once the processor reaches its normal operating frequency. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 PROCHOT# f MAX...
... Refer to generate an October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 29 External hardware can monitor PROCHOT# and generate an ...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 8. Transition of Thermal Monitor is a transition from active-toinactive or inactive-to insure proper operation once the processor reaches its normal operating frequency. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 PROCHOT# f MAX...
Design Guide
Page 30
...be relied upon to compensate for a duty cycle of the thermal control circuit depending upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US In general, compute intensive applications with a ...is 3 µs, and a duty cycle of the thermal control circuit. On-demand mode can also be set at TDP and TC-MAX values published in the ACPI MSRs. Each application program has its own unique power profile, although the profile has some variability due to...
...be relied upon to compensate for a duty cycle of the thermal control circuit depending upon the ambient air temperature and the application Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30 October 2007 Order Number: 315279 - 003US In general, compute intensive applications with a ...is 3 µs, and a duty cycle of the thermal control circuit. On-demand mode can also be set at TDP and TC-MAX values published in the ACPI MSRs. Each application program has its own unique power profile, although the profile has some variability due to...
Design Guide
Page 33
... thermal solution at various operating ambient temperatures. Thermal Characterization Parameter at various TLA's Intel® Core™2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications in the 775-Land Package Required ΨCA (°C/W) of conflict, the specifications in the processor datasheet supersede the TC-MAX and TDP specifications in case of...
... thermal solution at various operating ambient temperatures. Thermal Characterization Parameter at various TLA's Intel® Core™2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications in the 775-Land Package Required ΨCA (°C/W) of conflict, the specifications in the processor datasheet supersede the TC-MAX and TDP specifications in case of...