Design Guide
Page 2
... specifications and product descriptions at any features or instructions marked "reserved" or "undefined." Copies of Intel Corporation in this information. They are not intended to change without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Code Names are not intended for conflicts or...
... specifications and product descriptions at any features or instructions marked "reserved" or "undefined." Copies of Intel Corporation in this information. They are not intended to change without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Code Names are not intended for conflicts or...
Design Guide
Page 3
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16 2.3 Heatsink Design Considerations...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 Definition of Terms 9 2.0 Processor Thermal/Mechanical Information 11 2.1 Mechanical Requirements 11 2.1.1 Processor Package 11 2.1.2 Heatsink Attach 12 2.2 Thermal Requirements 14 2.2.1 Processor Case Temperature 14 2.2.2 Thermal Profile 15 2.2.3 TCONTROL 16 2.3 Heatsink Design Considerations...
Design Guide
Page 4
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
Design Guide
Page 5
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for ...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for ...
Design Guide
Page 6
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US
Design Guide
Page 7
...to ensure that thermal design requirements are met for the processor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 All of these thermal characteristics and discuss guidelines ...component may be required to provide adequate cooling for each component, including the processor, in the system. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management...
...to ensure that thermal design requirements are met for the processor. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 All of these thermal characteristics and discuss guidelines ...component may be required to provide adequate cooling for each component, including the processor, in the system. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management...
Design Guide
Page 8
... Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Section 2.0 discusses the thermal solution considerations and metrology recommendations to the datasheet for illustration only. Section 6.0 discusses the implementation of the processor that are for the product dimensions, thermal power dissipation and maximum case temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG...
... Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Section 2.0 discusses the thermal solution considerations and metrology recommendations to the datasheet for illustration only. Section 6.0 discusses the implementation of the processor that are for the product dimensions, thermal power dissipation and maximum case temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG...
Design Guide
Page 9
... Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines Intel® Pentium® 4 Processor...
... Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines Intel® Pentium® 4 Processor...
Design Guide
Page 10
...is the specification limit for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US TA) / Total ...processor that can be expressed as (TS - TMA Thermal Module Assembly. LGA775 Socket The surface mount socket designed to the heatsink. A measure of reading the processor temperature and providing the PWM signal to dissipate the thermal design power. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
...is the specification limit for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US TA) / Total ...processor that can be expressed as (TS - TMA Thermal Module Assembly. LGA775 Socket The surface mount socket designed to the heatsink. A measure of reading the processor temperature and providing the PWM signal to dissipate the thermal design power. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
Design Guide
Page 11
... spreader (IHS) that is named LGA775 socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. The processor connects to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket is shown...
... spreader (IHS) that is named LGA775 socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1. The processor connects to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 The socket is shown...
Design Guide
Page 12
... plays a significant role in the robustness of the system in approximately a 539 N [117 lbf] dynamic load on the LGA775 socket to directly attach a heatsink. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.1.2 2.1.2.1 The primary function of the IHS is to transfer the non-uniform heat distribution from the...
... plays a significant role in the robustness of the system in approximately a 539 N [117 lbf] dynamic load on the LGA775 socket to directly attach a heatsink. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.1.2 2.1.2.1 The primary function of the IHS is to transfer the non-uniform heat distribution from the...
Design Guide
Page 13
..., the better the initial performance. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring...Intel® Core™2 Duo desktop processor E6000 Sequence. Note that , depending on designs departing from 7.517 mm to the LGA775 Socket Mechanical Design Guide for more information). The IHS height from the top of the product. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
..., the better the initial performance. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring...Intel® Core™2 Duo desktop processor E6000 Sequence. Note that , depending on designs departing from 7.517 mm to the LGA775 Socket Mechanical Design Guide for more information). The IHS height from the top of the product. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...
Design Guide
Page 14
... been installed into the socket is defined as the temperature measured at the geometric center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The Thermal Profile defines the maximum case temperature as heat through the IHS...
... been installed into the socket is defined as the temperature measured at the geometric center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The Thermal Profile defines the maximum case temperature as heat through the IHS...
Design Guide
Page 15
... LGA Package Thermal and Mechanical Design Guidelines, available on www.intel.com for the thermal profile. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 By design, the thermal solutions must meet the... thermal profile for a processor dissipating 70W, the maximum case temperature is plotted on...
... LGA Package Thermal and Mechanical Design Guidelines, available on www.intel.com for the thermal profile. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 By design, the thermal solutions must meet the... thermal profile for a processor dissipating 70W, the maximum case temperature is plotted on...
Design Guide
Page 16
... thermal sensor. Refer to the processor thermal specification. The result can be a negative number. A thermal solution designed to program a fan speed control component. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3.
... thermal sensor. Refer to the processor thermal specification. The result can be a negative number. A thermal solution designed to program a fan speed control component. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3.
Design Guide
Page 17
... performance of the IHS and into the surrounding air through it in particular the fin faces and the heatsink base. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to it. Providing a direct conduction path from the heat source to the airflow increases, and it is more...
... performance of the IHS and into the surrounding air through it in particular the fin faces and the heatsink base. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to it. Providing a direct conduction path from the heat source to the airflow increases, and it is more...
Design Guide
Page 18
...Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it is recommended to use: • The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775... to heatsink installation. All thermal interface materials should be used , it . Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US The insertion of the heatsink...
...Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it is recommended to use: • The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775... to heatsink installation. All thermal interface materials should be used , it . Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 18 October 2007 Order Number: 315279 -003US The insertion of the heatsink...
Design Guide
Page 19
... noise constraints may reduce the thermal solution cost by designing to air thermal characterization parameter). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38...
... noise constraints may reduce the thermal solution cost by designing to air thermal characterization parameter). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis delivers a maximum TA of 38...
Design Guide
Page 42
... the SST bus. Contact your Intel Field Sales representative for the current list of thermal / voltage sensors to provide devices for your design. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 42 October 2007 Order Number:315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology...
... the SST bus. Contact your Intel Field Sales representative for the current list of thermal / voltage sensors to provide devices for your design. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 42 October 2007 Order Number:315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology...
Design Guide
Page 51
... - October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 51 In addition, a video that shows the process in real time - For information on case temperature reference setup, tool use, and approach, please refer to the IHS of the LGA775 socket for which it is available...
... - October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 51 In addition, a video that shows the process in real time - For information on case temperature reference setup, tool use, and approach, please refer to the IHS of the LGA775 socket for which it is available...