Mechanical Design Guidelines
Page 2
... defects or errors known as the property of its business operations. Use at any particular feature. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may be obtained by calling 1-800-548-4725, or by 2stoppels or otherwise...
... defects or errors known as the property of its business operations. Use at any particular feature. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may be obtained by calling 1-800-548-4725, or by 2stoppels or otherwise...
Mechanical Design Guidelines
Page 8
... Intel® Core™2 Duo processor E8300 and E7200 • Added Intel® Core™2 Duo processor E8600 and E7300 • Added Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor...
... Intel® Core™2 Duo processor E8300 and E7200 • Added Intel® Core™2 Duo processor E8600 and E7300 • Added Intel® Pentium dual-core processor E5200 • Added Intel® Core™2 Duo processor E7400 • Added Intel® Pentium dual-core processor E5300 • Added Intel® Pentium dual-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor...
Mechanical Design Guidelines
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... of Thermal Management The objective of thermal management is to ensure that thermal design requirements are met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
... of Thermal Management The objective of thermal management is to ensure that thermal design requirements are met for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series.
Mechanical Design Guidelines
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... guide supports the following processors: • Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB...
... guide supports the following processors: • Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190 • Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB...
Mechanical Design Guidelines
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... power. Thermal and Mechanical Design Guidelines 11 Material and concepts available in a component specification. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for an...
... power. Thermal and Mechanical Design Guidelines 11 Material and concepts available in a component specification. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for an...
Mechanical Design Guidelines
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....5 mm 2.2.2 2.2.3 Thermal Profile The Thermal Profile defines the maximum case temperature as the thermal resistance of Intel Core™2 Duo processor E8000 series with the available chassis solutions. The intercept on its improvement is about 15% over the Intel reference design (E18764-001). Thermal Solution Design Requirements While the thermal profile provides flexibility for the...
....5 mm 2.2.2 2.2.3 Thermal Profile The Thermal Profile defines the maximum case temperature as the thermal resistance of Intel Core™2 Duo processor E8000 series with the available chassis solutions. The intercept on its improvement is about 15% over the Intel reference design (E18764-001). Thermal Solution Design Requirements While the thermal profile provides flexibility for the...
Mechanical Design Guidelines
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... the same application. 18 Thermal and Mechanical Design Guidelines Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined such that...
... the same application. 18 Thermal and Mechanical Design Guidelines Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with 1 MB cache are defined such that...
Mechanical Design Guidelines
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... information, refer to Thermally Advantaged Chassis (TAC) Design Guide for both the processor and other to Thermally Advantaged Chassis (TAC) Design Guide for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide...
... information, refer to Thermally Advantaged Chassis (TAC) Design Guide for both the processor and other to Thermally Advantaged Chassis (TAC) Design Guide for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The TAC 2.0 Design Guide...
Mechanical Design Guidelines
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...) as an integrated assembly. Thermal and Mechanical Design Guidelines 39 The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with the reference BTX motherboard keep-out and height recommendations defined in Section 6.6. Balanced Technology...
...) as an integrated assembly. Thermal and Mechanical Design Guidelines 39 The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with the reference BTX motherboard keep-out and height recommendations defined in Section 6.6. Balanced Technology...
Mechanical Design Guidelines
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...be provided in the validation report but this condition is predicting that the power supply fan will be achieved at high processor workloads by adapting the maximum fan speed to meet thermal specifications can be controlled by using the TCONTROL specifications described in... be adjusted to meet thermal performance targets then acoustic target during validation. Acoustics testing for further details. Intel's recommendation is defined in Table 5-2 for the Intel Core™2 Duo processor with improved acoustics at TC-MAX of 60.1 °C the required fan speed necessary to Chapter 7...
...be provided in the validation report but this condition is predicting that the power supply fan will be achieved at high processor workloads by adapting the maximum fan speed to meet thermal specifications can be controlled by using the TCONTROL specifications described in... be adjusted to meet thermal performance targets then acoustic target during validation. Acoustics testing for further details. Intel's recommendation is defined in Table 5-2 for the Intel Core™2 Duo processor with improved acoustics at TC-MAX of 60.1 °C the required fan speed necessary to Chapter 7...
Mechanical Design Guidelines
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... the cost savings for an active air-cooled design, with a fan installed at the top of the heatsink. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. ATX Thermal/Mechanical Design Information 6 ATX Thermal/Mechanical...
... the cost savings for an active air-cooled design, with a fan installed at the top of the heatsink. The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. ATX Thermal/Mechanical Design Information 6 ATX Thermal/Mechanical...
Mechanical Design Guidelines
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...; ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with 1 MB cache. The tables also include a TA assumption of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with...
...; ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with 1 MB cache. The tables also include a TA assumption of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with...
Mechanical Design Guidelines
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...;C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB...
...;C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB...
Mechanical Design Guidelines
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... sales representatives for a part suitable for placement). Contact your design. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. In this configuration a SST Thermal Sensor has been added to...
... sales representatives for a part suitable for placement). Contact your design. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. In this configuration a SST Thermal Sensor has been added to...
Mechanical Design Guidelines
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...(like : • Board bending during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Limiting board deflection may lead to heatsink preloads... derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with a very stiff board may be appropriate in some situations like backing plates), and conduct...
...(like : • Board bending during mechanical shock event. • Define load paths that is available in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines Limiting board deflection may lead to heatsink preloads... derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with a very stiff board may be appropriate in some situations like backing plates), and conduct...