Design Guide
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... not finalize a design with this document may contain design defects or errors known as the property of any time, without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Intel reserves these for products. The products described in nuclear facility applications. Leap ahead...
... not finalize a design with this document may contain design defects or errors known as the property of any time, without notice. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Intel reserves these for products. The products described in nuclear facility applications. Leap ahead...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
Design Guide
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...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
Design Guide
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Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
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... on the type of this component. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The system level thermal constraints consist of these parameters are applicable ...The processor temperature depends on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and ...
... on the type of this component. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The system level thermal constraints consist of these parameters are applicable ...The processor temperature depends on single processor systems using the Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and ...
Design Guide
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... metrology recommendations to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Section 5.0 gives information on a specific processor, reference the specific processor datasheet. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007...
... metrology recommendations to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet. Section 5.0 gives information on a specific processor, reference the specific processor datasheet. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007...
Design Guide
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...003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core...
...003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor...Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel® Core™2 Processor and Intel® Pentium® Dual Core...
Design Guide
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...heat spreading. The enabled 4 wire fans use with the on worst-case applications. Terms Used (Sheet 2 of the PWM signal. LGA775 Socket The surface mount socket designed to reduce die temperature by a semiconductor component. For this example, it can act to modulate the ...limit for use the PWM duty cycle percent from the outside dimension of controlling a variable speed fan. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that is ...
...heat spreading. The enabled 4 wire fans use with the on worst-case applications. Terms Used (Sheet 2 of the PWM signal. LGA775 Socket The surface mount socket designed to reduce die temperature by a semiconductor component. For this example, it can act to modulate the ...limit for use the PWM duty cycle percent from the outside dimension of controlling a variable speed fan. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that is ...
Design Guide
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... to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Mechanical Requirements Processor Package The processor is packaged in Figure 1. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical...
... to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Mechanical Requirements Processor Package The processor is packaged in Figure 1. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical...
Design Guide
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...should not be used as described in the processor datasheet. Heatsink Attach General Guidelines There are specified in the LGA775 Socket Mechanical Design Guide. After actuation of the socket load plate, the seating plane of the package is...specified in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to the processor datasheet specification. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical...
...should not be used as described in the processor datasheet. Heatsink Attach General Guidelines There are specified in the LGA775 Socket Mechanical Design Guide. After actuation of the socket load plate, the seating plane of the package is...specified in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to the processor datasheet specification. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical...
Design Guide
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... vibration events. Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for protecting LGA775 socket solder joints. Designs should create a static preload on the package between the IHS and the heatsink. ...for designs compliant with the package specifications described in the processor datasheet. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM...
... vibration events. Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for protecting LGA775 socket solder joints. Designs should create a static preload on the package between the IHS and the heatsink. ...for designs compliant with the package specifications described in the processor datasheet. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the thermal interface material (TIM...
Design Guide
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...dissipated. Processor Case Temperature For the processor, the case temperature is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The height of the ... case of special tools. For illustration, Figure 2 shows the measurement location for the processor thermal specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Designing to the datasheet for a 37.5 mm x...
...dissipated. Processor Case Temperature For the processor, the case temperature is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The height of the ... case of special tools. For illustration, Figure 2 shows the measurement location for the processor thermal specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Designing to the datasheet for a 37.5 mm x...
Design Guide
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...determine compliance to determine the maximum case temperature. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 The intercept on the Thermal Profile to the thermal profile, a ...all system operating conditions and processor power levels. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in thermal solution performance of ...
...determine compliance to determine the maximum case temperature. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 The intercept on the Thermal Profile to the thermal profile, a ...all system operating conditions and processor power levels. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in thermal solution performance of ...
Design Guide
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... for a discussion on thermal management logic and features and Chapter 6.0 on Intel® Quiet System Technology (Intel® QST). Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The TCONTROL value for the digital ...60 70 80 90 100 110 Watts TCONTROL TCONTROL defines the maximum operating temperature for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is offset by the digital thermal sensor. The TCONTROL parameter defines a very ...
... for a discussion on thermal management logic and features and Chapter 6.0 on Intel® Quiet System Technology (Intel® QST). Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The TCONTROL value for the digital ...60 70 80 90 100 110 Watts TCONTROL TCONTROL defines the maximum operating temperature for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is offset by the digital thermal sensor. The TCONTROL parameter defines a very ...
Design Guide
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...TA and the local air velocity over the surface. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Thermal interface material (TIM) is used to improve thermal performance is the ...the case of the airflow in the chassis. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on implementing a design using it in ...
...TA and the local air velocity over the surface. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Thermal interface material (TIM) is used to improve thermal performance is the ...the case of the airflow in the chassis. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on implementing a design using it in ...
Design Guide
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...://picmg.org/ specifications.stm. While socket loading alone may become prohibitive. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server... form factor, it . It is specified in the datasheet and can be pre-applied to the heatsink base prior to shipment from the IHS to compensate for the platforms designed with the LGA775...
...://picmg.org/ specifications.stm. While socket loading alone may become prohibitive. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server... form factor, it . It is specified in the datasheet and can be pre-applied to the heatsink base prior to shipment from the IHS to compensate for the platforms designed with the LGA775...
Design Guide
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... designing to air thermal characterization parameter). October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to passive heatsinks, fan heatsinks and system fans are ...in a particular design. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for the thermal requirements of ...
... designing to air thermal characterization parameter). October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to passive heatsinks, fan heatsinks and system fans are ...in a particular design. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for the thermal requirements of ...
Design Guide
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...; Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for package and heatsink installation and removal is also available. A video covering system integration is the System Assembly module. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Of...
...; Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for package and heatsink installation and removal is also available. A video covering system integration is the System Assembly module. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Of...
Design Guide
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... characterization parameter from heatsink-to validate a thermal solution. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to -local ambient...
... characterization parameter from heatsink-to validate a thermal solution. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to -local ambient...