Mechanical Design Guidelines
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... WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. Intel products are trademarks of its discretion to update specifications or product descriptions with information. Copies of future roadmaps. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components...
... WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. Intel products are trademarks of its discretion to update specifications or product descriptions with information. Copies of future roadmaps. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components...
Mechanical Design Guidelines
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...solution space and airflow typically become more transistors). Specific examples used will be required to provide adequate cooling for that form factor. Temperatures exceeding the maximum operating limit of a component may be the Intel enabled reference solution for ATX/uATX systems. ...met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The result is an increased ...
...solution space and airflow typically become more transistors). Specific examples used will be required to provide adequate cooling for that form factor. Temperatures exceeding the maximum operating limit of a component may be the Intel enabled reference solution for ATX/uATX systems. ...met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The result is an increased ...
Mechanical Design Guidelines
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... made to "the datasheet", the reader should refer to the Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet, Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel® Celeron® Processor E3000 Series Datasheet. If needed for clarify, the specific reference design will be referenced. Chapter 7 discusses the implementation...
... made to "the datasheet", the reader should refer to the Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet, Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel® Celeron® Processor E3000 Series Datasheet. If needed for clarify, the specific reference design will be referenced. Chapter 7 discusses the implementation...
Mechanical Design Guidelines
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Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for....formfactors.org/ http://www.formfactors.org/ http://www.intel.com/go/chassis/ Definition of thermal solution performance using total package power. This temperature is defined as specified in a component specification. Introduction 1.2 1.3 References Material and concepts available in...
Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for....formfactors.org/ http://www.formfactors.org/ http://www.intel.com/go/chassis/ Definition of thermal solution performance using total package power. This temperature is defined as specified in a component specification. Introduction 1.2 1.3 References Material and concepts available in...
Mechanical Design Guidelines
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...these is plotted on Intel Quiet System Technology (Intel QST). Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 ...result a processor with a high (closer to determine the maximum case temperature. The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Note: The TCONTROL value for the processor is relative to the...
...these is plotted on Intel Quiet System Technology (Intel QST). Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 ...result a processor with a high (closer to determine the maximum case temperature. The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Note: The TCONTROL value for the processor is relative to the...
Mechanical Design Guidelines
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... the thermal solution and the amount of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for the reference solutions and Intel Boxed Processor thermal solutions. The following tables show the TA requirements for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series...
... the thermal solution and the amount of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for the reference solutions and Intel Boxed Processor thermal solutions. The following tables show the TA requirements for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series...
Mechanical Design Guidelines
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...at higher fan inlet temperatures (TA) and the appropriate thermal performance with improved acoustics at lower processor workload by using the TCONTROL specifications described in ISO 9296 standard, and measured according to ISO 7779. 2. Acoustic performance is not a target for Case 2 will...speed limited by the fan heatsink assembly, the Type II reference design implements a variable speed fan. Table 5-2. Acoustic data for the Intel Core™2 Duo processor with 4 Wire PWM Controlled to meet the effective fan curve shown in the same a BTX S2 reference chassis and commercially ...
...at higher fan inlet temperatures (TA) and the appropriate thermal performance with improved acoustics at lower processor workload by using the TCONTROL specifications described in ISO 9296 standard, and measured according to ISO 7779. 2. Acoustic performance is not a target for Case 2 will...speed limited by the fan heatsink assembly, the Type II reference design implements a variable speed fan. Table 5-2. Acoustic data for the Intel Core™2 Duo processor with 4 Wire PWM Controlled to meet the effective fan curve shown in the same a BTX S2 reference chassis and commercially ...
Mechanical Design Guidelines
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...; 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB...adjusted to meet thermal specifications can be controlled by using the TCONTROL specifications described in ISO 9296 standard, and measured according to implement fan speed control capability based digital thermal sensor temperature. Intel recommendation is met at...
...; 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB...adjusted to meet thermal specifications can be controlled by using the TCONTROL specifications described in ISO 9296 standard, and measured according to implement fan speed control capability based digital thermal sensor temperature. Intel recommendation is met at...
Mechanical Design Guidelines
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... during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Solutions derived...Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to bend underneath the socket. For example, such a situation may occur when using a backing plate that keep the dynamic load applied to heatsink preloads exceeding package maximum load specification...
... during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Solutions derived...Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to bend underneath the socket. For example, such a situation may occur when using a backing plate that keep the dynamic load applied to heatsink preloads exceeding package maximum load specification...