Hardware Reference
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EMC CLARiiON DAE2P and DAE3P Disk-Array Enclosures HARDWARE REFERENCE P/N 300-002-407 REV A04 EMC Corporation Corporate Headquarters: Hopkinton, MA 01748-9103 1-508-435-1000 www.EMC.com
EMC CLARiiON DAE2P and DAE3P Disk-Array Enclosures HARDWARE REFERENCE P/N 300-002-407 REV A04 EMC Corporation Corporate Headquarters: Hopkinton, MA 01748-9103 1-508-435-1000 www.EMC.com
Hardware Reference
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... computer hardware safety and maintenance procedures. The DAE2P/DAE3P is organized as follows: Chapter 1, "About DAE2P and DAE3P disk enclosures," provides a descriptive overview of information about EMC CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P and DAE3P) hardware. Audience Organization This guide is part of the DAE2P and DAE3P documentation set up and power up the enclosure(s) in this guide are expected to set...
... computer hardware safety and maintenance procedures. The DAE2P/DAE3P is organized as follows: Chapter 1, "About DAE2P and DAE3P disk enclosures," provides a descriptive overview of information about EMC CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P and DAE3P) hardware. Audience Organization This guide is part of the DAE2P and DAE3P documentation set up and power up the enclosure(s) in this guide are expected to set...
Hardware Reference
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... a DAE3P. DAE3P enclosures can include 15 hard disk drive/carrier modules. An enclosure connects to -point") disk-array enclosures are highly available, high-performance, high-capacity storage systems that use a Fibre Channel Arbitrated Loop (FC-AL) as your needs increase. The examples and illustrations in this manual show the rackmounted DAE2P/DAE3P in RAID (Redundant Array of Independent Disk) configurations. The enclosure is...
... a DAE3P. DAE3P enclosures can include 15 hard disk drive/carrier modules. An enclosure connects to -point") disk-array enclosures are highly available, high-performance, high-capacity storage systems that use a Fibre Channel Arbitrated Loop (FC-AL) as your needs increase. The examples and illustrations in this manual show the rackmounted DAE2P/DAE3P in RAID (Redundant Array of Independent Disk) configurations. The enclosure is...
Hardware Reference
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... while the array is powered up to maintain air flow. the number and size of buses depends on the capabilities of each component accompany the figures. High-availability features are field-replaceable units (FRUs), which you can interconnect disk enclosures to manage disks and I/O traffic between enclosures. Details on a 4 Gb bus. About DAE2P and DAE3P disk enclosures The DAE2P/DAE3P uses...
... while the array is powered up to maintain air flow. the number and size of buses depends on the capabilities of each component accompany the figures. High-availability features are field-replaceable units (FRUs), which you can interconnect disk enclosures to manage disks and I/O traffic between enclosures. Details on a 4 Gb bus. About DAE2P and DAE3P disk enclosures The DAE2P/DAE3P uses...
Hardware Reference
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... are contiguous throughout an array: enclosure 0 contains modules 0-14; enclosure 1 contains modules 15-29; plug directly into the midplane. Midplane A midplane between the disk modules and the LCC and power/cooling modules distributes power and signals to right (looking at installation. the enclosure's field-replaceable units (FRUs) - About DAE2P and DAE3P disk enclosures 0 1 Bus ID 2 3 Enclosure Address EA Selection (Press...
... are contiguous throughout an array: enclosure 0 contains modules 0-14; enclosure 1 contains modules 15-29; plug directly into the midplane. Midplane A midplane between the disk modules and the LCC and power/cooling modules distributes power and signals to right (looking at installation. the enclosure's field-replaceable units (FRUs) - About DAE2P and DAE3P disk enclosures 0 1 Bus ID 2 3 Enclosure Address EA Selection (Press...
