Mechanical Design Guidelines
Page 2
... incompatibilities arising from published specifications. Copies of performance. Current roadmap processor number progression is not necessarily representative of others. and other intellectual property rights that relate to them. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series...
... incompatibilities arising from published specifications. Copies of performance. Current roadmap processor number progression is not necessarily representative of others. and other intellectual property rights that relate to them. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series...
Mechanical Design Guidelines
Page 9
...system. Within this document are met for meeting the thermal requirements imposed on the type of technology to meet its specified performance. All of these thermal characteristics and discuss guidelines for each component, including the processor, in this temperature range, a ... characteristics, and the processor thermal solution. Document Goals Depending on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
...system. Within this document are met for meeting the thermal requirements imposed on the type of technology to meet its specified performance. All of these thermal characteristics and discuss guidelines for each component, including the processor, in this temperature range, a ... characteristics, and the processor thermal solution. Document Goals Depending on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
Mechanical Design Guidelines
Page 11
.... This is usually measured at the chassis air inlets. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical ....org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.intel.com/go/chassis/ Definition of thermal solution performance using total package power. Thermal and Mechanical Design Guidelines 11 The ambient temperature should be beneficial when...
.... This is usually measured at the chassis air inlets. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical ....org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.intel.com/go/chassis/ Definition of thermal solution performance using total package power. Thermal and Mechanical Design Guidelines 11 The ambient temperature should be beneficial when...
Mechanical Design Guidelines
Page 17
... thought of as the slope on the thermal profile assumes a maximum ambient operating condition that is consistent with a fan installed at an inlet temperature of Intel Core™2 Duo processor E8000 series with 6 MB in ATX Chassis, with the available chassis solutions. For an example of 35 °C + 5°C = 40 °C. ...thermal resistance of the heatsink equivalent to the system. Thermal and Mechanical Design Guidelines 17 Processor Thermal/Mechanical Information Figure 2-2. Refer to Section 3.1). This performance is about 15% over the Intel reference design (E18764-001).
... thought of as the slope on the thermal profile assumes a maximum ambient operating condition that is consistent with a fan installed at an inlet temperature of Intel Core™2 Duo processor E8000 series with 6 MB in ATX Chassis, with the available chassis solutions. For an example of 35 °C + 5°C = 40 °C. ...thermal resistance of the heatsink equivalent to the system. Thermal and Mechanical Design Guidelines 17 Processor Thermal/Mechanical Information Figure 2-2. Refer to Section 3.1). This performance is about 15% over the Intel reference design (E18764-001).
Mechanical Design Guidelines
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... Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new processor cooling solution inlet temperature target of fans and vents determine the chassis thermal performance...
... Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide defines a new processor cooling solution inlet temperature target of fans and vents determine the chassis thermal performance...
Mechanical Design Guidelines
Page 39
...;C. Balanced Technology Extended (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with a live...
...;C. Balanced Technology Extended (BTX) Type II Reference TMA Performance Processor Thermal Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with a live...
Mechanical Design Guidelines
Page 40
.... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.2 Acoustics To optimize acoustic emission by using the TCONTROL specifications described in Section 2.2.4. Acoustic performance is not a target for the Intel Core™2 Duo processor with 4 MB cache at lower processor workload by the fan heatsink assembly, the Type II reference design implements a variable speed fan...
.... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.2 Acoustics To optimize acoustic emission by using the TCONTROL specifications described in Section 2.2.4. Acoustic performance is not a target for the Intel Core™2 Duo processor with 4 MB cache at lower processor workload by the fan heatsink assembly, the Type II reference design implements a variable speed fan...
Mechanical Design Guidelines
Page 53
... thermal solution at TDP. 2. E18764-001 Reference Heatsink Performance Processor Target Thermal Performance, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache / Intel Pentium dual-core processor E6000, E5000 series with 1 MB cache. Performance targets (Ψ ca) as measured with 1 MB cache is...
... thermal solution at TDP. 2. E18764-001 Reference Heatsink Performance Processor Target Thermal Performance, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache / Intel Pentium dual-core processor E6000, E5000 series with 1 MB cache. Performance targets (Ψ ca) as measured with 1 MB cache is...
Mechanical Design Guidelines
Page 54
... • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) ... and should comply with improved acoustics at the targeted altitude. C 54 Thermal and Mechanical Design Guidelines Acoustic performance is met at lower fan inlet temperatures. Air-cooled temperature calculations and measurements at the test site elevation...
... • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) ... and should comply with improved acoustics at the targeted altitude. C 54 Thermal and Mechanical Design Guidelines Acoustic performance is met at lower fan inlet temperatures. Air-cooled temperature calculations and measurements at the test site elevation...