Technical Product Specification
Page 11
... 1.1.1 Feature Summary Table 1 summarizes the major features of the Intel® H77 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with four DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory • Support for a PCI Express* 3.0 x16 add-in graphics...
... 1.1.1 Feature Summary Table 1 summarizes the major features of the Intel® H77 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with four DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory • Support for a PCI Express* 3.0 x16 add-in graphics...
Technical Product Specification
Page 19
...SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs. • 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification) • Two independent memory channels with interleaved mode support • Unbuffered, single-sided or double...-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are only supported by 3rd generation Intel Core processor...
...SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR3 SDRAM DIMMs. • 1.35 V Low Voltage DDR3 DIMMs (JEDEC specification) • Two independent memory channels with interleaved mode support • Unbuffered, single-sided or double...-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are only supported by 3rd generation Intel Core processor...
Technical Product Specification
Page 27
... the infrared communication language of the battery. Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for PCI systems • Intelligent power management, including a programmable wake-up of a filtered translated infrared input compliant...with an equivalent one. Product Description 1.6 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for the I/O controller. 1.7.1 Consumer Infrared (CIR...
... the infrared communication language of the battery. Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for PCI systems • Intelligent power management, including a programmable wake-up of a filtered translated infrared input compliant...with an equivalent one. Product Description 1.6 Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for the I/O controller. 1.7.1 Consumer Infrared (CIR...
Technical Product Specification
Page 75
... options to provide custom performance enhancements when using 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors in an LGA1155 socket. • Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted down) • Memory multiplier adjustment • Memory voltage adjustment • Graphics multiplier adjustment 75 Overview of BIOS...
... options to provide custom performance enhancements when using 3rd generation Intel Core processor family and 2nd generation Intel Core processor family processors in an LGA1155 socket. • Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted down) • Memory multiplier adjustment • Memory voltage adjustment • Graphics multiplier adjustment 75 Overview of BIOS...