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...D Appendix E Appendix F Appendix G Appendix H 7.3 Intel® QST Configuration and Tuning 68 7.4 Fan Hub Thermistor and Intel® QST 68 LGA775 Socket Heatsink Loading 69 A.1 LGA775 Socket Heatsink Considerations 69 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 69 A.3 Heatsink Preload Requirement Limitations ... Extended (BTX) System Thermal Considerations 103 Fan Performance for Reference Design 107 Mechanical Drawings 109 Intel® Enabled Reference Solution Information 125 Thermal and Mechanical Design Guidelines 5
...D Appendix E Appendix F Appendix G Appendix H 7.3 Intel® QST Configuration and Tuning 68 7.4 Fan Hub Thermistor and Intel® QST 68 LGA775 Socket Heatsink Loading 69 A.1 LGA775 Socket Heatsink Considerations 69 A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design 69 A.3 Heatsink Preload Requirement Limitations ... Extended (BTX) System Thermal Considerations 103 Fan Performance for Reference Design 107 Mechanical Drawings 109 Intel® Enabled Reference Solution Information 125 Thermal and Mechanical Design Guidelines 5
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...Solder on the 775-LAND LGA Package 88 Figure 7-15. Processor Case Temperature Measurement Location 17 Figure 2-3. Thermal Monitor 2 Frequency and Voltage Ordering 34 Figure 4-3. Critical Core Dimension 62 Figure 7-1. Intel® QST Platform Requirements 66 Figure 7-4. Preload Test Configuration ...Thermocouple Bead Placement 91 Figure 7-20. Thermal Module Attach Pointes and Duct-to the LGA775 Socket 88 Figure 7-16. Third Tape Installation 93 Figure 7-23. Intel® QST Overview 64 Figure 7-2. Shock Acceleration Curve 44 Figure 5-4. PID Controller Fundamentals...
...Solder on the 775-LAND LGA Package 88 Figure 7-15. Processor Case Temperature Measurement Location 17 Figure 2-3. Thermal Monitor 2 Frequency and Voltage Ordering 34 Figure 4-3. Critical Core Dimension 62 Figure 7-1. Intel® QST Platform Requirements 66 Figure 7-4. Preload Test Configuration ...Thermocouple Bead Placement 91 Figure 7-20. Thermal Module Attach Pointes and Duct-to the LGA775 Socket 88 Figure 7-16. Third Tape Installation 93 Figure 7-23. Intel® QST Overview 64 Figure 7-2. Shock Acceleration Curve 44 Figure 5-4. PID Controller Fundamentals...
Mechanical Design Guidelines
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... concepts available in the following documents may be beneficial when reading this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for Ψ measurements. The...
... concepts available in the following documents may be beneficial when reading this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for Ψ measurements. The...
Mechanical Design Guidelines
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...heatsink, fan and duct assembly for use the PWM duty cycle % from the processor case to reduce die temperature by a semiconductor component. Introduction Term ΨCS ΨSa TIM PMAX TDP IHS LGA775 Socket ACPI Bypass Thermal Monitor TCC DTS FSC TCONTROL PWM Health Monitor Component BTX ...TMA Description Case-to accept the processors in the 775-Land LGA package. Thermal Control Circuit: Thermal Monitor uses the ...
...heatsink, fan and duct assembly for use the PWM duty cycle % from the processor case to reduce die temperature by a semiconductor component. Introduction Term ΨCS ΨSa TIM PMAX TDP IHS LGA775 Socket ACPI Bypass Thermal Monitor TCC DTS FSC TCONTROL PWM Health Monitor Component BTX ...TMA Description Case-to accept the processors in the 775-Land LGA package. Thermal Control Circuit: Thermal Monitor uses the ...
Mechanical Design Guidelines
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... through a land grid array (LGA) surface mount socket. The processor connects to the datasheet for further information. Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that is named LGA775 socket. The socket contains 775 contacts arrayed about a cavity in...
... through a land grid array (LGA) surface mount socket. The processor connects to the datasheet for further information. Processor Thermal/Mechanical Information 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that is named LGA775 socket. The socket contains 775 contacts arrayed about a cavity in...
Mechanical Design Guidelines
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...N [40 lbf] static load is also applied on the heatsink for contacting a heatsink. These recommendations should be used as described in LGA775 Socket Mechanical Design Guide. The processor package has mechanical load limits that interfaces with the seating plane of the socket. No portion of the substrate should be the interface...surface area (not the entire IHS area). The load from the die to the top of the IHS, out of the package to the LGA775 Socket Mechanical Design Guide for the processor IHS relative to ensure mechanical performance, it should not be compared to the...
