Mechanical Design Guidelines
Page 4
... Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA Stiffness 48 5.6.1 Structural Design Strategy 48 5.6.2 TMA Preload... Reference Attach Mechanism 61 7 Intel® Quiet System Technology (Intel® QST 63 7.1 Intel® QST Algorithm 63 7.1.1 Output Weighting Matrix 64 7.1.2 Proportional-Integral-Derivative (PID 64 7.2 Board and System Implementation of Intel® QST 66 4 Thermal and Mechanical Design ...
... Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA Stiffness 48 5.6.1 Structural Design Strategy 48 5.6.2 TMA Preload... Reference Attach Mechanism 61 7 Intel® Quiet System Technology (Intel® QST 63 7.1 Intel® QST Algorithm 63 7.1.1 Output Weighting Matrix 64 7.1.2 Proportional-Integral-Derivative (PID 64 7.2 Board and System Implementation of Intel® QST 66 4 Thermal and Mechanical Design ...
Mechanical Design Guidelines
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...Figure 6-2. Shock Acceleration Curve 56 Figure 6-5. Intel® QST Platform Requirements 66 Figure 7-4. Example-Defining Heatsink Preload Meeting Board Deflection Limit ....... 73 Figure 7-8. Bottom View ..76 Figure 7-9. Bending the Tip of Copper Core Applied by TC-1996 Grease 52 Figure 6-3....Position Bead on the 775-LAND LGA Package 88 Figure 7-15. Positioning Solder on Thermocouple 89 Figure 7-17. Minimum Required Processor Preload to Attach..........90 Figure 7-19. E18764-001 Reference Design - PID Controller Fundamentals 65 Figure 7-3. Third Tape Installation 93...
...Figure 6-2. Shock Acceleration Curve 56 Figure 6-5. Intel® QST Platform Requirements 66 Figure 7-4. Example-Defining Heatsink Preload Meeting Board Deflection Limit ....... 73 Figure 7-8. Bottom View ..76 Figure 7-9. Bending the Tip of Copper Core Applied by TC-1996 Grease 52 Figure 6-3....Position Bead on the 775-LAND LGA Package 88 Figure 7-15. Positioning Solder on Thermocouple 89 Figure 7-17. Minimum Required Processor Preload to Attach..........90 Figure 7-19. E18764-001 Reference Design - PID Controller Fundamentals 65 Figure 7-3. Third Tape Installation 93...
Mechanical Design Guidelines
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...additional thermal and voltage sensing capability to provide board thermal data for Intel QST algorithms • Intel QST firmware Figure 7-3. Intel® QST Platform Requirements Processor Intel® (G)MCH MMEE DRAM DRAM Intel® ICH8 Controller Link FSC Control SPI SPI Flash SST Sensor Note...and powered • DRAM with Channel A DIMM 0 installed and 2 MB reserved for Intel QST FW execution • SPI Flash with sufficient space for the Intel QST Firmware • SST-based thermal sensors to the Intel Management Engine (ME). 66 Thermal and Mechanical Design Guidelines
...additional thermal and voltage sensing capability to provide board thermal data for Intel QST algorithms • Intel QST firmware Figure 7-3. Intel® QST Platform Requirements Processor Intel® (G)MCH MMEE DRAM DRAM Intel® ICH8 Controller Link FSC Control SPI SPI Flash SST Sensor Note...and powered • DRAM with Channel A DIMM 0 installed and 2 MB reserved for Intel QST FW execution • SPI Flash with sufficient space for the Intel QST Firmware • SST-based thermal sensors to the Intel Management Engine (ME). 66 Thermal and Mechanical Design Guidelines