Hardware Reference
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CAUTION The disk-array enclosure will power up immediately once you secure the power cord with the retention bails (strain reliefs) at each power/cooling module, as shown in the ... AC power source. Plug an AC line cord into each connector. The strain reliefs prevent the power cord from pulling out of the connections. Installing a DAE2P/DAE3P Connecting AC power ! EXP PRI PRI PRI # EXP EXP PRI EMC3213 Connecting AC Power 2-5
CAUTION The disk-array enclosure will power up immediately once you secure the power cord with the retention bails (strain reliefs) at each power/cooling module, as shown in the ... AC power source. Plug an AC line cord into each connector. The strain reliefs prevent the power cord from pulling out of the connections. Installing a DAE2P/DAE3P Connecting AC power ! EXP PRI PRI PRI # EXP EXP PRI EMC3213 Connecting AC Power 2-5
Hardware Reference
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...bus and address, and balance the number of enclosures on each bus. Wherever possible, assign a new DAE with the enclosure selection button. Installing a DAE2P/DAE3P Setting the enclosure address Before you specify an enclosure address or connect your DAE2P/DAE3P to a back end bus, make certain ...with 2 Gb disks) and 4 Gb DAE3P enclosures on bus 1. Optimize your system by bus speed and type whenever practical. For example, if your rack independently. The enclosure address ranges from DAE2s to right (facing the unit) and are contiguous throughout an array: enclosure 0 contains modules ...
...bus and address, and balance the number of enclosures on each bus. Wherever possible, assign a new DAE with the enclosure selection button. Installing a DAE2P/DAE3P Setting the enclosure address Before you specify an enclosure address or connect your DAE2P/DAE3P to a back end bus, make certain ...with 2 Gb disks) and 4 Gb DAE3P enclosures on bus 1. Optimize your system by bus speed and type whenever practical. For example, if your rack independently. The enclosure address ranges from DAE2s to right (facing the unit) and are contiguous throughout an array: enclosure 0 contains modules ...
Hardware Reference
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... device connects to the Primary disk enclosure connectors, and subsequent enclosures connect in Figure 2-6 shows a CX3-series Model 40 storage processor enclosure (SPE3) below eight DAE3P disk-array enclosures. EXP PRI EA0/Bus 1 EXP PRI PRI ! # PRI EXP EXP # ! EXP PRI EA0/Bus 0 EXP PRI PRI ! # PRI EXP EXP ! Environments with DAE2P/DAE3Ps as the only disk-array enclosures. EXP PRI EA2/Bus...
... device connects to the Primary disk enclosure connectors, and subsequent enclosures connect in Figure 2-6 shows a CX3-series Model 40 storage processor enclosure (SPE3) below eight DAE3P disk-array enclosures. EXP PRI EA0/Bus 1 EXP PRI PRI ! # PRI EXP EXP # ! EXP PRI EA0/Bus 0 EXP PRI PRI ! # PRI EXP EXP ! Environments with DAE2P/DAE3Ps as the only disk-array enclosures. EXP PRI EA2/Bus...
Hardware Reference
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...-to-point disk-array enclosure) disk module description 1-9 disk drive 1-10 drive carrier 1-11 EA indicator 3-4 front bezel description 1-6 operating limits A-5 power supply 1-11 powering down 3-7, 3-20 powering up 3-22 rear 1-5 requirements operating A-5 technical specifications A-2 disk configuration rules 2-15 disk drive description 1-10 specifications A-3 disk module adding 3-10 binding into RAID groups 2-15 description 1-9 disk drive 1-10 DAE2P/DAE3P Hardware Reference...
...-to-point disk-array enclosure) disk module description 1-9 disk drive 1-10 drive carrier 1-11 EA indicator 3-4 front bezel description 1-6 operating limits A-5 power supply 1-11 powering down 3-7, 3-20 powering up 3-22 rear 1-5 requirements operating A-5 technical specifications A-2 disk configuration rules 2-15 disk drive description 1-10 specifications A-3 disk module adding 3-10 binding into RAID groups 2-15 description 1-9 disk drive 1-10 DAE2P/DAE3P Hardware Reference...