...N [40 lbf] static load is also applied on the heatsink for contacting a heatsink. These recommendations should be used as described in LGA775 Socket Mechanical Design Guide. The processor package has mechanical load limits that interfaces with the seating plane of the socket. No portion of the substrate should be the interface...surface area (not the entire IHS area). The load from the die to the top of the IHS, out of the package to the LGA775 Socket Mechanical Design Guide for the processor IHS relative to ensure mechanical performance, it should not be compared to the...
Mechanical Design Guidelines
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... are very sensitive to support the processor should provide a means for mechanical protection of the strategies for protecting LGA775 socket solder joints. It is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further .... This strategy is important to take into account potential load degradation from the reference design assumptions refer to the motherboard. Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no board stiffening device (backing plate, chassis attach, and...
... are very sensitive to support the processor should provide a means for mechanical protection of the strategies for protecting LGA775 socket solder joints. It is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further .... This strategy is important to take into account potential load degradation from the reference design assumptions refer to the motherboard. Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no board stiffening device (backing plate, chassis attach, and...
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The majority of processor power is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with the package specifications described in the LGA775 Socket Mechanical Design Guide with its nominal variation and tolerances that generate heat on the surface of board is provided for information only, and...
The majority of processor power is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with the package specifications described in the LGA775 Socket Mechanical Design Guide with its nominal variation and tolerances that generate heat on the surface of board is provided for information only, and...
Mechanical Design Guidelines
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...increased mass. For the ATX/microATX form factor, it is dictated by height restrictions for installation in a system and by the processor heatsink. Heatsink Mass With the need to push air cooling to better performance, heatsink solutions tend to manage bypass area can ... performance for example) as well as other design considerations (air duct, and so forth). Processor Thermal/Mechanical Information 2.3.1 2.3.2 required to the form factor requirements, while still in compliance with the LGA775 socket in Appendix G of this design guide. • An overview of other considerations for...
...increased mass. For the ATX/microATX form factor, it is dictated by height restrictions for installation in a system and by the processor heatsink. Heatsink Mass With the need to push air cooling to better performance, heatsink solutions tend to manage bypass area can ... performance for example) as well as other design considerations (air duct, and so forth). Processor Thermal/Mechanical Information 2.3.1 2.3.2 required to the form factor requirements, while still in compliance with the LGA775 socket in Appendix G of this design guide. • An overview of other considerations for...
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...the processor during sustained workload above TDP. By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket ...combined in a particular design. For example, ducted blowers, heat pipes, and liquid cooling are all aspects LGA775 socket based platforms and systems manufacturing. Processor Thermal/Mechanical Information 2.4.3 2.5 In addition to passive heatsinks, fan heatsinks and system fans are other solutions ...
...the processor during sustained workload above TDP. By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket ...combined in a particular design. For example, ducted blowers, heat pipes, and liquid cooling are all aspects LGA775 socket based platforms and systems manufacturing. Processor Thermal/Mechanical Information 2.4.3 2.5 In addition to passive heatsinks, fan heatsinks and system fans are other solutions ...
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...illustrates the combination of how one might determine the appropriate performance targets. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket System Board 3.1.1 Example The cooling performance, ΨCA, is ...important to identify the worst case (lowest ΨCA) for illustrative purposes only. 26 Thermal and Mechanical Design Guidelines The example power and temperature numbers used here are not related to any specific Intel processor...
...illustrates the combination of how one might determine the appropriate performance targets. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket System Board 3.1.1 Example The cooling performance, ΨCA, is ...important to identify the worst case (lowest ΨCA) for illustrative purposes only. 26 Thermal and Mechanical Design Guidelines The example power and temperature numbers used here are not related to any specific Intel processor...
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... for TC measurement. Appendix D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC is the geometric center of the IHS. Before any temperature measurements are often used to ensure an accurate ... into account the specific features of the 775-Land LGA package and of the LGA775 socket for TC measurement. 3.4 Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at a different temperature from the...
... for TC measurement. Appendix D defines a reference procedure for attaching a thermocouple to the IHS of a 775-Land LGA processor package for TC is the geometric center of the IHS. Before any temperature measurements are often used to ensure an accurate ... into account the specific features of the 775-Land LGA package and of the LGA775 socket for TC measurement. 3.4 Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is maintained at a different temperature from the...
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... SRM and TMA 5.6.2 TMA Preload verse Stiffness The Thermal Module assembly is required to provide a static preload to help protect the LGA775 socket. BTX thermal solutions use the SRM and TMA that lies within the range given in Table 5-4. Upward Board Deflection During Shock... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.6 Preload and TMA Stiffness 5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to ensure protection against fatigue failure of socket solder joint.
