Technical Product Specification
Page 11
... DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 65 W TDP in graphics cards Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors • Intel® High Definition Audio: ― Realtek* ALC662 audio codec ― Front panel audio header...
... DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 65 W TDP in graphics cards Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors • Intel® High Definition Audio: ― Realtek* ALC662 audio codec ― Front panel audio header...
Technical Product Specification
Page 19
... 3 illustrates the memory channel and DIMM configuration. The maximum supported resolution is attached. 19 Memory Channel and DIMM Configuration 1.6 Graphics Subsystem The board supports system graphics through either Intel Graphics Technology or a PCI Express 3.0 x16 add-in graphics card. 1.6.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for POST whenever a monitor is 2048 x 1536...
... 3 illustrates the memory channel and DIMM configuration. The maximum supported resolution is attached. 19 Memory Channel and DIMM Configuration 1.6 Graphics Subsystem The board supports system graphics through either Intel Graphics Technology or a PCI Express 3.0 x16 add-in graphics card. 1.6.1 Integrated Graphics The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for POST whenever a monitor is 2048 x 1536...