Data Sheet
Page 2
... operate (including 32-bit operation) without notice. Processor numbers differentiate features within each processor family, not across different processor families. Intel may contain design defects or errors known as the property of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep® Technology. The Intel Pentium® dual-core processor E5000 series may make changes to obtain the...
... operate (including 32-bit operation) without notice. Processor numbers differentiate features within each processor family, not across different processor families. Intel may contain design defects or errors known as the property of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep® Technology. The Intel Pentium® dual-core processor E5000 series may make changes to obtain the...
Data Sheet
Page 7
Intel® Pentium® Dual-Core Processor E5000 Series Features • Available at 2.66 GHz, 2.50 GHz • Enhanced Intel Speedstep® Technology • Supports Intel® 64Φ architecture • Supports Execute Disable Bit capability • FSB ...CAD, games, multimedia, and multitasking user environments. Intel® 64Φ architecture enables the processor to execute operating systems and applications written to be marked as executable or non-executable. The Intel Pentium® dual-core processor E5000 series also includes the Execute Disable Bit capability...
Intel® Pentium® Dual-Core Processor E5000 Series Features • Available at 2.66 GHz, 2.50 GHz • Enhanced Intel Speedstep® Technology • Supports Intel® 64Φ architecture • Supports Execute Disable Bit capability • FSB ...CAD, games, multimedia, and multitasking user environments. Intel® 64Φ architecture enables the processor to execute operating systems and applications written to be marked as executable or non-executable. The Intel Pentium® dual-core processor E5000 series also includes the Execute Disable Bit capability...
Data Sheet
Page 9
... Grid Array (LGA) socket, referred to the Intel® Pentium® dual-core processor E5200 and E5300. Manufacturability is high, a nonmaskable interrupt has occurred. Datasheet 9 Introduction 1 Note: Note: 1.1 Introduction The Intel® Pentium® dual-core processor E5000 series is based on 45 nm process technology. In this document, the Intel® Pentium® dual-core processor E5000 series may be referred to the interface...
... Grid Array (LGA) socket, referred to the Intel® Pentium® dual-core processor E5200 and E5300. Manufacturability is high, a nonmaskable interrupt has occurred. Datasheet 9 Introduction 1 Note: Note: 1.1 Introduction The Intel® Pentium® dual-core processor E5000 series is based on 45 nm process technology. In this document, the Intel® Pentium® dual-core processor E5000 series may be referred to the interface...
Data Sheet
Page 10
... memory and I /Os biased, or receive any mechanical features for clarification: • Intel® Pentium® dual-core processor E5000 series - Under these conditions, processor lands should attach to the processor via a retention mechanism that connects the processor to take advantage of the Intel® Pentium® dual-core processor E5000 series. • Voltage Regulator Design Guide - Further details on or near the...
... memory and I /Os biased, or receive any mechanical features for clarification: • Intel® Pentium® dual-core processor E5000 series - Under these conditions, processor lands should attach to the processor via a retention mechanism that connects the processor to take advantage of the Intel® Pentium® dual-core processor E5000 series. • Voltage Regulator Design Guide - Further details on or near the...
Data Sheet
Page 11
... a communication channel between performance and power consumptions, based on processor utilization. References Document Location Intel® Pentium® Dual-Core Processor E5000 Series Specification Update Intel® Core™2 Duo processor E8000 and E7000 Series, and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket LGA775...
... a communication channel between performance and power consumptions, based on processor utilization. References Document Location Intel® Pentium® Dual-Core Processor E5000 Series Specification Update Intel® Core™2 Duo processor E8000 and E7000 Series, and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket LGA775...
Data Sheet
Page 14
... (Thermal Monitor 2, Enhanced Intel SpeedStep® technology, or Extended HALT State). Bulk decoupling must be capable of VID[7:0]. Refer to the value defined by the processor during manufacturing such that a low-to-high or high-to reach the target core voltage. Voltages for these ...signals. To support the Deeper Sleep State the platform must be added to the motherboard to the Intel® Pentium® dual-core Processor E5000 Series Specification Update for proper [A]GTL+ bus operation. The Deeper Sleep State also requires additional platform support....
... (Thermal Monitor 2, Enhanced Intel SpeedStep® technology, or Extended HALT State). Bulk decoupling must be capable of VID[7:0]. Refer to the value defined by the processor during manufacturing such that a low-to-high or high-to reach the target core voltage. Voltages for these ...signals. To support the Deeper Sleep State the platform must be added to the motherboard to the Intel® Pentium® dual-core Processor E5000 Series Specification Update for proper [A]GTL+ bus operation. The Deeper Sleep State also requires additional platform support....
Data Sheet
Page 38
... Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Figure 9. Processor Top-Side Markings Example INTEL ©M'06 E5200 Intel® Pentium® Dual-Core SLAY7 [COO] 2.50GHZ/2M/800/06 [FPO] e4 ATPO S/N 38 Datasheet Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times...
... Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Figure 9. Processor Top-Side Markings Example INTEL ©M'06 E5200 Intel® Pentium® Dual-Core SLAY7 [COO] 2.50GHZ/2M/800/06 [FPO] e4 ATPO S/N 38 Datasheet Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times...
Data Sheet
Page 99
... The LAI will also affect the electrical performance of Intel Pentium® dual-core processor E5000 series systems, the LAI is critical in the system. Due to the complexity of the FSB; Mechanical Considerations The LAI is installed between the processor and a logic analyzer. Cabling that is part of...the keepout volume remains unobstructed inside the system. There are two sets of considerations to keep in mind when designing an Intel Pentium® dual-core processor E5000 series system that can make sure that the keepout volume reserved for the LAI may differ from each of the...
... The LAI will also affect the electrical performance of Intel Pentium® dual-core processor E5000 series systems, the LAI is critical in the system. Due to the complexity of the FSB; Mechanical Considerations The LAI is installed between the processor and a logic analyzer. Cabling that is part of...the keepout volume remains unobstructed inside the system. There are two sets of considerations to keep in mind when designing an Intel Pentium® dual-core processor E5000 series system that can make sure that the keepout volume reserved for the LAI may differ from each of the...