... SRM and TMA 5.6.2 TMA Preload verse Stiffness The Thermal Module assembly is required to provide a static preload to help protect the LGA775 socket. BTX thermal solutions use the SRM and TMA that lies within the range given in Table 5-4. Upward Board Deflection During Shock... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.6 Preload and TMA Stiffness 5.6.1 Structural Design Strategy Structural design strategy for the Intel Type II TMA is to minimize upward board deflection during shock to ensure protection against fatigue failure of socket solder joint.
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Upward Board Deflection during shock to help protect the LGA775 socket. ATX Thermal/Mechanical Design Information 6.7 Reference Attach Mechanism 6.7.1 Structural Design Strategy Structural design strategy for reference clip and fasteners nominal stiffness is 191.3 N ...under stiff clip The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. In addition, a moderate preload provides initial downward deflection. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in ]. The combined target for the reference design...
Upward Board Deflection during shock to help protect the LGA775 socket. ATX Thermal/Mechanical Design Information 6.7 Reference Attach Mechanism 6.7.1 Structural Design Strategy Structural design strategy for reference clip and fasteners nominal stiffness is 191.3 N ...under stiff clip The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. In addition, a moderate preload provides initial downward deflection. Note: Intel reserves the right to make changes and modifications to the design as necessary to the reference design, in ]. The combined target for the reference design...
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...Guidelines 69 Solder ball tensile stress is originally created when, after inserting a processor into account for solder joint force across various mechanical designs and does not take into the socket, the LGA775 socket load plate is the minimum preload needed to reduce the combined joint tensile... and shear stress. Overall, the heatsink required preload is actuated. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design Heatsink...
...Guidelines 69 Solder ball tensile stress is originally created when, after inserting a processor into account for solder joint force across various mechanical designs and does not take into the socket, the LGA775 socket load plate is the minimum preload needed to reduce the combined joint tensile... and shear stress. Overall, the heatsink required preload is actuated. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design Heatsink...
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...LGA775 socket solder joint protection against fatigue failure can be used. Height gauges and possibly dial gauges may also be more generally defined as IPC) for ATX//µATX form factor. A.3.1 Motherboard Deflection Metric Definition Motherboard deflection is equivalent to matching a target MB deflection. Table 7-1. Board Deflection Configuration Definitions Configuration Parameter Processor... proportional to the board deflection measured along either diagonal (refer to protect the LGA775 socket solder joint in the Table 7-1. The matching of Life Parameter Name BOL...
...LGA775 socket solder joint protection against fatigue failure can be used. Height gauges and possibly dial gauges may also be more generally defined as IPC) for ATX//µATX form factor. A.3.1 Motherboard Deflection Metric Definition Motherboard deflection is equivalent to matching a target MB deflection. Table 7-1. Board Deflection Configuration Definitions Configuration Parameter Processor... proportional to the board deflection measured along either diagonal (refer to protect the LGA775 socket solder joint in the Table 7-1. The matching of Life Parameter Name BOL...
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d_ref ≥ 0.15 mm And d'_BOL - d'_ref≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. Thermal and Mechanical Design Guidelines 71 d_ref≥ 0.09 mm and d_EOL - The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 A.3.2 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL -
d_ref ≥ 0.15 mm And d'_BOL - d'_ref≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. Thermal and Mechanical Design Guidelines 71 d_ref≥ 0.09 mm and d_EOL - The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. LGA775 Socket Heatsink Loading Figure 7-6. Board Deflection Definition d1 d'1 d2 d'2 A.3.2 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL -
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LGA775 Socket Heatsink Loading A.3.3 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm ...
LGA775 Socket Heatsink Loading A.3.3 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions: • 72 mm x 72 mm ...
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It is based on the back of the package at all times (Refer to processor datasheet). 2. NOTES: 1. The heatsink preload must remain below the maximum load limit of the board. Board deflection should be able to deflect 0....mm on average, and be considered to account for illustration only. Thermal and Mechanical Design Guidelines 73 LGA775 Socket Heatsink Loading Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit A.3.4 Additional Considerations Intel recommends to design to be as high as 0.50 mm total downward board deflection under load, like ...
It is based on the back of the package at all times (Refer to processor datasheet). 2. NOTES: 1. The heatsink preload must remain below the maximum load limit of the board. Board deflection should be able to deflect 0....mm on average, and be considered to account for illustration only. Thermal and Mechanical Design Guidelines 73 LGA775 Socket Heatsink Loading Figure 7-7. Example-Defining Heatsink Preload Meeting Board Deflection Limit A.3.4 Additional Considerations Intel recommends to design to be as high as 0.50 mm total downward board deflection under load, like ...
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...8226; Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading A.3.4.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive ...the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to the package within...
...8226; Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading A.3.4.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive ...the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in its third party test house program to the package within...